公开(公告)号：US06224392B1

公开(公告)日：2001-05-01

申请号：US09206024

申请日：1998-12-04

Applicant: Benjamin V. Fasano ,  Kevin M. Prettyman

Inventor： Benjamin V. Fasano ,  Kevin M. Prettyman

IPC: H01R1200

CPC classification number: H01R4/30 ,  H01R12/52 ,  H01R12/58 ,  Y10T29/49158

Abstract: A compliant, high-density land grid array connector and the process of making such a connector. The process includes the steps of: (a) forming holes in a supporting substrate; (b) forming threaded sidewalls by tapping the holes; (c) plating the threaded sidewalls to form bellows-like structures; and (d) etching a surface of the supporting substrate after the plating to leave portions of the bellows-like structures protruding past a surface of the substrate. The resulting connector includes a substrate having bellows-like contacts extending from one or both sides for resiliently engaging pads such as those of an LGA module. As an alternative, the holes may be formed as blind holes. Ends of the bellows-like contacts may be roughened. The connector may also be formed by casting the substrate in a mold box having screw-like mandrels followed by steps of mandrel removal, hole plating and surface etching.

Abstract translation: 符合标准的高密度焊盘阵列连接器和制造这种连接器的过程。 该方法包括以下步骤：（a）在支撑衬底中形成孔; （b）通过敲击孔形成带螺纹的侧壁; （c）电镀螺纹侧壁以形成波纹管状结构; 和（d）在镀覆之后蚀刻支撑衬底的表面以使波纹管状结构的部分突出穿过衬底的表面。 所得到的连接器包括具有从一侧或两侧延伸的波纹状接触的基板，用于弹性接合焊盘，例如LGA模块的接头。 作为替代，孔可以形成为盲孔。 波纹管状触点的端部可能会变粗糙。 连接器也可以通过将基板浇铸在具有螺旋状心轴的模具箱中，之后是心轴去除，孔镀层和表面蚀刻的步骤来形成。

公开(公告)号：US06200373B1

公开(公告)日：2001-03-13

申请号：US09311811

申请日：1999-05-13

Applicant: Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

Inventor： Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

IPC: B32B1700

CPC classification number: C04B41/009 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  Y10T428/265 ,  C04B41/4539 ,  C04B41/4556 ,  C04B41/4578 ,  C04B41/5032 ,  C04B41/526 ,  C04B35/581 ,  H01L2924/00

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract translation: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。 在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。

公开(公告)号：US5791911A

公开(公告)日：1998-08-11

申请号：US739104

申请日：1996-10-25

Applicant: Benjamin V. Fasano ,  Kevin M. Prettyman

Inventor： Benjamin V. Fasano ,  Kevin M. Prettyman

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R24/50 ,  H01R12/57 ,  H05K1/0243 ,  H01L2924/0002 ,  H01R2103/00 ,  H05K1/0237 ,  H05K2201/09809 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  Y10T29/49123 ,  Y10T29/49147

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

Abstract translation: 表面安装的电子互连器件。 该装置包括：同轴电焊盘，其包括在与同轴连接器的导体布置相对应的衬底上的多个导电表面; 以及包括电介质材料的同轴连接器，所述电介质材料具有与所述连接器的端部平坦的中心开口和隔离的导电内部和外部表面。 电介质将内部导电表面与外部导电表面分离，并且管状地形成有用于导电内表面的内壁。 同轴连接器内外导体也可以由微弹簧构成。 同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。 示出了用于与同轴连接器第二端配合的插座，包括主体和内部和外部导体，并且构造成在不同时间接触同轴连接器的内部和外部表面。 插座的内导体适于被容纳在同轴连接器的导电内表面内。

公开(公告)号：US5773377A

公开(公告)日：1998-06-30

申请号：US489610

申请日：1995-06-12

Applicant: Jonathan H. Harris ,  Robert A. Youngman ,  Subhash L. Shinde ,  Lester W. Herron ,  Benjamin V. Fasano

Inventor： Jonathan H. Harris ,  Robert A. Youngman ,  Subhash L. Shinde ,  Lester W. Herron ,  Benjamin V. Fasano

IPC: C04B35/581 ,  C04B35/64 ,  C04B35/582

CPC classification number: C04B35/581 ,  C04B35/64 ,  Y10S428/901

Abstract: An aluminum nitride ceramic having enhanced properties suitable for electronic packaging applications can be prepared from a synergistic aluminum nitride powder/sintering aid mixture, in which the sintering aid is formulated to provide a resultant desirable second phase within the sintered body. The aluminum nitride powder/sintering aid mixture can be formed into green sheet-metal laminates and sintered at low temperature to yield high density, high electrical resistivity, and high thermal conductivity metal ceramic sintered bodies with low camber.

Abstract translation: 具有适合于电子封装应用的增强性能的氮化铝陶瓷可以由协同的氮化铝粉末/烧结助剂混合物制备，其中配制烧结助剂以在烧结体内提供所需的所需第二相。 氮化铝粉末/烧结助剂混合物可以形成生坯薄片金属层压板，并在低温下烧结以产生高密度，高电阻率，以及具有低弧度的高导热性金属陶瓷烧结体。

公开(公告)号：US5541145A

公开(公告)日：1996-07-30

申请号：US489615

申请日：1995-06-12

Applicant: Jonathan H. Harris ,  Subhash L. Shinde ,  Takeshi Takamori ,  Robert A. Youngman ,  Lester W. Herron ,  Benjamin V. Fasano

Inventor： Jonathan H. Harris ,  Subhash L. Shinde ,  Takeshi Takamori ,  Robert A. Youngman ,  Lester W. Herron ,  Benjamin V. Fasano

IPC: C04B35/581

CPC classification number: C04B35/581 ,  Y10S428/901

Abstract: An aluminum nitride ceramic having desired properties suitable for electronic packaging applications can be prepared from a novel aluminum nitride powder/sintering aid mixture. The sintering aid comprises a glassy component formed from alumina, calcia and boria, and a non-vitreous component comprising an element or compound of a metal of Group IIa, IIIa, or the lanthanides, preferably crystalline oxides, reactibis with the crystallized glass component and the alumina from the Al N grains. Alternatively, the sintering aid comprises a multi-component glass composition capable of forming the above components upon melting and thereafter crystallizing upon reaction.

Abstract translation: 可以由新型氮化铝粉末/烧结助剂混合物制备具有适合于电子封装应用的所需性能的氮化铝陶瓷。 烧结助剂包括由氧化铝，氧化钙和氧化硼形成的玻璃状组分，以及包含IIa，IIIa族金属或镧系元素的元素或化合物的非玻璃状组分，优选结晶氧化物与结晶的玻璃组分反应， 来自Al N颗粒的氧化铝。 或者，烧结助剂包括能够在熔化后形成上述组分并随后在反应后结晶的多组分玻璃组合物。

公开(公告)号：US07806341B2

公开(公告)日：2010-10-05

申请号：US12348364

申请日：2009-01-05

Applicant: Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D. Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

Inventor： Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D. Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

IPC: G06K19/05

CPC classification number: G06K19/07381 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/576 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

Abstract translation: 防篡改集成电路（IC）模块包括陶瓷芯片载体; 一个或多个集成电路芯片，附接到芯片载体的顶表面; 一个陶瓷基帽结构，附着在芯片载体的顶表面上，并覆盖一个或多个集成电路芯片; 以及嵌入在所述芯片载体和所述盖结构内的导电栅格结构，所述导电栅格结构具有设置在x方向，y方向和z方向上的多个曲折线; 其中所述导电栅格结构被配置为检测穿透所述IC模块的尝试。

公开(公告)号：US07615850B2

公开(公告)日：2009-11-10

申请号：US12104103

申请日：2008-04-16

Applicant: Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

Inventor： Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

IPC: H01L23/556

CPC classification number: H01L21/563 ,  C08G2650/40 ,  C08L71/00 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Abstract translation: 提供了一种包括易于再加工的α粒子屏障的方法和装置。 在芯片的表面和基板的表面之间的空间中施加易于再加工的α粒子屏障，并且降低软错误率（SER）。 此外，易于再加工的α粒子阻挡材料选自有机材料，烃，更具体地是聚α-烯烃（PAO）油和聚合物或填充聚合物的组; 其中所述聚α-烯烃油的粘度低于1000cSt（在100℃）。 易于再加工的α粒子阻挡材料可以与多芯片模块（MCM）一起使用，允许一个或多个模具的简单的器件返工，而不会影响同一基板上的其他裸片。

公开(公告)号：US06703560B2

公开(公告)日：2004-03-09

申请号：US09838454

申请日：2001-04-19

Applicant: Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar M. Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

Inventor： Patrick Anthony Coico ,  James H. Covell ,  Benjamin V. Fasano ,  Lewis S. Goldman ,  Ronald L. Hering ,  Sundar M. Kamath ,  Kenneth Charles Marston ,  Frank Louis Pompeo ,  Karl J. Puttlitz ,  Jeffrey Allen Zitz

IPC: H01L2302

CPC classification number: H01L21/50 ,  H01L23/04 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/301 ,  H01L2224/0401

Abstract: An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.

Abstract translation: 集成电路模块，焊盘栅阵列模块以及用于形成模块的方法包括安装一个或多个芯片或分立电子部件的基板以及用于覆盖基板的盖，并且包括至少一个连接到 用于在致动期间限制基板的弯曲量的盖。 所述至少一个突起可以刚性地固定到盖上或者可调节地插入通过盖。

公开(公告)号：US06552529B1

公开(公告)日：2003-04-22

申请号：US10022270

申请日：2001-12-17

Applicant: Benjamin V. Fasano ,  Mark G. Courtney

Inventor： Benjamin V. Fasano ,  Mark G. Courtney

IPC: G01R2708

CPC classification number: G01R31/2808 ,  G01R1/0408

Abstract: A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.

Abstract translation: 一种用于组装电路板的方法和结构，由此在连接永久性低温附着装置之前可以对高温附着装置进行电测试。 具有低温附着的测试插入件已知的良好参考装置与包含高温附接装置的电路板电接触。 测试插件/电路板组件可用于识别在连接电路板上的永久性低温连接装置之前可以更换的任何有缺陷的高温连接装置。 这种部分中间测试当仅将高温附着装置安装在电路板上时，在高温附着装置返工过程中消除了从电路板中去掉已知的良好的低温附着装置的需要。

公开(公告)号：US06171988B2

公开(公告)日：2001-01-09

申请号：US09364844

申请日：1999-07-30

Applicant: Benjamin V. Fasano ,  Robert A. Rita

Inventor： Benjamin V. Fasano ,  Robert A. Rita

IPC: C03C3078

CPC classification number: C03C14/004 ,  C03C2214/08 ,  C03C2214/20 ,  H05K1/0306 ,  Y10T428/24926

Abstract: The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO3, SrTiO3 and Ta2O5 produce the most effective results.

Abstract translation: 通过选择性地添加高介电常数陶瓷，例如钛酸盐，钽酸盐，碳化物和金属如铜，可以在一定范围内改变低损耗相切玻璃 - 陶瓷组合物的介电常数，例如堇青石系玻璃陶瓷。 在一定范围的频率范围内保持或改善低损耗角正切，保持玻璃陶瓷的低CTE。 BaTiO3，SrTiO3和Ta2O5产生最有效的结果。