公开(公告)号：US08686545B2

公开(公告)日：2014-04-01

申请号：US13394430

申请日：2011-07-21

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/4878 ,  H01L23/4334 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A semiconductor device according to the present disclosure includes: a plate (13) having a through hole (15); a metal column (16) fixed to the through hole with an insulating member (17) interposed therebetween, and having a projection projecting from the upper surface of the plate; a semiconductor element (12) fixed to the projection; a lead frame (11) electrically connected to the semiconductor element; and a package (14) covering the semiconductor element, and also covering at least part of each of the plate, the metal column, and the lead frame. The lower surface (13b) of the plate is exposed from the package.

摘要翻译： 根据本公开的半导体器件包括：具有通孔（15）的板（13）; 固定在通孔上的金属柱（16），绝缘构件（17）插入其间，并且具有从板的上表面突出的突起; 固定到所述突起的半导体元件（12） 电连接到所述半导体元件的引线框架（11） 以及覆盖半导体元件的封装（14），并且还覆盖板，金属柱和引线框架中的每一个的至少一部分。 板的下表面（13b）从包装中露出。

公开(公告)号：US20120218717A1

公开(公告)日：2012-08-30

申请号：US13402968

申请日：2012-02-23

申请人： Keiko TAKAHASHI ,  Masanori Minamio ,  Kenya Yamashita

发明人： Keiko TAKAHASHI ,  Masanori Minamio ,  Kenya Yamashita

IPC分类号： H05K7/20

CPC分类号： H05K7/209 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/642 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A reliable power module is realized, in which a good performance of radiating heat of the power semiconductor element is secured and it is hard for the heat of a power semiconductor element to be conducted to a driving element. A power module includes a power semiconductor element mounted on a lead frame, and a driving element mounted on the lead frame, and a heat radiating plate radiating heat which is generated by the power semiconductor element, and a resin holding the power semiconductor element, the driving element, and the heat radiating plate, wherein the heat radiating plate has a portion disposed at a side opposite to a surface of the lead frame where the power semiconductor element is mounted, a portion disposed between the power semiconductor element and the driving element, and a portion disposed below the power semiconductor element, as the portions being in a body.

摘要翻译： 实现了可靠的功率模块，其中确保了功率半导体元件的辐射热的良好性能，并且功率半导体元件的热难以被传导到驱动元件。 功率模块包括安装在引线框架上的功率半导体元件和安装在引线框架上的驱动元件和由功率半导体元件产生的散热的散热板和保持功率半导体元件的树脂， 驱动元件和散热板，其中散热板具有设置在与安装功率半导体元件的引线框架的表面相对的一侧的部分，设置在功率半导体元件和驱动元件之间的部分， 以及设置在功率半导体元件下方的部分，因为所述部分在体内。

公开(公告)号：US20120161302A1

公开(公告)日：2012-06-28

申请号：US13394430

申请日：2011-07-21

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L21/4878 ,  H01L23/4334 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A semiconductor device according to the present disclosure includes: a plate (13) having a through hole (15); a metal column (16) fixed to the through hole with an insulating member (17) interposed therebetween, and having a projection projecting from the upper surface of the plate; a semiconductor element (12) fixed to the projection; a lead frame (11) electrically connected to the semiconductor element; and a package (14) covering the semiconductor element, and also covering at least part of each of the plate, the metal column, and the lead frame. The lower surface (13b) of the plate is exposed from the package.

摘要翻译： 根据本公开的半导体器件包括：具有通孔（15）的板（13）; 固定在通孔上的金属柱（16），绝缘构件（17）插入其间，并且具有从板的上表面突出的突起; 固定到所述突起的半导体元件（12） 电连接到所述半导体元件的引线框架（11） 以及覆盖半导体元件的封装（14），并且还覆盖板，金属柱和引线框架中的每一个的至少一部分。 板的下表面（13b）从包装中露出。

公开(公告)号：US20120112332A1

公开(公告)日：2012-05-10

申请号：US13382244

申请日：2011-06-03

申请人： Masanori Minamio ,  Shinichi Ijima

发明人： Masanori Minamio ,  Shinichi Ijima

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49537 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin-sealed semiconductor device includes a power element (1), a control element (4), a first lead frame (3) having a first die pad (3A) which holds the power element (1), a second lead frame (5) having a second die pad (5A) which holds the control element (4), and a housing (6) made of a resin material and sealing the power element, the first die pad, the control element, and the second die pad. A lower surface of the second die pad is higher than an upper surface of the first element, and at least part of the first die pad and at least part of the second die pad overlap each other when viewed from the top. One of the first leads and one of the second leads are directly joined together by a joint portion (23) and electrically coupled together in the housing.

摘要翻译： 树脂密封半导体器件包括功率元件（1），控制元件（4），具有保持功率元件（1）的第一管芯焊盘（3A）的第一引线框架（3），第二引线框架 5），具有保持控制元件（4）的第二管芯焊盘（5A）和由树脂材料制成的壳体（6），并密封功率元件，第一管芯焊盘，控制元件和第二管芯焊盘 。 第二管芯焊盘的下表面高于第一元件的上表面，并且当从顶部观察时，第一管芯焊盘的至少一部分和第二管芯焊盘的至少一部分彼此重叠。 第一引线中的一个引线和第二引线中的一个引线通过接合部分（23）直接连接在一起并且电耦合在壳体中。

公开(公告)号：US08125041B2

公开(公告)日：2012-02-28

申请号：US12711660

申请日：2010-02-24

申请人： Masanori Minamio ,  Kyoko Fujii

发明人： Masanori Minamio ,  Kyoko Fujii

IPC分类号： H01L27/14

CPC分类号： H01L27/14618 ,  H01L23/3114 ,  H01L23/481 ,  H01L27/14683 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor substrate 1; a through electrode 7 extending through the semiconductor substrate 1; a diffusion layer 24 formed in a region of an upper portion of the semiconductor substrate 1 located on a side of the through electrode 7; and a diffusion layer 22 formed in an upper portion of the diffusion layer 24. A portion of the side surface of the through electrode 7 facing the diffusion layer 24 is curved, and a portion of the surface of the diffusion layer 24 facing the through electrode 7 is curved.

摘要翻译： 半导体器件包括：半导体衬底1; 穿过半导体衬底1的贯通电极7; 形成在位于贯通电极7侧的半导体基板1的上部区域的扩散层24; 以及形成在扩散层24的上部的扩散层22.直通电极7的面向扩散层24的一部分侧面是弯曲的，并且扩散层24的面向通孔的部分表面 7是弯曲的。

公开(公告)号：US08080855B2

公开(公告)日：2011-12-20

申请号：US12407837

申请日：2009-03-20

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

IPC分类号： H01L29/93

CPC分类号： H01L33/483 ,  H01L27/14618 ,  H01L27/14685 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base 16 is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

摘要翻译： 根据本发明，用于保护透明构件11的保护密封件S1由有机基底16，粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上，并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底16用粘合剂层17和18固定到透明构件11的侧面11b和表面11a。

公开(公告)号：US07822090B2

公开(公告)日：2010-10-26

申请号：US12186979

申请日：2008-08-06

申请人： Masanori Minamio ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Noriyuki Yoshikawa ,  Shinichi Ijima ,  Toshiyuki Fukuda

IPC分类号： H01S5/00 ,  H01S3/30 ,  H01S3/04 ,  H01L29/16

CPC分类号： B82Y20/00 ,  G11B7/127 ,  H01L2224/48091 ,  H01S5/0021 ,  H01S5/0071 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/02224 ,  H01S5/02248 ,  H01S5/02292 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/028 ,  H01S5/34333 ,  H01L2924/00014

摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.

摘要翻译： 半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。 用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。

公开(公告)号：US20100265665A1

公开(公告)日：2010-10-21

申请号：US12760219

申请日：2010-04-14

申请人： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

发明人： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

IPC分类号： H05K7/20

CPC分类号： H05K7/20963 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/00

摘要： The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.

摘要翻译： 电子设备包括：散热器，其包括具有凹部的前表面; 放置在所述凹部中的与所述散热器接触的导热部件; 放置在所述凹部中的与所述导热部件接触的半导体元件; 电连接到半导体元件并放置在散热器的表面上的柔性基板; 以及底板部件，其具有前表面，散热器固定在该前表面上，以便在与前表面相对的后表面与散热器接触。

公开(公告)号：US20090236613A1

公开(公告)日：2009-09-24

申请号：US12407837

申请日：2009-03-20

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/483 ,  H01L27/14618 ,  H01L27/14685 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

摘要翻译： 根据本发明，用于保护透明构件11的保护密封件S1由有机基底16，粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上，并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底用粘合剂层17和18固定在透明构件11的侧面11b和表面11a上。

公开(公告)号：US07580075B2

公开(公告)日：2009-08-25

申请号：US10958500

申请日：2004-10-06

申请人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

发明人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

摘要翻译： 引线框架埋在模具树脂中以形成模具结构。 使用宽刀片来制造在模具结构中具有对准步骤的压痕。 然后，使用窄刀片分割模具结构。 在与模具结构分离的单独部分的基部的外周部分处，形成对准步骤。 由于对准步骤，容易且快速地附接诸如成像光学系统的镜管的光学元件等。