Abstract:
Signal propagation times in circuit paths are matched to compensate for signal delays due to differences in the physical parameters, such as lengths, of the circuit paths. This is accomplished by adjusting the length of lead lines and by the addition of resistors in series with shorter lead lines in a chip or die. In a chip with an active device, such as logic, having multiple input lines, the lines are divided into long lines and short lines. All long lines are laid out so as to have the same length and to use the least amount of chip surface area. Similarly, all short lines are laid out on the chip so as to have the same length while using the least amount of chip surface area. With all the short lines having the same propagation time difference relative to all the long lines, the same resistive element is added to all the short lines to effect the same RC delay in signal propagation on the short lines so as to match the signal propagation time on the short lines with that on the long lines.
Abstract:
A bias circuit for generating a bias voltage over variations in the power supply voltage and over process parameters is disclosed. The bias circuit utilizes a voltage divider to generate a divided voltage based on the power supply value. The divided voltage is applied to the gate of a modulating transistor (biased in saturation) in a current mirror, which controls a current applied to a linear load device biased in the linear region. The voltage across the load device determines the bias voltage. Variations in the power supply voltage are thus reflected in the bias voltage, such that the gate-to-source voltage of the series transistor is constant over variations in power supply voltage. Variations in process parameters that produce different transistor current drive characteristics are reflected in a variations of the bias voltage produced by the linear load device. The bias circuit may control the slew rate of an output driver, may control the propagation delay through a delay element, and be used to control the duration of a pulse produced by a pulse generating circuit.
Abstract:
A read circuit for a memory cell includes a sense amplifier and an equilibrate circuit. The sense amplifier is coupled to the memory cell via a pair of data lines, and amplifies the data signals that the memory cell provides. The equilibrate circuit is coupled to the sense amplifier, receives an equilibrate signal, and, when the equilibrate signal has an active level, equilibrates the sense amplifier. When the equilibrate signal has an inactive level, the equilibrate circuit causes the sense amplifier to draw substantially zero supply current, regardless of the levels of any signals on the data lines. The read circuit may also include an enable circuit that receives an enable signal and is coupled to the sense amplifier. When the enable signal has an active level, the enable circuit allows the sense amplifier to amplify the data signals on the data lines. When the enable signal has an inactive level, the enable circuit prohibits the sense amplifier from amplifying the data signals on the data lines.
Abstract:
An output driver circuit for an integrated circuit is disclosed, where the output driver drives an output terminal with a high logic level having a voltage limited from the power supply voltage of the integrated circuit. The limited voltage is provided by applying a limited output high voltage to an output buffer, such that the drive signal applied to the gate of the pull-up transistor in the output driver is limited by the limited output high voltage applied to the output buffer. A voltage reference and regulator circuit for generating the limited output high voltage is also disclosed, and is based on a current mirror. The sum of the current in the current mirror is controlled by a bias current source, which may be dynamically controlled within the operating cycle or programmed by way of fuses. An offset compensating current source adds current into the reference leg of the current mirror to eliminate the development of an offset voltage in the current mirror, and the limited output high voltage is shifted by the threshold voltage of the pull-up drive transistor by way of a threshold shift circuit.
Abstract:
A memory and a method involving the memory. The memory includes a memory array having a data quantity output for outputting a data quantity and a data output driver having an input for receiving the data quantity and an output for outputting the data quantity from the memory. The memory further includes a data quantity pipeline register having an input for receiving the data quantity and an output coupled to the input of the data output driver. Finally, the memory includes means for selectively coupling a data quantity from the data output of the memory array to the input of the data output driver in a first operational mode and to the input of the data quantity pipeline register in a second operational mode.
Abstract:
A circuit and related method are provided for parallel stressing of a plurality of memory circuits integrated on dies on a silicon wafer. A test mode control circuit, having a first and a second test mode control input, is used, during special test operation mode, to force outputs of address buffers, data buffers and other signal buffers, like chip-enable or write buffers, to predetermined logic values so that all row and column decoders are selected and predetermined data is written into the array of memory cells. Contemporaneously are also exercised entire paths of buffers. The integrated circuit is then heated and maintained at an elevated temperature for a desired time, and then cooled down. In this way it is possible to stress test one or more integrated circuits on the same wafer in a short time, requiring only a limited number of test signals. It is possible, indeed, to connect in parallel power supply and test inputs of a plurality of integrated circuits and test them simultaneously. For example by connecting only four probes to one of the plurality of integrated circuits (ground, supply voltage and two test mode inputs), it is possible to write all 0's or all 1's and to deselect the entire memory array simultaneously in all integrated circuits during the test. This circuit allows to use very simple test equipment and reduces dramatically test times avoiding consequent burn in of packaged devices.
Abstract:
According to the present invention, faulty isolated bits in the cache memory are made inaccessible to the microprocessor by rendering an appropriate line of data in the cache memory uncacheable to the microprocessor. When faulty data bits are not repairable through conventional repair means such as row/column redundancy, the tag RAM may be programmed with the address of the faulty data bit such that when the microprocessor requests data at that address, a comparator inside the tag RAM generates a signal indicative of a "miss" condition which is an output signal of the tag RAM. The miss condition is communicated to the microprocessor which must access the requested data from main memory. In this way, a cache memory having faulty data bits may still be utilized.
Abstract:
Two addresses of an integrated circuit are selected to define a portion of the die which is functional and the portion of the die which will not be used. An input structure for addresses, which may be added to part of the electrostatic discharge (ESD) input structure of a pin, allows an address signal to be set to a predetermined logic level and to not be bonded out to the package. Additionally, another input structure allows the mapping of a signal pin to be changed. The function of a pin may need to be changed to accommodate a pinout for a different density device. This is useful when a die is put into a smaller density device package which has a pin out that does not accommodate the die. In this way, partially functional die that previously were discarded may be utilized, thereby recouping potential losses during manufacturing.
Abstract:
The mechanism for performing writes to the data cache memory in a cache subsystem is modified to reduce the occurrence of microprocessor wait states. Concurrently, with operation of the tag RAM, the write signal from the microprocessor propagates through the data cache up to a point in the internal circuitry of the data cache which is as close as reasonably possible to the memory cell being written. At this point in the circuitry, the write signal is gated by the Match signal from the tag RAM. Address decoding is completed prior to receiving the Match signal, such that when the tag RAM generates a "hit" Match output signal, the write signal is allowed to finish propagating through data cache internal circuitry without additional address set-up time. This allows the memory cell to be written to quickly and reduces the probability of microprocessor wait states. In a preferred embodiment of the present invention, the write signal propagates to a logic function, such as a logic gate, where it is gated by the Match signal from the tag RAM and data. When the tag RAM generates a "hit" Match output signal, the write signal as well as the data is allowed to finish propagating to the memory cell.
Abstract:
A memory system including a memory array having at least two pairs of data lines, first and second data lines, that correspond to columns in the memory array. A first stage is included having inputs connected to the two pairs of data lines. The first stage also has a pair of output lines, a true output lines and a complement output line, wherein output signals generated in the output lines are controlled by a first and second set of transistors. Each transistor in the first set has a gate connected to one of the input lines, and each transistor in the second set is connected in series with one of the transistors in the first set and may be selectively turned on and turned off, wherein of one of the two pairs of data lines may be selected by turning transistors on and off in the second set.