公开(公告)号：US20090148667A1

公开(公告)日：2009-06-11

申请号：US12314205

申请日：2008-12-05

Applicant: Yong Seok Choi ,  Jong Myeon Lee ,  Eun Tae Park

Inventor： Yong Seok Choi ,  Jong Myeon Lee ,  Eun Tae Park

IPC: B32B3/10 ,  B32B38/00

CPC classification number: H05K3/4629 ,  B32B3/085 ,  B32B3/266 ,  B32B18/00 ,  B32B37/24 ,  B32B2037/243 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2311/24 ,  B32B2315/02 ,  B32B2457/00 ,  C04B2237/343 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/68 ,  H05K1/0306 ,  H05K3/4611 ,  H05K2201/09036 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T428/24562

Abstract: There are provided a method of manufacturing a ceramic laminated substrate in which the ceramic laminated substrate, with a cavity formed therein, can be manufactured by constrained sintering without undergoing deformation of the cavity, and a ceramic laminated substrate manufactured using the same.

Abstract translation: 提供一种制造陶瓷层压基板的方法，其中可以通过约束烧结而不发生空腔的变形来制造其中形成有腔的陶瓷层叠基板，以及使用其形成的陶瓷层叠基板。

公开(公告)号：US20090142582A1

公开(公告)日：2009-06-04

申请号：US12324006

申请日：2008-11-26

Applicant: Beom Joon CHO ,  Jong Myeon LEE

Inventor： Beom Joon CHO ,  Jong Myeon LEE

IPC: C03B29/00 ,  B32B18/00

CPC classification number: B32B18/00 ,  C04B38/0022 ,  C04B2111/00844 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/252 ,  C04B35/10 ,  C04B38/0054 ,  C04B38/0675 ,  C04B38/068

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract translation: 提供了一种约束绿色，其包括第一约束层，其具有设置在陶瓷层叠体的顶表面和底表面中的一个上的表面，第一约束层包含第一无机粉末; 以及第二约束层，其设置在所述第一约束层的顶部并且包含第二无机粉末和飞灰。 约束生片用于确保陶瓷层压体的收缩较小，并改善脱脂特性。

公开(公告)号：US20090135542A1

公开(公告)日：2009-05-28

申请号：US12271386

申请日：2008-11-14

Applicant: Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

Inventor： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

IPC: H01G4/30 ,  C03C3/064

CPC classification number: H01G4/1227 ,  C03C3/064 ,  C03C8/02 ,  C04B35/4682 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5445 ,  H01G4/129 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

Abstract: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, O≦d≦10, and O≦e≦10, respectively.

Abstract translation: 提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。 玻璃组合物包括由组成式表示的Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e分别为40 < = a <= 89，10 <= b <= 50，1 <= c <= 20，O <= d <= 10，O <= e <= 10。

公开(公告)号：US07425731B2

公开(公告)日：2008-09-16

申请号：US11708459

申请日：2007-02-21

Applicant: Ho Sung Choo ,  Youn Gon Park ,  Jong Myeon Lee

Inventor： Ho Sung Choo ,  Youn Gon Park ,  Jong Myeon Lee

IPC: H01L29/18

CPC classification number: H01L33/56 ,  H01L33/54

Abstract: A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.

Abstract translation: 具有降低的光损耗的发光二极管封装包括封装衬底，安装在封装衬底上的发光二极管芯片和形成在封装衬底上以封装发光二极管芯片的密封剂。 密封剂具有从其外周表面到其中心轴线的折射率连续增加的折射率梯度。

公开(公告)号：US20070196939A1

公开(公告)日：2007-08-23

申请号：US11709130

申请日：2007-02-22

Applicant: Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

Inventor： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

IPC: H01L21/00

CPC classification number: H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Abstract translation: 一种制造发光二极管封装的方法。 制备其中形成有凹部的杯形封装结构和形成在凹部的底部上的电极结构。 发光二极管芯片安装在凹部的底部，其中芯片的端子电连接到电极结构。 将液态透明树脂注入到凹部中，并且在液态透明树脂完全固化之前，将刻有其上的微粗糙图案的印模涂布在树脂的上表面上。 液态透明树脂用施加在其上的印模固化以形成树脂密封剂，并且从树脂密封剂中除去印模。

公开(公告)号：US20070148332A1

公开(公告)日：2007-06-28

申请号：US11524952

申请日：2006-09-22

Applicant: Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

Inventor： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

IPC: B05D1/12 ,  B05D7/00 ,  B05D5/12

CPC classification number: C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

Abstract translation: 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。