利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

59 条记录 (耗时 0.033 秒)

    Compositions and processes for immersion lithography
    42.
    发明申请
    Compositions and processes for immersion lithography 有权

    公开(公告)号：US20090130592A1

    公开(公告)日：2009-05-21

    申请号：US12319737

    申请日：2009-01-12

    申请人： Deyan Wang

    发明人： Deyan Wang

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/0392 ,  G03F7/0046 ,  G03F7/0047 ,  G03F7/0382 ,  G03F7/0757 ,  G03F7/0758 ,  G03F7/2041

    摘要： New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

    Leveler compounds
    43.
    发明授权
    Leveler compounds 有权
    矫平剂化合物

    公开(公告)号：US07510639B2

    公开(公告)日：2009-03-31

    申请号：US11182311

    申请日：2005-07-16

    申请人： Deyan Wang ,  Robert D. Mikkola ,  Chunyi Wu ,  George G. Barclay

    发明人： Deyan Wang ,  Robert D. Mikkola ,  Chunyi Wu ,  George G. Barclay

    IPC分类号： C25D3/58 ,  C25D3/38 ,  C23C18/40

    CPC分类号： C08G59/184 ,  C25D3/38 ,  H01L21/2885 ,  H05K3/423

    摘要： Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

    摘要翻译： 提供含有流平剂混合物的电镀浴，其中混合物包括具有第一扩散系数的第一级试剂和具有第二扩散系数的第二流平剂。 这种电镀浴在一定范围的电解质浓度下沉积基本平坦的金属层，特别是铜层。 还公开了使用这种电镀浴沉积金属层的方法。 这些浴和方法对于在具有小孔径的基板（例如电子设备）上提供铜的平面层是有用的。

    Leveler compounds
    49.
    发明授权
    Leveler compounds 有权
    矫平剂化合物

    公开(公告)号：US08506788B2

    公开(公告)日：2013-08-13

    申请号：US13609267

    申请日：2012-09-11

    申请人： Deyan Wang ,  Robert D. Mikkola ,  George G. Barclay

    发明人： Deyan Wang ,  Robert D. Mikkola ,  George G. Barclay

    IPC分类号： C25D3/38

    CPC分类号： C25D3/38 ,  C25D3/02 ,  C25D3/40 ,  C25D7/12 ,  C25D7/123 ,  H05K3/423

    摘要： Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.

    摘要翻译： 提供金属电镀浴的流平剂。 含有这种流平剂的镀浴提供具有基本水平表面的金属沉积物。 可以选择这种流平剂以选择性地将期望水平的杂质掺入到金属沉积物中。

    Compositons and processes for immersion lithography
    50.
    发明授权
    Compositons and processes for immersion lithography 有权
    浸入式光刻的组合物和工艺

    公开(公告)号：US08257902B2

    公开(公告)日：2012-09-04

    申请号：US12290980

    申请日：2008-11-05

    申请人： Deyan Wang ,  Cheng-Bai Xu ,  George G. Barclay

    发明人： Deyan Wang ,  Cheng-Bai Xu ,  George G. Barclay

    IPC分类号： G03F7/00 ,  G03F7/004

    CPC分类号： G03F7/2041 ,  C08F220/22 ,  C08F220/24 ,  C08F220/26 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0757 ,  H01L21/0274

    摘要： New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprises two or more distinct materials that can be substantially non-mixable with a resin component of the resist. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

    摘要翻译： 提供了可用于浸没式光刻的新的光致抗蚀剂组合物。 本发明优选的光致抗蚀剂组合物包含两种或多种不同的材料，其可以与抗蚀剂的树脂组分基本上不可混合。 本发明的特别优选的光致抗蚀剂可以在浸没光刻处理期间将抗蚀剂材料的浸出降低到与抗蚀剂层接触的浸没流体中。