公开(公告)号：US07205214B2

公开(公告)日：2007-04-17

申请号：US11079815

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。

公开(公告)号：US20070048891A1

公开(公告)日：2007-03-01

申请号：US11551971

申请日：2006-10-23

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。

公开(公告)号：US07176978B2

公开(公告)日：2007-02-13

申请号：US10847302

申请日：2004-05-18

申请人： Kazuyuki Uchida ,  Kengo Nishimura ,  Akihiro Miyazaki ,  Jyunichi Nakahashi ,  Kunihiko Hayashi ,  Satoshi Ikawa

发明人： Kazuyuki Uchida ,  Kengo Nishimura ,  Akihiro Miyazaki ,  Jyunichi Nakahashi ,  Kunihiko Hayashi ,  Satoshi Ikawa

IPC分类号： H04N9/475

CPC分类号： H04N21/2368 ,  H04N21/4305 ,  H04N21/4341

摘要： In synchronization of a conventional AV system, when a stream as the master stops, a system clock cannot be corrected for synchronization. Since the correction is consistently performed even when an error is small, overhead of correction is large. On the other hand, when an error is large, sharp correction causes a feeling that something wrong. In the present invention, when the stream as the master stops, previously registering the degree of priority regarding the master, consideration of a corrected period or a previous error for the system clock, or transmitting a stream containing information regarding the master can allow for other process to serves as the master. Accordingly, it is possible to provide a method for synchronization with maintaining correction of the system clock. When a corrected error is large, gradual correction or reference can provide a system with normal feeling. Furthermore, when an error of correction is small, omission of correction or reference can provide a system with less overhead.

公开(公告)号：US20050158904A1

公开(公告)日：2005-07-21

申请号：US11079742

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B44C1/00 ,  B44C1/165 ,  H01L21/00 ,  H01L21/336 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US5413988A

公开(公告)日：1995-05-09

申请号：US227004

申请日：1994-04-13

申请人： Kunihiko Hayashi ,  Shuichi Fujino ,  Youichi Enomoto ,  Shoji Tanaka

发明人： Kunihiko Hayashi ,  Shuichi Fujino ,  Youichi Enomoto ,  Shoji Tanaka

IPC分类号： C01G1/00 ,  C01G3/00 ,  C04B35/45 ,  C04B35/653 ,  C23C14/08 ,  C23C14/34 ,  C30B23/02 ,  C30B29/22 ,  H01B12/06 ,  H01B13/00 ,  H01L39/24 ,  C30B15/00 ,  B05D3/06 ,  B05D5/12

CPC分类号： H01L39/2448 ,  C04B35/4508 ,  C04B35/653 ,  C23C14/087 ,  C30B23/02 ,  C30B29/22 ,  C30B29/225 ,  Y10S505/729 ,  Y10S505/732

摘要： An oxide superconductor thin film of Y.sub.1.+-..alpha. Ba.sub.2.+-..beta. Cu.sub.3.+-..gamma. O.sub.7-.delta. with a smooth surface having a low density of particles being generated without decreasing superconductivity is produced by the steps of applying a pulsed laser beam to the target formed of an oxide material having an apparent density of 95% or more, substantially composed of Y.sub.1.+-..alpha. Ba.sub.2.+-..beta. Cu.sub.3.+-..gamma. O.sub.7-.delta., which is obtained from a molded body of an amorphous powder by subjecting it to partial melting, followed by gradual cooling, depositing and accumulating an irradiated and evaporated oxide material of the target on a substrate.

摘要翻译： 通过以下步骤产生具有具有低密度颗粒的光滑表面而不降低超导性的Y1 +/-αBa2 +/-βCu3 +/-γO7-δ的氧化物超导体薄膜，其步骤是将脉冲激光束施加到靶 由表观密度为95％以上的氧化物材料形成，其基本上由Y1 +/-αBa 2 +/-βCu 3 +/-γO 7-δ组成，其通过使其部分地由无定形粉末的成型体获得 熔化，随后逐渐冷却，沉积并将靶材的辐射和蒸发的氧化物材料沉积并堆积在基底上。

公开(公告)号：US08868835B2

公开(公告)日：2014-10-21

申请号：US13253456

申请日：2011-10-05

申请人： Kunihiko Hayashi

发明人： Kunihiko Hayashi

IPC分类号： G06F15/16 ,  G06F12/08

CPC分类号： G06F12/0864 ,  G06F12/0842

摘要： A cache control apparatus according to the present invention includes a cache allocation control unit which allocates each of a plurality of ways included in a cache memory to one or more of tasks to be executed by a plurality of processors. In the case where a group of ways includes an unallocated way that is not allocated to any of the tasks and a way allocated to one or more of the tasks which is to be executed by one of the processors, the cache allocation control unit allocates the unallocated way included in the group to the one or more of the tasks to be executed by the one of the processors.

摘要翻译： 根据本发明的高速缓存控制装置包括：高速缓存分配控制单元，其将包括在高速缓冲存储器中的多个方式中的每一个分配给由多个处理器执行的任务中的一个或多个。 在一组方式包括未分配给任何任务的未分配方式和分配给要由一个处理器执行的一个或多个任务的方式的情况下，高速缓存分配控制单元分配 未分配的方式包括在组中以由一个处理器执行的一个或多个任务。

公开(公告)号：US20140007824A1

公开(公告)日：2014-01-09

申请号：US13389994

申请日：2011-03-18

申请人： Kunihiko Hayashi ,  Syusaku Sugamoto ,  Yoshio Hasegawa ,  Hirokazu Hata

发明人： Kunihiko Hayashi ,  Syusaku Sugamoto ,  Yoshio Hasegawa ,  Hirokazu Hata

IPC分类号： F01P3/00

CPC分类号： F01P3/00 ,  F01P3/20 ,  F01P7/167 ,  F01P11/04 ,  F01P11/06 ,  F01P2007/146 ,  F01P2060/08

摘要： A cooling system is incorporated into an engine cooling circuit including a pump for circulating a coolant of an engine and a radiator for cooling the coolant of the engine. The cooling system includes a first passage portion provided between the engine and a coolant outlet of the pump; a second passage portion provided between the engine and an coolant inlet of the pump, a rotary valve disc interposed in the passage portions and being rotatable so as to simultaneously control the coolant flowing through the first passage portion and the coolant flowing through the second passage portion.

摘要翻译： 一种冷却系统结合到发动机冷却回路中，该发动机冷却回路包括用于循环发动机冷却剂的泵和用于冷却发动机冷却剂的散热器。 冷却系统包括设置在发动机和泵的冷却剂出口之间的第一通道部分; 设置在发动机和泵的冷却剂入口之间的第二通道部分，设置在通道部分中的旋转阀盘，并且可旋转，以便同时控制流过第一通道部分的冷却剂和流过第二通道部分的冷却剂 。

公开(公告)号：US08590495B2

公开(公告)日：2013-11-26

申请号：US13581690

申请日：2010-03-05

申请人： Hideo Kobayashi ,  Kunihiko Hayashi ,  Akihito Hosoi ,  Masahide Ishikawa

发明人： Hideo Kobayashi ,  Kunihiko Hayashi ,  Akihito Hosoi ,  Masahide Ishikawa

IPC分类号： F01P7/16

CPC分类号： F01P7/081 ,  F01P2037/02 ,  F16D48/064 ,  F16D2500/1022 ,  F16D2500/10418 ,  F16D2500/3067 ,  F16D2500/5023 ,  F16D2500/70424

摘要： In a control device 1 for a clutch unit 20 for transmitting rotation of a crankshaft 18 of an engine 100 to a water pump 2 for circulating cooling water within the engine 100, it is determined that whether engagement or disengagement of the clutch unit 20 when a request to start the engine 100 is made, and the clutch unit 20 is caused to be in an engagement state based on a determination result before cranking of the engine 100 starts.

摘要翻译： 在用于将发动机100的曲轴18的旋转传递到用于使发动机100内的冷却水循环的水泵2的离合器单元20的控制装置1中，确定当离合器单元20的接合或分离时 制造启动发动机100的请求，并且基于在发动机100起动之前的确定结果开始使离合器单元20处于接合状态。

公开(公告)号：US08297407B2

公开(公告)日：2012-10-30

申请号：US13317551

申请日：2011-10-21

申请人： Taiichi Mori ,  Hideo Kobayashi ,  Katuhiko Arisawa ,  Kenichi Yamada ,  Yoshio Yamashita ,  Kunihiko Hayashi

发明人： Taiichi Mori ,  Hideo Kobayashi ,  Katuhiko Arisawa ,  Kenichi Yamada ,  Yoshio Yamashita ,  Kunihiko Hayashi

IPC分类号： F16N31/00

CPC分类号： F01M11/0004 ,  F01M5/007 ,  F01M2011/0037 ,  F01M2011/0045 ,  F01M2011/007 ,  Y10T137/7404 ,  Y10T137/7436

摘要： An oil pan is provided with an oil pan separator that partitions a first chamber that communicates with a moving part inside a cylinder block and a second chamber outside the first chamber. A communicating hole is provided to a bottom panel of the oil pan separator. The communicating hole is shielded from a strainer.

公开(公告)号：US08276156B2

公开(公告)日：2012-09-25

申请号：US13080847

申请日：2011-04-06

申请人： Kunihiko Hayashi

发明人： Kunihiko Hayashi

IPC分类号： G06F9/46

CPC分类号： G06F9/4881 ,  Y02D10/24

摘要： A method of assigning task management blocks for first type tasks to time slot information on a one-by-one basis, assigning a plurality of task management blocks for second type tasks to time slot information, selecting a task management block according to a priority classification when switching to the time slot of the time slot information, and switching to the time slot except the time slot information. Additionally a task switching apparatus selects the task management block assigned to the time slot and executes the task.

摘要翻译： 一种将第一类型任务的任务管理块分配给时隙信息的方法，将用于第二类型任务的多个任务管理块分配给时隙信息，根据优先级分类选择任务管理块 切换到时隙信息的时隙，并切换到时隙信息以外的时隙。 此外，任务切换装置选择分配给时隙的任务管理块，并执行该任务。