公开(公告)号：US20100153872A1

公开(公告)日：2010-06-17

申请号：US12621067

申请日：2009-11-18

Applicant: Jun-mo AHN ,  Yong-hwan KWON ,  Joon-hwan KIM ,  Heui-jin KWON ,  Chang-soo LEE ,  Jeong-yeon LEE ,  Victor SZILAGYI

Inventor： Jun-mo AHN ,  Yong-hwan KWON ,  Joon-hwan KIM ,  Heui-jin KWON ,  Chang-soo LEE ,  Jeong-yeon LEE ,  Victor SZILAGYI

IPC: G06F3/048

CPC classification number: G06F3/0482 ,  G06F3/0481 ,  G06F2203/04806

Abstract: A method for providing a graphical user interface (GUI) and an electronic device using the method are provided. The method includes forming one or more groups of GUI items other than a GUI item selected by a user, moving the GUI items in the one or more groups, and enlarging and displaying the selected item on an area formed by movement of the GUI items. Therefore, it is possible to provide a GUI which enables easy manipulation and which is displayed with superior visual effect on a screen that is relatively small in size.

Abstract translation: 提供了一种用于提供图形用户界面（GUI）和使用该方法的电子设备的方法。 该方法包括：形成除用户选择的GUI项目之外的一个或多个GUI项目组，移动一个或多个组中的GUI项目，以及在由GUI项目的移动形成的区域上放大并显示所选择的项目。 因此，可以提供一种能够容易操作并且在尺寸相对较小的屏幕上以优异的视觉效果显示的GUI。

公开(公告)号：US20100144123A1

公开(公告)日：2010-06-10

申请号：US12508382

申请日：2009-07-23

Applicant: Mi-Ran PARK ,  Jae-Sik SIM ,  Yong-Hwan KWON ,  Bongki MHEEN ,  Dae Kon OH

Inventor： Mi-Ran PARK ,  Jae-Sik SIM ,  Yong-Hwan KWON ,  Bongki MHEEN ,  Dae Kon OH

IPC: H01L21/20 ,  H01L21/22

CPC classification number: H01L21/2258

Abstract: Provided is a method of forming a compound semiconductor device. In the method, a dopant element layer is formed on an undoped compound semiconductor layer. An annealing process is performed to diffuse dopants in the dopant element layer into the undoped compound semiconductor layer, thereby forming a dopant diffusion region. A rapid cooling process is performed using liquid nitrogen with respect to the substrate having the dopant diffusion region.

Abstract translation: 提供一种形成化合物半导体器件的方法。 在该方法中，在未掺杂的化合物半导体层上形成掺杂剂元素层。 执行退火处理以将掺杂剂元素层中的掺杂剂扩散到未掺杂的化合物半导体层中，从而形成掺杂剂扩散区域。 相对于具有掺杂剂扩散区域的基板，使用液氮进行快速冷却处理。

公开(公告)号：US20100133590A1

公开(公告)日：2010-06-03

申请号：US12626343

申请日：2009-11-25

Applicant: Bong Ki Mheen ,  Albert J. P. Theuwissen ,  Jae Sik Sim ,  Mi Ran Park ,  Yong Hwan Kwon ,  Eun Soo Nam

Inventor： Bong Ki Mheen ,  Albert J. P. Theuwissen ,  Jae Sik Sim ,  Mi Ran Park ,  Yong Hwan Kwon ,  Eun Soo Nam

IPC: H01L31/14

CPC classification number: H01L27/14603 ,  H01L27/14609 ,  H01L27/1463 ,  H01L27/14641

Abstract: An image sensor with a shared photodiode is provided. The image sensor includes at least two unit pixels, each of which includes a photodiode, a diffusion region which gathers electrons from the photodiode, a transfer transistor which connects the photodiode with the diffusion region, and a readout circuit which reads out a signal from the diffusion region. Photodiodes of neighboring unit pixels are disposed symmetrically to be adjacent to one another to form a shared photodiode. The image sensor does not have a STI region which causes a dark current restricting its performance and does not require a basic minimum design factor (a distance or an area) related to a STI region. A region corresponding to a STI region may be used as a region of a photodiode or for additional pixel scaling. Therefore, a limitation in scaling of a photodiode is overcome, and pixel performance is improved in spite of pixel scaling.

Abstract translation: 提供具有共享光电二极管的图像传感器。 图像传感器包括至少两个单位像素，每个单元像素包括光电二极管，从光电二极管收集电子的扩散区域，连接光电二极管与扩散区域的传输晶体管，以及读出电路， 扩散区。 相邻单位像素的光电二极管彼此对称设置以形成共用光电二极管。 图像传感器不具有导致暗电流限制其性能的STI区域，并且不需要与STI区域相关的基本最小设计因子（距离或面积）。 可以将对应于STI区域的区域用作光电二极管的区域或用于附加像素缩放。 因此，克服了光电二极管的缩放的限制，并且尽管像素缩放来提高像素性能。

公开(公告)号：US20090249420A1

公开(公告)日：2009-10-01

申请号：US12240314

申请日：2008-09-29

Applicant: Won-il KIM ,  Yong-hwan KWON ,  Sang-hee LEE

Inventor： Won-il KIM ,  Yong-hwan KWON ,  Sang-hee LEE

IPC: H04N7/173

CPC classification number: H04L12/2812 ,  H04L12/2807 ,  H04L41/0803 ,  H04L41/0856 ,  H04L41/22 ,  H04L2012/2849 ,  H04N7/17318 ,  H04N21/254 ,  H04N21/4104 ,  H04N21/6547 ,  H04N21/6582 ,  H04N21/84

Abstract: A method for configuring a video apparatus, and a video apparatus and a server are provided. The video apparatus transmits video apparatus information and content information to an external server, receives setting information corresponding to the video apparatus information and content information from the external server, and thereby configures the video apparatus. Therefore, it is possible for a user to configure the video apparatus to be more optimally suited to the video apparatus and content to be played back.

Abstract translation: 提供了一种用于配置视频设备的方法，以及视频设备和服务器。 视频装置向外部服务器发送视频装置信息和内容信息，从外部服务器接收与视频装置信息和内容信息相对应的设置信息，从而配置视频装置。 因此，用户可以将视频设备配置为更适合于要重放的视频设备和内容。

公开(公告)号：US07569423B2

公开(公告)日：2009-08-04

申请号：US12139771

申请日：2008-06-16

Applicant: Yong-hwan Kwon ,  Chung-sun Lee ,  Woon-byung Kang

Inventor： Yong-hwan Kwon ,  Chung-sun Lee ,  Woon-byung Kang

IPC: H01L21/48 ,  H01L23/34

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wafer-level-chip-scale package and related method of fabrication are disclosed. The wafer-level-chip-scale package comprises a semiconductor substrate comprising an integrated circuit, a conductive ball disposed on the semiconductor substrate and electrically connected to the integrated circuit, and a protective portion formed from an insulating material and disposed on bottom and side surfaces of the semiconductor substrate.

Abstract translation: 公开了一种晶片级芯片级封装及相关的制造方法。 晶片级芯片级封装包括半导体衬底，其包括集成电路，设置在半导体衬底上并与集成电路电连接的导电球，以及由绝缘材料形成并设置在底表面和侧表面上的保护部分 的半导体衬底。

公开(公告)号：US20090150770A1

公开(公告)日：2009-06-11

申请号：US12183494

申请日：2008-07-31

Applicant: Dong-heon Lee ,  Yong-hwan Kwon ,  Sang-hee Lee ,  Won-il Kim

Inventor： Dong-heon Lee ,  Yong-hwan Kwon ,  Sang-hee Lee ,  Won-il Kim

IPC: G06F3/14

CPC classification number: H04N7/163 ,  H04N5/44543 ,  H04N5/44591 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/478 ,  H04N21/482 ,  H04N21/4854 ,  H04N21/6125

Abstract: A display apparatus which has a display unit, the display apparatus includes: a communication unit which receives contents from an external server; a UI (user interface) generator which generates UI information; and a controller which controls the UI generator to display the UI information about setting an initial screen of the contents supplied by the external server on the display unit if the display apparatus is connected to the external server.

Abstract translation: 一种具有显示单元的显示装置，所述显示装置包括：通信单元，其从外部服务器接收内容; 生成UI信息的UI（用户界面）生成器; 以及控制器，如果所述显示装置连接到所述外部服务器，则所述控制器控制所述UI生成器以在所述显示单元上显示关于设置由所述外部服务器提供的内容的初始屏幕的UI信息。

公开(公告)号：US20090130791A1

公开(公告)日：2009-05-21

申请号：US12274642

申请日：2008-11-20

Applicant: Woon-Seong KWON ,  Tae-Je CHO ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

Inventor： Woon-Seong KWON ,  Tae-Je CHO ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

IPC: H01L21/00

CPC classification number: H04N5/2252 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

Abstract translation: 提供能够有效屏蔽电磁波（EM）波的相机模块及其制造方法。 制造相机模块的方法包括：制备包括透镜单元阵列的第一晶片。 然后，制备包括图像传感器CSP阵列（芯片级封装）的第二晶片。 图像传感器CSP中的每一个包括对应于一个透镜单元的图像传感器芯片。 第一晶片被堆叠在第二晶片上。 切割第一晶片和第二晶片以形成在相邻透镜单元之间的界面处暴露图像传感器芯片的顶表面的沟槽。 沟槽填充有用于形成壳体的第一材料。 第一材料和图像传感器芯片在相邻透镜单元之间的界面处被切割。

公开(公告)号：US20080258299A1

公开(公告)日：2008-10-23

申请号：US12073310

申请日：2008-03-04

Applicant: Un Byoung Kang ,  Yong Hwan Kwon ,  Chung Sun Lee ,  Woon Seong Kwon ,  Hyung Sun Jang

Inventor： Un Byoung Kang ,  Yong Hwan Kwon ,  Chung Sun Lee ,  Woon Seong Kwon ,  Hyung Sun Jang

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/83 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11901 ,  H01L2224/11912 ,  H01L2224/13099 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/01007 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions.

Abstract translation: 一种制造半导体器件的方法包括在衬底上形成扩散阻挡层，并在衬底上形成至少两个特征，使得扩散阻挡层分别设置在每个特征和衬底之间，并接触至少两个特征。 衬底的第一杂质区包含第一类杂质，衬底的第二杂质区包含不同于第一类型的第二类杂质，所述至少两个特征的第一特征在第一杂质区， 并且所述至少两个特征的第二特征在于第二杂质区域，使得第二特征通过不同的杂质区域与第一特征电隔离。

公开(公告)号：US20080251872A1

公开(公告)日：2008-10-16

申请号：US11831768

申请日：2007-07-31

Applicant: Woon-Seong KWON ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

Inventor： Woon-Seong KWON ,  Yong-Hwan KWON ,  Un-Byoung KANG ,  Chung-Sun LEE ,  Hyung-Sun JANG

IPC: H01L27/12 ,  H01L21/02

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.

Abstract translation: 提供了图像传感器封装，其制造方法和包括图像传感器封装的图像传感器模块。 在图像传感器封装中，将图像传感器芯片安装在透光性基板的凹部上。 粘合剂将图像传感器芯片粘合到透射基板上，并将图像传感器芯片上的有源像素传感器（APS）密封并保护其免受细颗粒污染。 将IR切割膜设置在透射基底上以最小化图像传感器封装的高度。 图像传感器封装电连接到凹陷中的外部连接焊盘。 因此，图像传感器封装具有最小高度，不易受到颗粒污染，并且在制造期间不需要昂贵的对准过程。

公开(公告)号：US20080012084A1

公开(公告)日：2008-01-17

申请号：US11826124

申请日：2007-07-12

Applicant: Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

Inventor： Yong-Hwan Kwon ,  Un-Byoung Kang ,  Chung-Sun Lee ,  Woon-Seong Kwon ,  Hyung-Sun Jang

IPC: H01L31/0232

CPC classification number: H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor package may include a transparent substrate, an image sensor chip having a sensing region disposed over the transparent substrate, a resin protection dam disposed between the image sensor chip and the transparent substrate inside a wiring pattern, the resin protection dam having an aperture formed to expose a sensing region of the image sensor chip and defining a cavity between the sensing region and the transparent substrate, a resin filled on the transparent substrate outside the resin protection dam, and a black matrix pattern disposed on each side of the transparent substrate and configured to block excess transmission of light.

Abstract translation: 图像传感器封装可以包括透明基板，具有设置在透明基板上的感测区域的图像传感器芯片，设置在图像传感器芯片和布线图案内的透明基板之间的树脂保护坝，树脂保护坝具有孔 形成为暴露图像传感器芯片的感测区域并且在感测区域和透明基板之间限定空腔，填充在树脂保护堤外的透明基板上的树脂和布置在透明基板的每一侧上的黑矩阵图案 并且被配置为阻止光的过量透射。