Methods and structures for split gate memory cell scaling with merged control gates
    42.
    发明授权
    Methods and structures for split gate memory cell scaling with merged control gates 有权
    具有合并控制门的分离栅极存储单元缩放的方法和结构

    公开(公告)号:US09318501B2

    公开(公告)日:2016-04-19

    申请号:US14303290

    申请日:2014-06-12

    摘要: A memory device has first and second memory cells in and over a substrate. A first doped region is in a first active region. A top surface of the first active region is substantially coplanar with a top surface of the first doped region. A control gate is over the first doped region and extends over a first side of the first doped region and over a second side of the first doped region. A charge storage layer is between the first control gate and the first active region including between the first select gate and the first doped region. A first select gate is over the first active region on the first side of the first doped region and adjacent to the control gate. A second select gate is over the first active region on the second side of the first doped region and adjacent to the control gate.

    摘要翻译: 存储器件具有在衬底中和之上的第一和第二存储器单元。 第一掺杂区域处于第一有源区。 第一有源区的顶表面与第一掺杂区的顶表面基本共面。 控制栅极在第一掺杂区域之上,并且在第一掺杂区域的第一侧上并且在第一掺杂区域的第二侧上延伸。 第一控制栅极和第一有源区域之间的电荷存储层包括在第一选择栅极和第一掺杂区域之间。 第一选择栅极在第一掺杂区域的第一侧上并与控制栅极相邻的第一有源区上方。 第二选择栅极位于第一掺杂区域的第二侧上并与控制栅极相邻的第一有源区上。

    Method for simulating long-term performance of a non-volatile memory by exposing the non-volatile memory to heavy-ion radiation
    44.
    发明授权
    Method for simulating long-term performance of a non-volatile memory by exposing the non-volatile memory to heavy-ion radiation 有权
    通过将非易失性存储器暴露于重离子辐射来模拟非易失性存储器的长期性能的方法

    公开(公告)号:US07955877B2

    公开(公告)日:2011-06-07

    申请号:US12405308

    申请日:2009-03-17

    IPC分类号: G01R31/26 H01L21/66

    摘要: Testing a non volatile memory by exposing the non volatile memory to particle radiation (e.g. xenon ions) to emulate memory cell damage due to data state changing events of a non volatile memory cell. After the exposing, the memory cells are subjected to tests and the results of the tests are used to develop reliability indications of the non volatile memory. Integrated circuits with non volatile memories of the same design are provided. Reliability representations of the integrated circuits can be made with respect to a number of data state charging events based on the exposure and subsequent tests.

    摘要翻译: 通过将非易失性存储器暴露于粒子辐射(例如氙离子)来测试非易失性存储器,以模拟由非易失性存储器单元的数据状态改变事件引起的存储器单元损坏。 在曝光之后,对存储器单元进行测试,并且测试结果用于开发非易失性存储器的可靠性指示。 提供了具有相同设计的非易失性存储器的集成电路。 集成电路的可靠性表示可以基于曝光和随后的测试相对于多个数据状态充电事件进行。

    METHOD OF MAKING A SPLIT GATE MEMORY CELL
    46.
    发明申请
    METHOD OF MAKING A SPLIT GATE MEMORY CELL 有权
    制造分离栅存储单元的方法

    公开(公告)号:US20100099246A1

    公开(公告)日:2010-04-22

    申请号:US12254331

    申请日:2008-10-20

    IPC分类号: H01L21/8247

    摘要: A method includes forming a first layer of gate material over a semiconductor substrate; forming a hard mask layer over the first layer; forming an opening; forming a charge storage layer over the hard mask layer and within the opening; forming a second layer of gate material over the charge storage layer; removing a portion of the second layer and a portion of the charge storage layer which overlie the hard mask layer, wherein a second portion of the second layer remains within the opening; forming a patterned masking layer over the hard mask layer and over the second portion, wherein the patterned masking layer defines both a first and second bitcell; and forming the first and second bitcell using the patterned masking layer, wherein each of the first and second bitcell comprises a select gate made from the first layer and a control gate made from the second layer.

    摘要翻译: 一种方法包括在半导体衬底上形成栅极材料的第一层; 在第一层上形成硬掩模层; 形成开口 在所述硬掩模层和所述开口内形成电荷存储层; 在所述电荷存储层上形成栅极材料的第二层; 去除所述第二层的一部分和所述电荷存储层的覆盖所述硬掩模层的部分,其中所述第二层的第二部分保留在所述开口内; 在所述硬掩模层上并在所述第二部分上形成图案化掩模层,其中所述图案化掩模层限定第一和第二位单元; 以及使用所述图案化掩模层形成所述第一和第二位单元,其中所述第一和第二位单元中的每一个包括由所述第一层制成的选择栅极和由所述第二层制成的控制栅极。

    Method for forming a non-volatile memory and a peripheral device on a semiconductor substrate
    48.
    发明授权
    Method for forming a non-volatile memory and a peripheral device on a semiconductor substrate 有权
    在半导体衬底上形成非易失性存储器和外围器件的方法

    公开(公告)号:US07341914B2

    公开(公告)日:2008-03-11

    申请号:US11376411

    申请日:2006-03-15

    IPC分类号: H01L21/336

    摘要: A method for forming a semiconductor device includes forming a first gate electrode over a semiconductor substrate, wherein the first gate electrode comprises silicon and forming a second gate electrode over the semiconductor substrate and adjacent the first gate electrode, wherein the second gate electrode comprises silicon. Nanoclusters are present in the first gate electrode. A peripheral transistor area is formed devoid of nanoclusters.

    摘要翻译: 一种用于形成半导体器件的方法包括在半导体衬底上形成第一栅电极,其中第一栅电极包括硅并在半导体衬底上形成并邻近第一栅电极的第二栅电极,其中第二栅电极包括硅。 纳米簇存在于第一栅电极中。 外围晶体管区域形成为没有纳米团簇。

    Method of forming a semiconductor device and structure thereof
    49.
    发明申请
    Method of forming a semiconductor device and structure thereof 失效
    形成半导体器件的方法及其结构

    公开(公告)号:US20070218669A1

    公开(公告)日:2007-09-20

    申请号:US11376412

    申请日:2006-03-15

    IPC分类号: H01L21/4763

    摘要: A method for forming a semiconductor device includes providing a semiconductor substrate comprising silicon, forming a layer of dielectric on the surface of the semiconductor substrate, forming a gate electrode comprising silicon over the layer of dielectric, recessing the layer of dielectric under the gate electrode, filling the recess with a discrete charge storage material, oxidizing a portion of the gate electrode, and oxidizing a portion of the semiconductor substrate.

    摘要翻译: 一种形成半导体器件的方法包括提供包括硅的半导体衬底,在半导体衬底的表面上形成电介质层,在电介质层上形成包含硅的栅电极,使栅电极下的电介质层凹陷, 用分散的电荷存储材料填充凹槽,氧化栅电极的一部分,以及氧化半导体衬底的一部分。

    Multi-bit non-volatile integrated circuit memory and method therefor

    公开(公告)号:US20050106812A1

    公开(公告)日:2005-05-19

    申请号:US10716956

    申请日:2003-11-19

    摘要: A non-volatile memory (10) includes at least two buried bit lines (45, 47) formed within a semiconductor substrate (12), a charge storage layer (18) overlying the semiconductor substrate (12); a control gate (26) overlying the charge storage layer (18); an insulating liner (30) overlying the control gate; and first and second conductive sidewall spacer control gates (32, 34). Multiple programmable charge storage regions (42) and (41, 44) are created within the charge storage layer (18) beneath respective ones of the control gate (26) and the first and second sidewall spacer control gates (32, 34). Also, the non-volatile memory (10) is a virtual ground NOR type multi-bit flash EEPROM (electrically erasable programmable read only memory). By using conductive sidewall spacers as the control gates, a very dense multi-bit non-volatile memory can be manufactured.