METHOD AND APPARATUS FOR SUPPLYING POWER TO A SEMICONDUCTOR DEVICE USING A CAPACITOR DC SHUNT
    42.
    发明申请
    METHOD AND APPARATUS FOR SUPPLYING POWER TO A SEMICONDUCTOR DEVICE USING A CAPACITOR DC SHUNT 失效
    使用电容器DC SHUNT向半导体器件供电的方法和装置

    公开(公告)号:US20080079136A1

    公开(公告)日:2008-04-03

    申请号:US11943468

    申请日:2007-11-20

    申请人: Yuan-Liang Li

    发明人: Yuan-Liang Li

    IPC分类号: H01L23/48 H01L21/60

    摘要: A power shunt for use within a semiconductor device of a type having a motherboard and an integrated circuit package electrically coupled to the motherboard and of a type having a spaced portion located between the motherboard and the package. The power shunt comprises a capacitor within the spaced portion between the motherboard and the package of the semiconductor device. The capacitor includes a conductive layer of a first type, a conductive layer of a second type, and a dielectric layer that electrically isolates the first type conductive layer from the second type conductive layer, wherein said first type conductive layer and second type conductive layer form a conductive bridge between the motherboard and the package. The arrangement of the capacitor fulfills the dual function of providing decoupling capacitance with the capability of supplying an additional path of current between the motherboard and package to the die load 16.

    摘要翻译: 一种用于半导体器件的功率分流器,该半导体器件具有电耦合到母板的主板和集成电路封装,并且具有位于母板和封装之间的间隔部分的类型。 功率分流器包括在母板和半导体器件的封装之间的间隔部分内的电容器。 电容器包括第一类型的导电层,第二类型的导电层和将第一类型导电层与第二类型导电层电隔离的电介质层,其中所述第一导电层和第二导电层形成 主板和封装之间的导电桥。 电容器的布置实现了提供去耦电容的双重功能,其具有在母板和封装之间向芯片负载16提供额外的电流路径的能力。

    Electronic packages having multiple-zone interconnects and methods of manufacture
    47.
    发明授权
    Electronic packages having multiple-zone interconnects and methods of manufacture 有权
    具有多区域互连的电子封装和制造方法

    公开(公告)号:US06717066B2

    公开(公告)日:2004-04-06

    申请号:US10004002

    申请日:2001-11-30

    IPC分类号: H01L2348

    摘要: To accommodate thermal stresses arising from different coefficients of thermal expansion (CTE) of a packaged or unpackaged die and a substrate, the package incorporates two or more different interconnect zones. A first interconnect zone, located in a central region of the die, employs a relatively stiff interconnect structure. A second interconnect zone, located near the periphery of the die, employs a relatively compliant interconnect structure. Additional interconnect zones, situated between the first and second interconnect zones and having interconnect structure with compliance qualities intermediate those of the first and second zones, can optionally be employed. In one embodiment, solder connections providing low electrical resistance are used in the first interconnect zone, and compliant connections, such as nanosprings, are used in the second interconnect zone. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system are also described.

    摘要翻译: 为了适应由封装的或未封装的裸片和衬底的不同热膨胀系数(CTE)产生的热应力,封装包含两个或多个不同的互连区域。 位于模具的中心区域中的第一互连区域采用相对较硬的互连结构。 位于模具周边附近的第二互连区采用相对顺应的互连结构。 位于第一和第二互连区之间并具有与第一和第二区之间的顺应性质量的互连结构的附加互连区可以任选地被采用。 在一个实施例中,在第一互连区域中使用提供低电阻的焊接连接,并且在第二互连区域中使用诸如纳米脉冲的顺应连接。 还描述了制造方法以及将包装应用于电子组件,电子系统和数据处理系统。

    APPARATUS, SYSTEM AND METHOD TO PROTECT SIGNAL COMMUNICATION INTEGRITY
    48.
    发明申请
    APPARATUS, SYSTEM AND METHOD TO PROTECT SIGNAL COMMUNICATION INTEGRITY 审中-公开
    装置,系统和保护信号通信完整性的方法

    公开(公告)号:US20160174362A1

    公开(公告)日:2016-06-16

    申请号:US14569524

    申请日:2014-12-12

    CPC分类号: H05K1/0227 H05K1/0243

    摘要: Techniques and mechanisms to mitigate noise in a signal line extending across rails arranged in a split plane configuration. In an embodiment, respective sides of a first rail and a second rail define opposite sides of a boundary region between the rails. The first rail forms a groove and the second rail forms a branch portion that extends at least in part into the groove. In another embodiment, one or more signal lines each extend across the boundary region and proximate to the branch portion, the one or more signals each to communicate a respective signal while the first rail is at a first voltage and while the second rail is at a second voltage. The branch portion and groove contribute to a reduced impedance discontinuity across the boundary region, which mitigates the creation of signal noise in the one or more signal lines.

    摘要翻译: 技术和机制,以减轻信号线中的噪声,延伸穿过设置在分离平面配置中的轨道。 在一个实施例中,第一轨道和第二轨道的相应侧面限定轨道之间的边界区域的相对侧面。 第一轨道形成凹槽,第二轨道形成至少部分地延伸到凹槽中的分支部分。 在另一个实施例中,一个或多个信号线各自延伸跨越边界区域并且靠近分支部分,所述一个或多个信号各自用于在第一轨道处于第一电压的同时传送相应的信号,而第二轨道处于 第二电压。 分支部分和凹槽有助于跨越边界区域的减小的阻抗不连续性,这减轻了一个或多个信号线中的信号噪声的产生。

    INDUCTIVE FILTERS AND METHODS OF FABRICATION THEREFOR
    50.
    发明申请
    INDUCTIVE FILTERS AND METHODS OF FABRICATION THEREFOR 有权
    电感滤波器及其制造方法

    公开(公告)号:US20060267216A1

    公开(公告)日:2006-11-30

    申请号:US11462611

    申请日:2006-08-04

    IPC分类号: H01L23/48

    摘要: A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.

    摘要翻译: 一系列电镀通孔(PTH)通孔在电介质板的顶表面和底表面之间交替的迹线互连。 该系列中的PTH通孔可以定位成产生共线感应滤波器,线圈型感应滤波器或变压器。 在一个实施例中,多个电隔离的互连PTH通孔系列可用作多相感应滤波器。 在另一个实施例中,多个互连的PTH通孔系列通过导电材料的连接部分电连接,导致低电阻感应滤波器。 铁磁材料图案可以嵌入电介质板中以增强互连通孔结构的感应特性。 在一个实施例中,闭合端图案具有围绕图案卷绕的两系列互连的通孔,从而形成嵌入式变压器结构。 制造互连的PTH通孔系列的方法包括提供具有一系列孔的电介质板。 在一些实施例中,板包括嵌入的铁磁材料图案。 电介质板的孔和顶表面和底表面具有导电材料。 选择性地去除导电材料的部分,从而产生嵌入的感应滤波器和/或变压器结构。