NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    42.
    发明申请
    NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20120126308A1

    公开(公告)日:2012-05-24

    申请号:US13298591

    申请日:2011-11-17

    Abstract: A non-volatile memory device includes a plurality of memory cells stacked along a channel protruded from a substrate, a first select transistor connected to one end of the plurality of memory cells, a first interlayer dielectric layer for being coupled between a source line and the first select transistor, and a second interlayer dielectric layer disposed between the first select transistor and the one end of the plurality of memory cells, and configured to include a first recess region.

    Abstract translation: 非易失性存储器件包括沿着从衬底突出的通道堆叠的多个存储器单元,连接到多个存储器单元的一端的第一选择晶体管,用于耦合在源极线与源极之间的第一层间电介质层 第一选择晶体管和设置在第一选择晶体管和多个存储单元的一端之间的第二层间电介质层,并且被配置为包括第一凹部区域。

    VERTICAL LIGHT-EMITTING DEVICE
    43.
    发明申请
    VERTICAL LIGHT-EMITTING DEVICE 审中-公开
    垂直发光装置

    公开(公告)号:US20120091434A1

    公开(公告)日:2012-04-19

    申请号:US13222732

    申请日:2011-08-31

    CPC classification number: H01L33/14 H01L33/20 H01L33/38 H01L33/405

    Abstract: A vertical light-emitting device includes: a substrate; a first electrode disposed on a bottom surface of the substrate; a reflection layer disposed on a top surface of the substrate; a current spreading layer disposed on the reflection layer and comprising a groove having a width narrower toward a top portion thereof; a light generation layer disposed on the current spreading layer; and a second electrode disposed on the light generation layer.

    Abstract translation: 垂直发光装置包括:基板; 设置在所述基板的底面上的第一电极; 反射层,设置在所述基板的顶表面上; 电流扩散层,其设置在所述反射层上,并且包括宽度朝向其顶部变窄的凹槽; 设置在电流扩散层上的发光层; 以及设置在光产生层上的第二电极。

    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE
    47.
    发明申请
    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE 有权
    制造非易失性存储器件的方法

    公开(公告)号:US20100062581A1

    公开(公告)日:2010-03-11

    申请号:US12432187

    申请日:2009-04-29

    CPC classification number: H01L27/11519 H01L27/11521

    Abstract: Provided is a method of fabricating a non-volatile semiconductor device. The method includes: forming a first hard mask layer over a substrate; etching the first hard mask layer and the substrate to form a plurality of isolation trenches extending in parallel to one another in a first direction; burying a dielectric layer in the isolation trenches to form a isolation layer; forming a plurality of floating gate mask patterns extending in parallel to one another in a second direction intersecting with the first direction over a resulting structure where the isolation layer is formed; etching the first hard mask layer by using the floating gate mask patterns as an etch barrier to form a plurality of island-shaped floating gate electrode trenches; and burying a conductive layer in the floating gate electrode trenches to form a plurality of island-shaped floating gate electrodes.

    Abstract translation: 提供了制造非易失性半导体器件的方法。 该方法包括:在衬底上形成第一硬掩模层; 蚀刻第一硬掩模层和衬底以形成在第一方向上彼此平行延伸的多个隔离沟槽; 在隔离沟槽中埋置介电层以形成隔离层; 在形成所述隔离层的结果上形成在与所述第一方向相交的第二方向上彼此平行延伸的多个浮置栅极掩模图案; 通过使用浮栅掩模图案作为蚀刻势垒来蚀刻第一硬掩模层,以形成多个岛状浮栅电极沟槽; 并在所述浮栅电极沟槽中埋设导电层以形成多个岛状浮栅。

    Flash memory device and method of manufacturing the same
    48.
    发明授权
    Flash memory device and method of manufacturing the same 失效
    闪存装置及其制造方法

    公开(公告)号:US07608885B2

    公开(公告)日:2009-10-27

    申请号:US11751013

    申请日:2007-05-19

    CPC classification number: H01L21/28273 H01L29/513 H01L29/7881

    Abstract: A non-volatile memory device has a gate dielectric film formed between a floating gate and a control gate. The gate dielectric film is formed by forming an oxide film and a ZrO2/Al2O3/ZrO2 (ZAZ) film. Accordingly, the reliability of non-volatile memory devices can be improved while securing a high coupling ratio.

    Abstract translation: 非易失性存储器件具有形成在浮置栅极和控制栅极之间的栅极电介质膜。 通过形成氧化膜和ZrO 2 / Al 2 O 3 / ZrO 2(ZAZ)膜来形成栅极电介质膜。 因此,可以在确保高耦合比的同时提高非易失性存储器件的可靠性。

    Method of fabricating flash memory device
    49.
    发明授权
    Method of fabricating flash memory device 失效
    制造闪存设备的方法

    公开(公告)号:US07592222B2

    公开(公告)日:2009-09-22

    申请号:US12147178

    申请日:2008-06-26

    CPC classification number: H01L21/28273 H01L27/11521

    Abstract: The present invention relates to a method of fabricating a flash memory device. According to a method of fabricating a flash memory device in accordance with an aspect of the present invention, a semiconductor substrate over which a tunnel insulating layer and a first conductive layer are formed is provided. A first oxide layer is formed on the first conductive layer using a plasma oxidization process in a state where a back bias voltage is applied. A nitride layer is formed on the first oxide layer. A second oxide layer is formed on the nitride layer. A second conductive layer is formed on the second oxide layer.

    Abstract translation: 本发明涉及一种制造闪速存储器件的方法。 根据本发明的一个方面的制造闪速存储器件的方法,提供了形成隧道绝缘层和第一导电层的半导体衬底。 在施加反向偏置电压的状态下,使用等离子体氧化工艺在第一导电层上形成第一氧化物层。 在第一氧化物层上形成氮化物层。 在氮化物层上形成第二氧化物层。 在第二氧化物层上形成第二导电层。

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