公开(公告)号：US20060168802A1

公开(公告)日：2006-08-03

申请号：US11334038

申请日：2006-01-17

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01R43/00 ,  G08B13/14 ,  G01R31/28 ,  H01Q17/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

Abstract translation: 一种无线识别装置，包括壳体; 外壳中的电路被配置为响应于询问信号提供信号以识别设备; 以及由壳体支撑的选择性致动的开关，并且控制电路是否识别该装置。 一种制造无线识别装置的方法，所述方法包括配置电路以响应于询问信号提供信号以识别所述装置; 将电路耦合到由壳体支持的推/推开关开关，并控制电路是否提供信号以识别装置; 并且将电路封装在壳体中，使得开关可以通过触摸壳体的一部分从壳体外部致动。

公开(公告)号：US20060143899A1

公开(公告)日：2006-07-06

申请号：US11370455

申请日：2006-03-07

Applicant: Mark Tuttle ,  John Tuttle

Inventor： Mark Tuttle ,  John Tuttle

IPC: H01Q13/00

CPC classification number: H01Q1/2225 ,  G01S13/767 ,  G01S13/78 ,  G06K7/10346 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q7/00

Abstract: An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device. Additionally, a method for tuning receiver sensitivity and/or transmitter sensitivity according to construction of the above device is disclosed.

Abstract translation: 一种可调节射频数据通信设备具有集成电路的单片半导体集成电路，在单片集成电路上提供的询问接收电路，其形成集成电路的至少一部分并且被配置为从询问器单元接收询问信号，天线电耦合 所述询问接收电路被配置为与所述远程询问器单元通信;电源，其耦合到所述集成电路并且被配置为生成所述通信设备的操作功率，并且所述天线和所述询问接收电路中的至少一个具有可重新配置的电 特性，电特性是可重构的，以在调谐和失谐状态的范围内选择性地调谐天线和询问接收电路中的至少一个，以实现通信设备的期望接收机灵敏度 e。 此外，公开了根据上述装置的结构来调整接收机灵敏度和/或发射机灵敏度的方法。

公开(公告)号：US20060082445A1

公开(公告)日：2006-04-20

申请号：US11290238

申请日：2005-11-29

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  Shu-Sun Yu ,  David Ovard ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  Shu-Sun Yu ,  David Ovard ,  Robert Rotzoll

IPC: H04Q5/22

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  G06K2017/0051 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US06924168B2

公开(公告)日：2005-08-02

申请号：US10003116

申请日：2001-12-06

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01L23/552 ,  H01L23/58 ,  H05K1/02 ,  H01L21/00 ,  H05K1/14

CPC classification number: H05K1/0233 ,  H01L23/552 ,  H01L23/585 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H01L2224/0401

Abstract: A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.

Abstract translation: 公开了一种为包含电磁电路元件的集成电路芯片提供一个或多个电磁屏蔽层的方法和装置。 屏蔽层可以与集成电路芯片接触，包括诸如MRAM的磁存储器结构，或者在倒装芯片载体中，或者两者。 支撑芯片的印刷电路板也可以具有一个或多个屏蔽层。

公开(公告)号：US20050133118A1

公开(公告)日：2005-06-23

申请号：US11060794

申请日：2005-02-18

Applicant: Mark Tuttle ,  Ronald Weimer

Inventor： Mark Tuttle ,  Ronald Weimer

IPC: H01F41/30 ,  H01F1/00 ,  C21D1/04 ,  G11B5/33

CPC classification number: B82Y25/00 ,  B82Y40/00 ,  H01F1/0009 ,  H01F41/304

Abstract: A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.

Abstract translation: 用于磁性退火在晶片上形成的磁阻元件的装置包括加热的卡盘和用于将晶片单独地单独地放置在卡盘上的输送机构。 线圈与卡盘相邻，并且在将晶片加热到反铁磁层的Néel温度之后产生磁场。 控制系统调节加热卡盘的温度，磁场的强度以及加热每个卡盘以控制退火过程的时间段。 退火元件被结合在磁存储器件的制造中。

公开(公告)号：US20050110889A1

公开(公告)日：2005-05-26

申请号：US10723363

申请日：2003-11-26

Applicant: Mark Tuttle ,  William Hiatt

Inventor： Mark Tuttle ,  William Hiatt

IPC: H01L23/02 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/335

CPC classification number: H01L27/14625 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic imager comprising an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include (a) a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and (b) a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is seated with the first referencing element at a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.

Abstract translation: 一种包括成像单元和附接到成像单元的光学单元的微电子成像器，以及用于封装微电子成像器的方法。 在一个实施例中，成像单元可以包括（a）具有图像传感器和电耦合到图像传感器的多个外部触点的微电子管芯和（b）固定到成像单元的第一参考元件。 光学单元可以包括光学构件和固定到光学单元的第二参考元件。 第二参考元件与第一参考元件一起固定在固定的预设位置，在该位置，光学元件位于相对于图像传感器的期望位置处。

公开(公告)号：US06625040B1

公开(公告)日：2003-09-23

申请号：US09653558

申请日：2000-08-31

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H05K900

CPC classification number: H05K1/0233 ,  G11C5/04 ,  G11C11/14

Abstract: A method and packaging device which provide a magnetically permeable shield for integrated circuits containing magnetic field sensitive circuit elements are disclosed. One or more magnetic shields are provided on, or embedded within, a printed circuit board and additional shielding elements are provided over the printed circuit board.

Abstract translation: 公开了一种为包含磁场敏感电路元件的集成电路提供导磁屏蔽的方法和封装装置。 一个或多个磁屏蔽设置在印刷电路板上或嵌入印刷电路板中，并且在印刷电路板上设置附加的屏蔽元件。

公开(公告)号：US4515906A

公开(公告)日：1985-05-07

申请号：US470371

申请日：1983-02-28

Applicant: Dwayne Friesen ,  Walter C. Babcock ,  Mark Tuttle

Inventor： Dwayne Friesen ,  Walter C. Babcock ,  Mark Tuttle

IPC: C08L101/00 ,  B01D69/02 ,  B01J41/00 ,  B01J45/00 ,  B01J47/00 ,  B01J47/12 ,  C08J5/20 ,  C08J5/22 ,  C08L1/00 ,  C08L27/00 ,  C08L33/00 ,  C08L33/02 ,  C08L67/00 ,  C08L77/00 ,  C08L81/06

CPC classification number: B01D69/141 ,  B01D67/0088 ,  B01J45/00 ,  B01J47/12 ,  C22B3/42 ,  B01D2325/022 ,  Y02P10/234

Abstract: Novel ion-exchange media are disclosed, the media comprising polymeric anisotropic microporous supports containing polymeric ion-exchange or ion-complexing materials. The supports are anisotropic, having small exterior pores and larger interior pores, and are preferably in the form of beads, fibers and sheets.

Abstract translation: 公开了新型离子交换介质，该介质包含含有聚合物离子交换或离子络合材料的聚合物各向异性微孔载体。 载体是各向异性的，具有小的外部孔和较大的内部孔，并且优选为珠粒，纤维和片材的形式。

公开(公告)号：US20110233777A1

公开(公告)日：2011-09-29

申请号：US13154550

申请日：2011-06-07

Applicant: Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

Inventor： Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

IPC: H01L23/498 ,  H01L23/48

CPC classification number: H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract translation: 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US07342409B2

公开(公告)日：2008-03-11

申请号：US11516342

申请日：2006-09-06

Applicant: Warren M. Farnworth ,  Mark Tuttle

Inventor： Warren M. Farnworth ,  Mark Tuttle

IPC: G01R31/26

CPC classification number: G01R31/2886

Abstract: A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The system can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

Abstract translation: 用于测试半导体部件的系统包括互连，用于将衬底对准互连的对准系统，用于将部件接合到互连的接合系统，以及用于加热组件和用于分离的互连的加热系统。 互连包括被配置用于结合到组件上并且然后与组件上的组件触点分离的互连触点。 该系统可以利用包括以下步骤的方法：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将互连件与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。