公开(公告)号：US07589942B2

公开(公告)日：2009-09-15

申请号：US11763646

申请日：2007-06-15

申请人： Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Cagglano ,  Kanakasabapathi Subramanian ,  David James Lesslie

发明人： Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Cagglano ,  Kanakasabapathi Subramanian ,  David James Lesslie

IPC分类号： F21V7/04 ,  H02H5/04 ,  H02H7/08

CPC分类号： H02H7/0855 ,  H01H9/541 ,  H01H59/0009 ,  H01H2071/008 ,  H02P1/16 ,  H02P29/02

摘要： A motor starter is disclosed. The motor starter includes control circuitry integrally arranged with at least one current path and a processor included in the control circuitry. The motor starter further includes at least one processor algorithm residing on the processor, the at least one processor algorithm containing instructions to monitor characteristics of current on the at least one current path and to provide data pertaining to a condition of the at least one current path. The motor starter further includes a micro electromechanical system (MEMS) switch disposed on the at least one current path, the MEMS switch responsive to the control circuitry to facilitate the control of an electrical current, passing through the at least one current path.

摘要翻译： 公开了一种电动机起动器。 电动机启动器包括与至少一个电流路径一体地布置的控制电路和包括在控制电路中的处理器。 电动机启动器还包括驻留在处理器上的至少一个处理器算法，所述至少一个处理器算法包含用于监视至少一个当前路径上的电流的特性的指令，以及提供与至少一个当前路径的条件有关的数据 。 电动机启动器还包括设置在至少一个电流路径上的微机电系统（MEMS）开关，所述MEMS开关响应于控制电路以便于通过至少一个电流路径的电流的控制。

公开(公告)号：US07527742B2

公开(公告)日：2009-05-05

申请号：US11167719

申请日：2005-06-27

申请人： Steven Alfred Tysoe ,  Steven Francis LeBoeuf ,  Mark Philip D'Evelyn ,  Venkat Subramaniam Venkataramani ,  Vinayak Tilak ,  Jeffrey Bernard Fortin ,  Charles Adrian Becker ,  Stephen Daley Arthur ,  Samhita Dasgupta ,  Kanakasabapathi Subramanian ,  Robert John Wojnarowski ,  Abasifreke Udo Ebong

发明人： Steven Alfred Tysoe ,  Steven Francis LeBoeuf ,  Mark Philip D'Evelyn ,  Venkat Subramaniam Venkataramani ,  Vinayak Tilak ,  Jeffrey Bernard Fortin ,  Charles Adrian Becker ,  Stephen Daley Arthur ,  Samhita Dasgupta ,  Kanakasabapathi Subramanian ,  Robert John Wojnarowski ,  Abasifreke Udo Ebong

IPC分类号： C03C15/00 ,  C03C25/68

CPC分类号： H01L21/31111

摘要： An etchant including a halogenated salt, such as Cryolite (Na3AlF6) or potassium tetrafluoro borate (KBF4), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (Na3AlF6), potassium tetrafluoro borate (KBF4), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

摘要翻译： 提供包括卤化盐的蚀刻剂，例如冰晶石（Na 3 AlF 6）或四氟硼酸钾（KBF 4）。 盐可以以足以蚀刻基材的量存在于蚀刻剂中，并且可以具有大于约200摄氏度的熔体温度。 湿蚀刻的方法可以包括使蚀刻剂与多层层压体的支撑层的至少一个表面接触，其中所述支撑层可以包括氧化铝; 或使蚀刻剂与多层层压体的支撑层的至少一个表面接触，其中所述蚀刻剂可以包括冰晶石（Na 3 AlF 6），四氟硼酸钾（KBF 4）或两者; 并蚀刻所述支撑层的至少一部分。 该方法可以提供通过将结晶生长到氧化铝载体层上并通过湿蚀刻化学去除至少一部分载体层而制备的层压体。 提供了包括层压板的电子设备，光学设备或组合设备。

公开(公告)号：US07473859B2

公开(公告)日：2009-01-06

申请号：US11622483

申请日：2007-01-12

申请人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Christopher Keimel ,  Long Que ,  Kuna Venkat Satya Rama Kishore ,  Abhijeet Dinkar Sathe ,  Xuefeng Wang ,  Edward Keith Howell

发明人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Christopher Keimel ,  Long Que ,  Kuna Venkat Satya Rama Kishore ,  Abhijeet Dinkar Sathe ,  Xuefeng Wang ,  Edward Keith Howell

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H47/22 ,  Y10T307/937

摘要： A gating voltage control system and method are provided for electrostatically actuating a micro-electromechanical systems (MEMS) device, e.g., a MEMS switch. The device may comprise an electrostatically responsive actuator movable through a gap for actuating the device to a respective actuating condition corresponding to one of a first actuating condition (e.g., a closed switching condition) and a second actuating condition (e.g., an open switching condition). The gating voltage control system may comprise a drive circuit electrically coupled to a gate terminal of the device to apply a gating voltage. The gating voltage control system may further comprise a controller electrically coupled to the drive circuit to control the gating voltage applied to the gating terminal in accordance with a gating voltage control sequence. The gating voltage control sequence may comprise a first interval for ramping up the gating voltage to a voltage level for producing an electrostatic force sufficient to accelerate the actuator through a portion of the gap to be traversed by the actuator to reach a respective actuating condition. The gating voltage control sequence may further comprise a second interval for ramping down the gating voltage to a level sufficient to reduce the electrostatic force acting on the movable actuator. This allows reducing the amount of force at which the actuator engages a contact for establishing the first actuating condition, or avoiding an overshoot position of the actuator while reaching the second actuating condition.

摘要翻译： 提供了门控电压控制系统和方法，用于静电致动微机电系统（MEMS）装置，例如MEMS开关。 该装置可以包括静电响应致动器，其可通过间隙移动，以将装置致动到对应于第一致动状态（例如，闭合开关状态）和第二致动状态（例如，开启状态）之一的相应致动状态， 。 门控电压控制系统可以包括电耦合到该器件的栅极端子以施加选通电压的驱动电路。 门控电压控制系统还可以包括电耦合到驱动电路的控制器，以根据门控电压控制顺序控制施加到门控端子的门控电压。 门控电压控制序列可以包括用于将门控电压升高到电压电平的第一间隔，用于产生足以通过由致动器穿过的间隙的一部分来加速致动器以达到相应的致动状态的静电力。 门控电压控制序列还可以包括用于将门控电压降低到足以减小作用在可移动致动器上的静电力的水平的第二间隔。 这允许减小致动器接合接触件以建立第一致动条件的力的量，或者避免致动器在达到第二致动状态时的过冲位置。

公开(公告)号：US20080310062A1

公开(公告)日：2008-12-18

申请号：US11763672

申请日：2007-06-15

申请人： Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Caggiano ,  Kanakasabapathi Subramanian ,  Charles Stephan Pitzen

发明人： Brent Charles Kumfer ,  William James Premerlani ,  Robert Joseph Caggiano ,  Kanakasabapathi Subramanian ,  Charles Stephan Pitzen

IPC分类号： H02H7/00

CPC分类号： H01H59/0009 ,  H01H9/541 ,  H01H47/002 ,  H01H71/1081 ,  H01H2071/008

摘要： Electrical distribution systems implementing micro-electromechanical system based switching devices. Exemplary embodiments include a method in an electrical distribution system, the method including determining if there is a fault condition in a branch of the electrical distribution system, the branch having a plurality of micro electromechanical system (MEMS) switches, re-closing a MEMS switch of the plurality of MEMS switches, which is furthest upstream in the branch and determining if the fault condition is still present. Exemplary embodiments include an electrical distribution system, including an input port for receiving a source of power, a main distribution bus electrically coupled to the input port, a service disconnect MEMS switch disposed between and coupled to the input port and the main distribution bus and a plurality of electrical distribution branches electrically coupled to the main distribution bus.

摘要翻译： 实现基于微机电系统的开关装置的配电系统。 示例性实施例包括在配电系统中的方法，所述方法包括确定在配电系统的分支中是否存在故障状况，所述分支具有多个微机电系统（MEMS）开关，重新闭合MEMS开关 在分支中最上游的多个MEMS开关中，确定故障状况是否仍然存在。 示例性实施例包括配电系统，包括用于接收电力源的输入端口，电耦合到输入端口的主配电总线，设置在输入端口和主配电总线之间并耦合到输入端口和主配电总线的服务断开MEMS开关 多个配电支路电耦合到主配电总线。

公开(公告)号：US20080190748A1

公开(公告)日：2008-08-14

申请号：US11674189

申请日：2007-02-13

申请人： Stephen Daley Arthur ,  Ahmed Elasser ,  Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Arun Virupaksha Gowda

发明人： Stephen Daley Arthur ,  Ahmed Elasser ,  Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  Christopher Fred Keimel ,  Arun Virupaksha Gowda

IPC分类号： H01H57/00 ,  H01H11/00

CPC分类号： H01H59/0009 ,  H01H9/52 ,  H01L24/24 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49105 ,  H01L2924/00

摘要： One embodiment of the invention comprises a MEMS structure further comprising: a MEMS device (240) having a first surface with one or more contact structures (244, 245 and 246) thereon connected to functional elements of the MEMS device (240), a dielectric layer (100) overlying the first surface defining openings therein through which the contact structures (244, 245 and 246) are exposed, a patterned metallization layer (254, 255 and 256) comprising conductive material extending from the contact structures (244, 245 and 246) through the openings in the dielectric layer (100) and onto a surface of the dielectric layer and a first heat sink (190) in thermal communication with the metallization layer (254, 255 and 256).

摘要翻译： 本发明的一个实施例包括一种MEMS结构，其进一步包括：MEMS器件（240），其具有其上连接到所述MEMS器件（240）的功能元件的一个或多个接触结构（244,245和246）的第一表面， 覆盖所述第一表面的层（100），所述第一表面限定其中所述接触结构（244,245和246）暴露于其中的开口;图案化金属化层（254,255和256），包括从所述接触结构（244,245和255）延伸的导电材料 246）通过介电层（100）中的开口并延伸到电介质层的表面上，以及与金属化层（254,255和256）热连通的第一散热器（190）。

公开(公告)号：US20080137238A1

公开(公告)日：2008-06-12

申请号：US11567296

申请日：2006-12-06

申请人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Edward Keith Howell

发明人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Edward Keith Howell

IPC分类号： H02H3/10 ,  H02H3/08

CPC分类号： H01H9/541 ,  H01H59/0009 ,  H01H2071/008

摘要： A switching system is provided. The switching system includes electromechanical switching circuitry, such as a micro-electromechanical system switching circuitry. The system may further include solid state switching circuitry coupled in a parallel circuit with the electromechanical switching circuitry, and a controller coupled to the electromechanical switching circuitry and the solid state switching circuitry. The controller may be configured to perform selective switching of a load current between the electromechanical switching circuitry and the solid state switching circuitry in response to a load current condition appropriate to an operational capability of a respective one of the switching circuitries.

摘要翻译： 提供一种切换系统。 开关系统包括机电开关电路，例如微机电系统开关电路。 该系统还可以包括与机电开关电路并联的固态开关电路，以及耦合到机电开关电路和固态开关电路的控制器。 控制器可以被配置为响应于适合于相应一个开关电路的操作能力的负载电流条件来执行机电开关电路和固态开关电路之间的负载电流的选择性切换。

公开(公告)号：US07332835B1

公开(公告)日：2008-02-19

申请号：US11563774

申请日：2006-11-28

申请人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Kuna Venkat Satya Rama Kishore

发明人： Joshua Isaac Wright ,  Kanakasabapathi Subramanian ,  William James Premerlani ,  John Norton Park ,  Kuna Venkat Satya Rama Kishore

IPC分类号： H01H57/00 ,  H01H47/02

CPC分类号： H01H1/0036 ,  H01H59/0009 ,  H01H2071/008 ,  Y10T307/685 ,  Y10T307/911

摘要： MEMS-based switching module, as may be electrically connected to other such modules in a series circuit, to achieve a desired voltage rating is provided. A switching array may be made up of a plurality of such switching modules (e.g., used as building blocks of the switching array) with circuitry configured so that any number of modules can be connected in series to achieve the desired voltage rating (e.g., voltage scalability).

摘要翻译： 提供了可以电连接到串联电路中的其它这样的模块的基于MEMS的开关模块以实现期望的额定电压。 开关阵列可以由多个这样的开关模块（例如，用作开关阵列的构建块）组成，其电路被配置为使得任何数量的模块可以串联连接以实现期望的电压额定值（例如，电压 可扩展性）。

公开(公告)号：US07101789B2

公开(公告)日：2006-09-05

申请号：US10938247

申请日：2004-09-13

申请人： Kanakasabapathi Subramanian ,  Jeffrey Bernard Fortin ,  Wei-Cheng Tian

发明人： Kanakasabapathi Subramanian ,  Jeffrey Bernard Fortin ,  Wei-Cheng Tian

IPC分类号： H01L21/44

CPC分类号： H01L21/30617 ,  H01L21/76898 ,  H01L23/481 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming smooth walled, prismatically-profiled through-wafer vias and articles formed through the method. An etch stop material is provided on a wafer, which may be a silicon wafer. A mask material is provided on the etch stop material and patterned in such a way as to lead to the formation of vias that have at least one pair of opposing side walls that run parallel to a plane in the wafer. A wet etchant, such as potassium hydroxide, is used to etch vias in the wafer. The use of a wet etchant leads to the formation of smooth side walls. This method allows an aspect ratio of height versus width of the vias of greater than 75 to 1.

公开(公告)号：US07022617B2

公开(公告)日：2006-04-04

申请号：US10606812

申请日：2003-06-26

申请人： Kanakasabapathi Subramanian ,  Noel C. MacDonald

发明人： Kanakasabapathi Subramanian ,  Noel C. MacDonald

IPC分类号： H01L21/461

CPC分类号： B81C1/00142 ,  B81B2203/0361 ,  B81C1/00071 ,  B81C1/00111 ,  B81C2201/0112 ,  Y10S977/70 ,  Y10S977/762

摘要： A process cycles between etching and passivating chemistries to create rough sidewalls that are converted into small structures. In one embodiment, a mask is used to define lines in a single crystal silicon wafer. The process creates ripples on sidewalls of the lines corresponding to the cycles. The lines are oxidized in one embodiment to form a silicon wire corresponding to each ripple. The oxide is removed in a further embodiment to form structures ranging from micro sharp tips to photonic arrays of wires. Fluidic channels are formed by oxidizing adjacent rippled sidewalls. The same mask is also used to form other structures for MEMS devices.

摘要翻译： 蚀刻和钝化化学物质之间的过程循环，以产生转变成小结构的粗糙侧壁。 在一个实施例中，使用掩模来限定单晶硅晶片中的线。 该过程在对应于循环的线的侧壁上产生波纹。 在一个实施例中，线被氧化以形成对应于每个纹波的硅线。 在另一个实施方案中去除氧化物以形成从微尖端到光线阵列的结构。 通过氧化相邻的波纹侧壁形成流体通道。 同样的掩模也用于形成MEMS器件的其他结构。

公开(公告)号：US07915696B2

公开(公告)日：2011-03-29

申请号：US11877786

申请日：2007-10-24

申请人： David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

发明人： David Cecil Hays ,  Marco Francesco Aimi ,  Christopher Fred Keimel ,  Glenn Scott Claydon ,  Kanakasabapathi Subramanian ,  Oliver Charles Boomhower

IPC分类号： H01L29/82

CPC分类号： B81B7/007 ,  B81B2207/07 ,  B81B2207/096 ,  H01H1/0036

摘要： An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.

摘要翻译： 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。