公开(公告)号：US08313834B2

公开(公告)日：2012-11-20

申请号：US12677758

申请日：2008-09-10

Applicant: Atsushi Sato ,  Toru Maeda

Inventor： Atsushi Sato ,  Toru Maeda

IPC: B32B5/16 ,  H01F41/02 ,  H01F41/16

CPC classification number: H01F3/14 ,  B22F2998/00 ,  H01F1/24 ,  H01F1/26 ,  H01F27/255 ,  H01F27/346 ,  H01F41/0246 ,  H01F2027/348 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/02

Abstract: To provide a core for reactor capable of reducing the eddy current loss and improving the direct current superposition characteristics, a manufacturing method thereof, and a reactor. A core for reactor M is obtained by press molding metallic magnetic particles coated with an insulating coated film, and the metallic magnetic particles have the following compositions: (1) the mean particle size is 1 μm or more and 70 μm or less; (2) the variation coefficient Cv which is a ratio (σ/μ) of the standard deviation (σ) of the particle size and the mean particle size (μ) is 0.40 or less; and (3) the degree of circularity is 0.8 or more and 1.0 or less. On the outside of the insulating coated film, at least one of a heat-resistance imparting protective film and a flexible protective film is further provided as a outer coated film.

Abstract translation: 为了提供能够降低涡流损耗并提高直流叠加特性的反应器的核心，其制造方法和反应器。 反应器M的核心是通过对涂覆有绝缘涂膜的金属磁性颗粒进行冲压成型获得，并且金属磁性颗粒具有以下组成：（1）平均粒径为1μm以上且70μm以下; （2）作为粒径的标准偏差（＆sgr）与平均粒径（μ）的比值（＆sgr /μ）的变化系数Cv为0.40以下; （3）圆形度为0.8以上且1.0以下。 在绝缘涂膜的外侧，进一步提供耐热性赋予保护膜和柔性保护膜中的至少一种作为外涂​​膜。

公开(公告)号：US20120286191A1

公开(公告)日：2012-11-15

申请号：US13511061

申请日：2011-05-10

Applicant: Toru Maeda ,  Asako Watanabe

Inventor： Toru Maeda ,  Asako Watanabe

IPC: H01F1/06 ,  H01F1/08

CPC classification number: H01F1/0552 ,  B22F1/0062 ,  B22F2998/10 ,  C22C33/0278 ,  C22C38/002 ,  C22C38/005 ,  C22C2202/02 ,  H01F1/0572 ,  H01F1/0573 ,  H01F1/0575 ,  H01F1/0576 ,  H01F1/0578 ,  H01F1/061 ,  H01F1/083 ,  H01F41/0293 ,  B22F3/02 ,  B22F2003/248

Abstract: The present invention provides a powder for a magnetic member being excellent in moldability and difficult to oxidize, a powder compact produced from the powder, and a magnetic member suitable for a raw material of a magnetic member such as a rare earth magnet. A powder for a magnetic member includes magnetic particles 1 which constitute the powder for a magnetic member and each of which is composed of less than 40% by volume of a hydrogen compound 3 of a rare earth element, and the balance composed of an iron-containing material 2 which contains iron and an iron-boron alloy containing iron and boron. The hydrogen compound 3 of a rare earth element is dispersed in a phase of the iron-containing material 2. An antioxidant layer 4 having a low-oxygen permeability coefficient is provided on the surface of each of the magnetic particles 1. Since the phase of the iron-containing material 2 is uniformly present in each of the magnetic particles 1, the powder has excellent moldability and the density of a powder compact can be easily increased. By providing the antioxidant layer 4, oxidation of a newly formed surface formed on each of the magnetic particle 1 during molding is little oxidized, and a decrease in a magnetic phase ratio due to the presence of an oxide can be suppressed.

Abstract translation: 本发明提供了一种成型性好，难以氧化的磁性部件粉末，由该粉末制成的粉末成形体，以及适用于稀土类磁铁等磁性部件的原料的磁性部件。 磁性部件用粉末包括构成磁性部件用粉末的磁性粒子1，它们各自由少于40体积％的稀土元素的氢化合物3构成，其余由铁 - 含有铁的含铁材料2和含有铁和硼的铁 - 硼合金。 稀土元素的氢化合物3分散在含铁材料2的相中。在每个磁性粒子1的表面上设置有具有低氧渗透系数的抗氧化层4。 含铁材料2均匀地存在于每个磁性颗粒1中，粉末具有优异的成型性，并且粉末压块的密度可以容易地增加。 通过设置抗氧化剂层4，在模制期间形成在每个磁性颗粒1上的新形成的表面的氧化几乎不被氧化，并且可以抑制由于存在氧化物而引起的磁相比的降低。

公开(公告)号：US20110114708A1

公开(公告)日：2011-05-19

申请号：US13055747

申请日：2009-07-08

Applicant: Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

Inventor： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

IPC: B23K1/20 ,  C09D11/00 ,  B23K3/06 ,  B23K3/04 ,  B82Y30/00

CPC classification number: B22F1/0062 ,  B22F2999/00 ,  H01L21/4867 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1152 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13399 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2225/06513 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

Abstract translation: 通过将氧气注入到有机溶剂中来制造用于将半导体管芯的电极和基板的电极接合和/或接合半导体管芯的电极和另一个半导体管芯的电极的金属纳米管（100） 在其表面涂布有分散剂（102）的金属纳米颗粒（101）之前或之后，将氧纳米气泡（125）或氧气（121）的形式混合到有机溶剂（105）中。 通过将金属纳米线（100）的微滴喷射到电极上，在半导体管芯的电极和基板的电极上形成凸起，将半导体管芯上下颠倒并重叠在衬底上，然后将金属 通过按压和加热电极之间的凸块，在凸起的纳米颗粒被烧结。 结果，在压力下烧结过程中产生的空隙被最小化。

公开(公告)号：US20100255188A1

公开(公告)日：2010-10-07

申请号：US12816833

申请日：2010-06-16

Applicant: Toru MAEDA ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Hirokazu Kugai ,  Kazuyuki Hayashi ,  Hiroko Morii ,  Seiji Ishitani

Inventor： Toru MAEDA ,  Naoto Igarashi ,  Haruhisa Toyoda ,  Hirokazu Kugai ,  Kazuyuki Hayashi ,  Hiroko Morii ,  Seiji Ishitani

IPC: B05D5/12

CPC classification number: B22F1/02 ,  B22F2998/10 ,  H01F1/24 ,  H01F1/26 ,  H01F41/0246 ,  Y10T428/2991 ,  B22F3/02 ,  B22F3/24

Abstract: A soft magnetic material is a soft magnetic material including a composite magnetic particle (30) having a metal magnetic particle (10) mainly composed of Fe and an insulating coating (20) covering metal magnetic particle (10), and insulating coating (20) contains an iron phosphate compound and an aluminum phosphate compound. The atomic ratio of Fe contained in a contact surface of insulating coating (20) in contact with metal magnetic particle (10) is larger than the atomic ratio of Fe contained in the surface of insulating coating (20). The atomic ratio of Al contained in the contact surface of insulating coating (20) in contact with metal magnetic particle (10) is smaller than the atomic ratio of Al contained in the surface of insulating coating (20). Thus, iron loss can be reduced.

Abstract translation: 软磁性材料是包括具有主要由Fe构成的金属磁性粒子（10）和覆盖金属磁性粒子（10）的绝缘涂层（20）的复合磁性体（30）和绝缘涂层（20）的软磁性材料， 含有磷酸铁化合物和磷酸铝化合物。 包含在与金属磁性颗粒（10）接触的绝缘涂层（20）的接触表面中的Fe的原子比大于绝缘涂层（20）表面中所含的Fe的原子比。 绝缘涂层（20）与金属磁性颗粒（10）接触的接触表面中所含的Al的原子比小于绝缘涂层（20）表面中的Al的原子比。 因此，可以减少铁损。

公开(公告)号：US20100194516A1

公开(公告)日：2010-08-05

申请号：US12677758

申请日：2008-09-10

Applicant: Atsushi Sato ,  Toru Maeda

Inventor： Atsushi Sato ,  Toru Maeda

IPC: H01F17/04 ,  H01F27/255

CPC classification number: H01F3/14 ,  B22F2998/00 ,  H01F1/24 ,  H01F1/26 ,  H01F27/255 ,  H01F27/346 ,  H01F41/0246 ,  H01F2027/348 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/02

Abstract: To provide a core for reactor capable of reducing the eddy current loss and improving the direct current superposition characteristics, a manufacturing method thereof, and a reactor. A core for reactor M is obtained by press molding metallic magnetic particles coated with an insulating coated film, and the metallic magnetic particles have the following compositions: (1) the mean particle size is 1 μm or more and 70 μm or less; (2) the variation coefficient Cv which is a ratio (σ/μ) of the standard deviation (σ) of the particle size and the mean particle size (μ) is 0.40 or less; and (3) the degree of circularity is 0.8 or more and 1.0 or less. On the outside of the insulating coated film, at least one of a heat-resistance imparting protective film and a flexible protective film is further provided as a outer coated film.

Abstract translation: 为了提供能够降低涡流损耗并提高直流叠加特性的反应器的核心，其制造方法和反应器。 反应器M的核心是通过对涂覆有绝缘涂膜的金属磁性颗粒进行冲压成型获得，并且金属磁性颗粒具有以下组成：（1）平均粒径为1μm以上且70μm以下; （2）作为粒径的标准偏差（＆sgr）与平均粒径（μ）的比值（＆sgr /μ）的变化系数Cv为0.40以下; （3）圆形度为0.8以上且1.0以下。 在绝缘涂膜的外侧，进一步提供耐热性赋予保护膜和柔性保护膜中的至少一种作为外涂​​膜。

公开(公告)号：US20100093131A1

公开(公告)日：2010-04-15

申请号：US12526730

申请日：2008-02-26

Applicant: Toru Maeda

Inventor： Toru Maeda

IPC: H01L21/822 ,  H01L21/60 ,  B23K3/06 ,  B23K1/06 ,  B23K20/10

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11318 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.

Abstract translation: 使用金属纳米膏将半导体管芯（12）的电极和电路基板（19）的电极接合的接合装置（10）包括通过注入金属纳米粒子的微滴形成凸块的凸块形成机构（20） 粘贴在每个电极上，主键合机构（50），其通过将半导体管芯（12）的凸起压靠在电路板（19）的凸块上而在非导电状态下对电极进行初次接合，以及 二次接合机构（80），其进行二次接合，使得电极通过在接合方向上加压一次接合凸块而导电，并且通过加热凸块来加压和烧结凸块中的金属纳米颗粒。 由此，能够以简单且容易的方式有效地接合电极，同时降低接合负载。

公开(公告)号：US20100089980A1

公开(公告)日：2010-04-15

申请号：US12526725

申请日：2008-02-26

Applicant: Toru Maeda

Inventor： Toru Maeda

IPC: B23K31/02 ,  B23K3/06 ,  B23K3/08 ,  B23K28/00

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11318 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.

Abstract translation: 使用金属纳米膏将半导体管芯（12）的电极和电路基板（19）的电极接合的接合装置（10）包括通过注入金属纳米粒子的微滴形成凸块的凸块形成机构（20） 粘贴在每个电极上，主键合机构（50），其通过将半导体管芯（12）的凸起压靠在电路板（19）的凸块上而在非导电状态下对电极进行初次接合，以及 二次接合机构（80），其包括在接合方向上对一次接合凸块加压的加压单元，并且进行二次接合，使得通过将凸起加热至高于金属的粘合剂去除温度的温度来使电极变得导电 纳米糊剂和金属纳米糊剂的分散剂去除温度，去除粘合剂和分散剂，并且在凸块中加压和烧结金属纳米颗粒。 由此，能够以简单且容易的方式有效地接合电极，同时降低接合负载。

公开(公告)号：US20100044618A1

公开(公告)日：2010-02-25

申请号：US12518498

申请日：2008-09-03

Applicant: Tomoyuki Ishimine ,  Toshihiro Sakamoto ,  Toru Maeda ,  Naoto Igarashi

Inventor： Tomoyuki Ishimine ,  Toshihiro Sakamoto ,  Toru Maeda ,  Naoto Igarashi

IPC: H01F1/04 ,  B32B5/16 ,  B05D7/00 ,  B22F1/00 ,  B22F1/02 ,  B05D5/00

CPC classification number: H01F3/02 ,  B22F1/0014 ,  B22F1/0062 ,  B22F1/007 ,  B22F2999/00 ,  C22C38/00 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/26 ,  H01F1/33 ,  H01F41/0246 ,  Y10T428/2982 ,  B22F3/10 ,  B22F2201/02

Abstract: A soft magnetic material, a dust core, a method for manufacturing the soft magnetic material, and a method for manufacturing the dust core that can improve DC bias characteristics are provided.A soft magnetic material includes a plurality of metal magnetic particles 10 whose coefficient of variation Cv (σ/μ), which is a ratio of a standard deviation (σ) of a particle size of the metal magnetic particles 10 to an average particle size (μ) thereof, is 0.40 or less and whose circularity Sf is 0.80 or more and 1 or less. The metal magnetic particles 10 preferably have an average particle size of 1 μm or more and 70 μm or less. The soft magnetic material preferably further includes an insulating coated film that surrounds a surface of each of the metal magnetic particles 10.

Abstract translation: 提供软磁性材料，压粉芯，软磁性材料的制造方法以及可提高直流偏压特性的集尘芯的制造方法。 软磁性材料包括多个金属磁性颗粒10，其金属磁性颗粒10的粒径与平均颗粒的标准偏差（＆sgr）的比值变化系数Cv（＆Sgr /μ） 尺寸（μ）为0.40以下，圆形度Sf为0.80以上1以下。 金属磁性粒子10的平均粒径优选为1μm以上且70μm以下。 软磁性材料优选还包括围绕每个金属磁性颗粒10的表面的绝缘涂膜。

公开(公告)号：US20100028195A1

公开(公告)日：2010-02-04

申请号：US12576716

申请日：2009-10-09

Applicant: Toru Maeda ,  Kazuyuki Maeda ,  Yasushi Mochida ,  Koji Mimura

Inventor： Toru Maeda ,  Kazuyuki Maeda ,  Yasushi Mochida ,  Koji Mimura

IPC: B22F1/02 ,  B05D5/00 ,  B22F3/12

CPC classification number: H01F41/0246 ,  B22F1/02 ,  B22F2003/145 ,  B22F2003/248 ,  B22F2998/10 ,  C22C33/02 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/26 ,  H01F1/33 ,  H01F3/08 ,  Y10T428/12014 ,  Y10T428/2995 ,  Y10T428/32 ,  Y10T428/325 ,  B22F9/082 ,  B22F1/0088 ,  B22F3/02 ,  B22F3/24 ,  B22F3/14

Abstract: A soft magnetic material includes a plurality of composite magnetic particles (40) each including a metal magnetic particle (10) and an insulation coating (20) covering the surface of the metal magnetic particle (10), wherein the insulation coating (20) contains Si (silicon), and 80% or more of Si contained in the insulation coating constitutes a silsesquioxane skeleton. Therefore, it is possible to effectively decrease a hysteresis loss while suppressing an increase in eddy-current loss.

Abstract translation: 软磁性材料包括多个复合磁性颗粒（40），每个复合磁性颗粒包括覆盖金属磁性颗粒（10）表面的金属磁性颗粒（10）和绝缘涂层（20），其中绝缘涂层（20）包含 Si（硅），绝缘涂层中所含的80％以上的Si构成倍半硅氧烷骨架。 因此，可以有效地降低磁滞损耗，同时抑制涡电流损耗的增加。

公开(公告)号：US07622202B2

公开(公告)日：2009-11-24

申请号：US11793984

申请日：2006-07-19

Applicant: Toru Maeda ,  Kazuyuki Maeda ,  Yasushi Mochida ,  Koji Mimura

Inventor： Toru Maeda ,  Kazuyuki Maeda ,  Yasushi Mochida ,  Koji Mimura

IPC: B32B15/00

CPC classification number: H01F41/0246 ,  B22F1/02 ,  B22F2003/145 ,  B22F2003/248 ,  B22F2998/10 ,  C22C33/02 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/26 ,  H01F1/33 ,  H01F3/08 ,  Y10T428/12014 ,  Y10T428/2995 ,  Y10T428/32 ,  Y10T428/325 ,  B22F9/082 ,  B22F1/0088 ,  B22F3/02 ,  B22F3/24 ,  B22F3/14

Abstract: A soft magnetic material includes a plurality of composite magnetic particles (40) each including a metal magnetic particle (10) and an insulation coating (20) covering the surface of the metal magnetic particle (10), wherein the insulation coating (20) contains Si (silicon), and 80% or more of Si contained in the insulation coating constitutes a silsesquioxane skeleton. Therefore, it is possible to effectively decrease a hysteresis loss while suppressing an increase in eddy-current loss.

Abstract translation: 软磁性材料包括多个复合磁性颗粒（40），每个复合磁性颗粒包括覆盖金属磁性颗粒（10）表面的金属磁性颗粒（10）和绝缘涂层（20），其中绝缘涂层（20）包含 Si（硅），绝缘涂层中所含的80％以上的Si构成倍半硅氧烷骨架。 因此，可以有效地降低磁滞损耗，同时抑制涡电流损耗的增加。