公开(公告)号：US20050121761A1

公开(公告)日：2005-06-09

申请号：US11035986

申请日：2005-01-18

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/98 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18 ,  H01L23/02

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

公开(公告)号：US06879385B2

公开(公告)日：2005-04-12

申请号：US10380248

申请日：2001-10-04

申请人： Tokudai Neda ,  Yasuharu Yokoi ,  Kenji Maeda ,  Kenji Horiuchi ,  Satoshi Yamashita

发明人： Tokudai Neda ,  Yasuharu Yokoi ,  Kenji Maeda ,  Kenji Horiuchi ,  Satoshi Yamashita

IPC分类号： G01N21/35 ,  G01N21/65 ,  G06K7/10 ,  G06K19/06 ,  G07D7/12 ,  G07F7/12 ,  G06K9/74

CPC分类号： G01N21/3563 ,  G01N21/65 ,  G06K7/10 ,  G06K19/06 ,  G07D7/1205

摘要： A nondestructive reading method for an isotopic label, capable of easily and quickly reading information on an isotopic label imparted to an article in advance without destroying the label, and a nondestructive reading-use isotopic label suitably using this method. In addition, information obtained by this nondestructive reading method is used to easily and quickly judge the authenticity of an article.

摘要翻译： 用于同位素标签的非破坏性阅读方法，能够容易且快速地读取预先赋予物品的同位素标签上的信息而不破坏标签，以及适当地使用该方法的非破坏性阅读用同位素标签。 另外，通过这种非破坏性阅读方法获得的信息用于容易且快速地判断物品的真实性。

公开(公告)号：US06755935B2

公开(公告)日：2004-06-29

申请号：US09793443

申请日：2001-02-27

申请人： Hideyuki Kazumi ,  Ichiro Sasaki ,  Kenji Maeda ,  Tsutomu Tetsuka ,  Hironobu Kawahara

发明人： Hideyuki Kazumi ,  Ichiro Sasaki ,  Kenji Maeda ,  Tsutomu Tetsuka ,  Hironobu Kawahara

IPC分类号： H01L213065

CPC分类号： H01J37/32082 ,  H01J37/32541

摘要： A plasma processing apparatus has a vacuum vessel, a processing chamber arranged in the vacuum vessel and supplied with gas, a support electrode arranged in the processing chamber to support an object to be processed, a radio frequency providing unit for supplying a radio frequency in UHF or VHF band, and a magnetic field generating unit for generating a magnetic field in the processing chamber, wherein the radio frequency providing unit includes an antenna having a groove or step formed in its surface opposing the process object, whereby plasma of high density and high uniformity can be generated in a wide parameter region.

摘要翻译： 等离子体处理装置具有真空容器，设置在真空容器中并供给气体的处理室，布置在处理室中的支撑电极，以支撑被处理物体;射频提供单元，用于在UHF中提供射频 或VHF频带，以及用于在处理室中产生磁场的磁场产生单元，其中所述射频提供单元包括在其与所述处理对象相对的表面中形成有凹槽或台阶的天线，由此形成高密度和高的等离子体 可以在宽参数区域中产生均匀性。

公开(公告)号：US06629182B1

公开(公告)日：2003-09-30

申请号：US09122325

申请日：1998-07-24

申请人： Shigeru Mizoguchi ,  Kenji Maeda ,  Jun Oida

发明人： Shigeru Mizoguchi ,  Kenji Maeda ,  Jun Oida

IPC分类号： G06F100

CPC分类号： G06F1/3228 ,  G06F1/1632 ,  G06F1/263

摘要： In an electronic device capable of being driven on a battery, there is provided a docking system configuration in which a docking unit mainly serving as an extension can be attached/detached to/from a master unit by using a system bus as a bridge. The docking unit is adapted to operate alone upon start-up of a power source even while being detached from the master unit. In each of the master unit and the docking unit, detection is made for whether the units are docked each other and for whether a residual capacity of a driving battery in steps is decreased. When it is detected that the residual capacity of the driving battery is decreased, either of operation suspending processing or operation end processing is selectively executed.

摘要翻译： 在能够在电池上驱动的电子设备中，提供了一种对接系统配置，其中主要用作扩展的对接单元可以通过使用系统总线作为桥连接/从主单元分离。 对接单元适于在启动电源时单独操作，即使在与主单元分离时也是如此。 在主单元和对接单元中的每一个中，检测单元是否彼此对接，以及是否减少了步进的驱动电池的剩余容量。 当检测到驱动电池的剩余容量减小时，选择性地执行操作暂停处理或操作结束处理中的任一个。

公开(公告)号：US06624084B2

公开(公告)日：2003-09-23

申请号：US09741996

申请日：2000-12-22

申请人： Kenji Maeda ,  Yutaka Omoto ,  Ichiro Sasaki ,  Hironobu Kawahara

发明人： Kenji Maeda ,  Yutaka Omoto ,  Ichiro Sasaki ,  Hironobu Kawahara

IPC分类号： H01L2100

CPC分类号： H01J37/32082 ,  H01J37/32623 ,  H01J37/32697

摘要： In plasma processing equipment having a vacuum processing chamber, a plasma generation means, a stage for loading a wafer to be processed in the vacuum processing chamber, an opposing electrode having an area almost equal to or wider than the aforementioned wafer which is installed opposite to the stage, and a bias power source for applying a high frequency bias to the wafer, a current path correction means is provided for correcting the current path part in the neighborhood of the outer periphery of the wafer among the high frequency current paths produced by the high frequency bias so as to be directed toward the wafer opposing surface of the opposing electrode.

摘要翻译： 在具有真空处理室的等离子体处理设备中，等离子体产生装置，用于在真空处理室中装载待处理的晶片的阶段，具有几乎等于或大于上述晶片的面积的对置电极， 该级和用于向晶片施加高频偏压的偏压电源，提供电流路径校正装置，用于校正由该晶体管产生的高频电流路径中的晶片外周附近的电流路径部分 高频偏压以指向相对电极的晶片相对表面。

公开(公告)号：US06605720B1

公开(公告)日：2003-08-12

申请号：US10349835

申请日：2003-01-23

申请人： Kenji Maeda ,  Shinji Kato ,  Takehiko Iida ,  David M. Tschaen

发明人： Kenji Maeda ,  Shinji Kato ,  Takehiko Iida ,  David M. Tschaen

IPC分类号： C07D491107

CPC分类号： C07D471/10

摘要： This invention relates to processes for making spirolactone compounds analogous to formula I:

摘要翻译： 本发明涉及类似于式I的螺内酯化合物的制备方法：

公开(公告)号：US06582991B1

公开(公告)日：2003-06-24

申请号：US09886997

申请日：2001-06-25

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L2144

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

公开(公告)号：US06336020B1

公开(公告)日：2002-01-01

申请号：US09576440

申请日：2000-05-22

申请人： Tomoji Ishikawa ,  Kazuyuki Sugihara ,  Yoshiyuki Kimura ,  Kenji Maeda ,  Yoshihide Kawamura ,  Fumio Ogata

发明人： Tomoji Ishikawa ,  Kazuyuki Sugihara ,  Yoshiyuki Kimura ,  Kenji Maeda ,  Yoshihide Kawamura ,  Fumio Ogata

IPC分类号： G03G1501

CPC分类号： G03G15/065 ,  G03G15/0126 ,  G03G15/0896 ,  G03G2215/0177

摘要： A developer container for use in an image forming apparatus including a supporting member rotating around a rotation shaft thereof. A plurality of developing devices are arranged on the supporting member, each developing device including a developer supplying device. A plurality of cylindrically-shaped developer containers containing developer are provided, each developer container having an opening and a guide, and each developer container being detachably mounted on the developer supplying device. A container rotating device rotates the developer container, in which the guide is arranged that when one of the developing devices needs to be filled with the developer, the container rotating device rotates the developer container to transfer the developer in the developer container to the opening in accordance with a rotating movement of the developer container.

摘要翻译： 一种用于图像形成装置的显影剂容器，包括围绕其旋转轴旋转的支撑构件。 在支撑构件上布置有多个显影装置，每个显影装置包括显影剂供应装置。 提供了多个包含显影剂的圆筒状显影剂容器，每个显影剂容器具有开口和引导件，并且每个显影剂容器可拆卸地安装在显影剂供应装置上。 容器旋转装置旋转显影剂容器，其中布置引导件，当显影装置中的一个需要用显影剂填充时，容器旋转装置旋转显影剂容器以将显影剂容器中的显影剂转移到开口中 根据显影剂容器的旋转运动。

公开(公告)号：US06180019B2

公开(公告)日：2001-01-30

申请号：US08979949

申请日：1997-11-26

申请人： Hideyuki Kazumi ,  Tsutomu Tetsuka ,  Ryoji Nishio ,  Masatsugu Arai ,  Ken Yoshioka ,  Tsunehiko Tsubone ,  Akira Doi ,  Manabu Edamura ,  Kenji Maeda ,  Saburo Kanai

发明人： Hideyuki Kazumi ,  Tsutomu Tetsuka ,  Ryoji Nishio ,  Masatsugu Arai ,  Ken Yoshioka ,  Tsunehiko Tsubone ,  Akira Doi ,  Manabu Edamura ,  Kenji Maeda ,  Saburo Kanai

IPC分类号： H05H102

CPC分类号： H01J37/32174 ,  H01J37/32009 ,  H01J37/321

摘要： A plasma is generated by feeding an antenna with radio-frequency electric power generated by a radio-frequency power source, and one end of the antenna is grounded to the earth through a capacitor of variable capacitance. A Faraday shield is electrically isolated from the earth, and the capacitance of the variable capacitor is determined to be such a value that the voltage at the two ends of the antenna may be equal in absolute values and inverted to reduce the partial removal of the wall after the plasma ignition. At the time of igniting the plasma, the capacitance of the capacitor is adjusted to a larger or smaller value than that minimizing the damage of the wall.

摘要翻译： 通过向天线馈送由射频电源产生的射频电力产生等离子体，并且天线的一端通过可变电容的电容器接地到地球。 法拉第屏蔽与地电隔离，可变电容器的电容被确定为这样一个值，即天线两端的电压可以相等于绝对值并反转以减少壁的部分去除 等离子体点火后。 在点燃等离子体时，电容器的电容被调整到比将壁损坏最小化的更大或更小的值。

公开(公告)号：US5218410A

公开(公告)日：1993-06-08

申请号：US767470

申请日：1991-09-30

申请人： Akiro Nakabayashi ,  Kenji Maeda

发明人： Akiro Nakabayashi ,  Kenji Maeda

IPC分类号： A47L11/40 ,  D04H1/4326 ,  D06M11/00 ,  D06M11/83 ,  D06M101/00 ,  D06M101/16 ,  D06M101/30 ,  D06M101/32 ,  D06M101/34 ,  D06M101/36 ,  G03G15/20 ,  G03G21/00 ,  G03G21/10

CPC分类号： G03G15/2025

摘要： In order to reliably clean a thermal fixing roll for fixing a non-fixed image in an image forming apparatus such as a copier or a laser beam printer, a non-woven fabric web having a crisscross structure or a parallel structure with a thermally bonded fiber sheet is disposed at least on the side in contact with the fixing roll. The thermally bonded fiber sheet comprises composite fibers including 5 to 70% by weight of electroless nickel plated `CONEX` fibers, which is obtained by depositing metallic nickel to a thickness of up to and including 0.2 .mu.m by an electroless plating method on `CONEX` fibers which have the surface formed with stripe-like grooves, macrovoids, fine irregularities or a modified cross-section and is heat-resistant and excellent in adhesion for nickel, in addition to non-plated `CONEX` fibers and undrawn polyester fibers. Preferably, the above non-fabric web is impregnated with a heat-resistant cationic charging agent as a cleaning roll material.