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    Flexible circuit electrode array with at least one tack opening
    41.
    发明授权
    Flexible circuit electrode array with at least one tack opening 有权
    具有至少一个定位开口的柔性电路电极阵列

    公开(公告)号：US07991478B2

    公开(公告)日：2011-08-02

    申请号：US11821328

    申请日：2007-06-21

    Applicant: Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

    Inventor： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  James Singleton Little ,  Brian V. Mech

    IPC: A61N1/05

    CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

    Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape.The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

    Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。

    Electrode array for even neural pressure
    42.
    发明授权
    Electrode array for even neural pressure 有权
    电极阵列甚至神经压力

    公开(公告)号：US07912556B2

    公开(公告)日：2011-03-22

    申请号：US12397974

    申请日：2009-03-04

    Applicant: Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Jordan Matthew Neysmith

    Inventor： Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Jordan Matthew Neysmith

    IPC: A61N1/00

    CPC classification number: A61N1/0543 ,  A61N1/0558

    Abstract: An electrode array attached to neural tissue, such as the retina, necessarily has graded pressure exerted on the tissue, with higher pressure near the attachment point. Greater pressure improves contact between the electrodes and neural tissue while too much pressure may damage neural tissue. Hence it is advantageous to obtain equal pressure across the array field. In the present invention multiple and selective attachment points are provided on an electrode array allowing a surgeon to select the attachment points providing the best electrode tissue contact.

    Abstract translation: 附着到神经组织（例如视网膜）上的电极阵列必须具有施加在组织上的分级压力，附近点附近具有更高的压力。 更大的压力改善了电极和神经组织之间的接触，而太多的压力可能损伤神经组织。 因此，有利的是在阵列场上获得相等的压力。 在本发明中，在电极阵列上提供多个选择性附着点，允许外科医生选择提供最佳电极组织接触的附着点。

    Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation
    43.
    发明授权
    Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation 有权
    生物相容性电镀互连接合方法和电子封装适合植入

    公开(公告)号：US07846285B2

    公开(公告)日：2010-12-07

    申请号：US11924722

    申请日：2007-10-26

    Applicant: Dao Min Zhou ,  James Singleton Little ,  Robert J. Greenberg

    Inventor： Dao Min Zhou ,  James Singleton Little ,  Robert J. Greenberg

    IPC: H05K3/46

    CPC classification number: H05K3/361 ,  A61N1/02 ,  A61N1/36046 ,  C25D3/567 ,  C25D3/62 ,  C25D5/02 ,  C25D5/18 ,  C25D5/56 ,  H05K3/32 ,  H05K2203/0723

    Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

    Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

    Electrode Array for Even Neural Pressure
    44.
    发明申请
    Electrode Array for Even Neural Pressure 有权
    用于均匀神经压力的电极阵列

    公开(公告)号：US20090228086A1

    公开(公告)日：2009-09-10

    申请号：US12397974

    申请日：2009-03-04

    Applicant: Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Jordan Matthew Neysmith

    Inventor： Robert J. Greenberg ,  Mark S. Humayun ,  James Singleton Little ,  Jordan Matthew Neysmith

    IPC: A61N1/05

    CPC classification number: A61N1/0543 ,  A61N1/0558

    Abstract: An electrode array attached to neural tissue, such as the retina, necessarily has graded pressure exerted on the tissue, with higher pressure near the attachment point. Greater pressure improves contact between the electrodes and neural tissue while too much pressure may damage neural tissue. Hence it is advantageous to obtain equal pressure across the array field. In the present invention multiple and selective attachment points are provided on an electrode array allowing a surgeon to select the attachment points providing the best electrode tissue contact.

    Abstract translation: 附着到神经组织（例如视网膜）上的电极阵列必须具有施加在组织上的分级压力，附近点附近具有更高的压力。 更大的压力改善了电极和神经组织之间的接触，而太多的压力可能损伤神经组织。 因此，有利的是在阵列场上获得相等的压力。 在本发明中，在电极阵列上提供多个选择性附着点，允许外科医生选择提供最佳电极组织接触的附着点。

    Process for Cathodic Protection of Electrode Materials
    46.
    发明申请
    Process for Cathodic Protection of Electrode Materials 有权
    电极材料阴极保护工艺

    公开(公告)号：US20080283417A1

    公开(公告)日：2008-11-20

    申请号：US11924349

    申请日：2007-10-25

    Applicant: Dao Min Zhou ,  Amy Hines ,  James Singleton Little ,  Robert J. Greenberg

    Inventor： Dao Min Zhou ,  Amy Hines ,  James Singleton Little ,  Robert J. Greenberg

    IPC: C23F13/00

    CPC classification number: C23F13/00 ,  A61N1/05 ,  A61N1/08 ,  C23F13/02

    Abstract: The present invention relates to a process for cathodic protection of electrode or electrode materials wherein negative bias is applied on the electrode. the negative bias is obtained by asymmetric current pulse. The asymmetric current pulse is obtained by performing negative phase with higher amplitude. The asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The asymmetric current pulse is obtained by performing negative phase with higher amplitude and with wider pulse width than that of the anodic phase. The present invention further relates to a process for cathodic protection of electrode or electrode materials, wherein negative bias is applied on the electrode, wherein the negative bias is obtained by asymmetric current pulse, wherein the asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains.

    Abstract translation: 本发明涉及对电极或电极材料进行阴极保护的方法，其中负电极施加在电极上。 负偏压通过不对称电流脉冲获得。 通过执行具有较高振幅的负相来获得非对称电流脉冲。 通过执行具有比阳极相宽的脉冲宽度的负相来获得非对称电流脉冲。 通过执行具有更高幅度和宽于脉冲宽度的阳极相的负相位获得非对称电流脉冲。 本发明还涉及一种用于对电极或电极材料进行阴极保护的方法，其中在电极上施加负偏压，其中通过不对称电流脉冲获得负偏压，其中非对称电流脉冲通过执行具有更宽的负相 脉冲宽度大于阳极相。 通过脉冲串获得更宽的脉冲宽度。

    ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME
    47.
    发明申请
    ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME 审中-公开
    具有增加的稳定性的电极及其制造方法

    公开(公告)号：US20080268134A1

    公开(公告)日：2008-10-30

    申请号：US11924763

    申请日：2007-10-26

    Applicant: Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

    Inventor： Dao Min Zhou ,  Jerry Ok ,  Neil Hamilton Talbot ,  Brian V. Mech ,  James Singleton Little ,  Robert J. Greenberg

    IPC: H01M4/04

    CPC classification number: A61N1/0543 ,  A61N1/36046

    Abstract: The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.

    Abstract translation: 本发明提供具有增加的稳定性的可植入电极，其具有聚集结构，其中电极的表面被包括填充有棒或柱的开口的材料覆盖。 本发明提供了具有增加的稳定性的可植入电极，其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 本发明提供一种具有增加的稳定性的电极的制造方法，包括：在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 本发明提供了一种制造具有增加的稳定性的电极的方法，包括：在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。

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