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公开(公告)号:US08569125B2
公开(公告)日:2013-10-29
申请号:US13307931
申请日:2011-11-30
申请人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Soon-Cheon Seo , Tenko Yamashita
发明人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Soon-Cheon Seo , Tenko Yamashita
IPC分类号: H01L21/336
CPC分类号: H01L29/6681 , H01L29/785
摘要: A FinFET with improved gate planarity and method of fabrication is disclosed. The gate is disposed on a pattern of fins prior to removing any unwanted fins. Lithographic techniques or etching techniques or a combination of both may be used to remove the unwanted fins. All or some of the remaining fins may be merged.
摘要翻译: 公开了一种具有改善的栅极平面度和制造方法的FinFET。 在移除任何不需要的翅片之前,门被设置在翅片图案上。 可以使用平版印刷技术或蚀刻技术或两者的组合来去除不需要的鳍片。 所有或一些剩余的翅片可能被合并。
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公开(公告)号:US20130134513A1
公开(公告)日:2013-05-30
申请号:US13307931
申请日:2011-11-30
申请人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Soon-Cheon Seo , Tenko Yamashita
发明人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Soon-Cheon Seo , Tenko Yamashita
IPC分类号: H01L27/12 , H01L21/336
CPC分类号: H01L29/6681 , H01L29/785
摘要: A FinFET with improved gate planarity and method of fabrication is disclosed. The gate is disposed on a pattern of fins prior to removing any unwanted fins. Lithographic techniques or etching techniques or a combination of both may be used to remove the unwanted fins. All or some of the remaining fins may be merged.
摘要翻译: 公开了一种具有改善的栅极平面度和制造方法的FinFET。 在移除任何不需要的翅片之前,门被设置在翅片图案上。 可以使用平版印刷技术或蚀刻技术或两者的组合来去除不需要的鳍片。 所有或一些剩余的翅片可能被合并。
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43.
公开(公告)号:US08987070B2
公开(公告)日:2015-03-24
申请号:US13611182
申请日:2012-09-12
IPC分类号: H01L21/00 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/06 , H01L29/66 , H01L29/786
CPC分类号: H01L27/1203 , H01L21/31144 , H01L21/76283 , H01L21/84 , H01L29/06 , H01L29/66772 , H01L29/78654
摘要: A semiconductor substrate having an isolation region and method of forming the same. The method includes the steps of providing a substrate having a substrate layer, a buried oxide (BOX), a silicon on insulator (SOI) layer, a pad oxide layer, and a pad nitride layer, forming a shallow trench region, etching the pad oxide layer to form ears and etching the BOX layer to form undercuts, depositing a liner on the shallow trench region, depositing a soft mask over the surface of the shallow trench region, filling the shallow trench region, etching the soft mask so that it is recessed to the top of the BOX layer, etching the liner off certain regions, removing the soft mask, and filling and polishing the shallow trench region. The liner prevents shorting of the semiconductor device when the contacts are misaligned.
摘要翻译: 具有隔离区域的半导体基板及其形成方法。 该方法包括以下步骤:提供具有衬底层,掩埋氧化物(BOX),绝缘体上硅(SOI)层,衬垫氧化物层和衬垫氮化物层的衬底,形成浅沟槽区,蚀刻衬垫 氧化层以形成耳朵并蚀刻BOX层以形成底切,在浅沟槽区域上沉积衬垫,在浅沟槽区域的表面上沉积软掩模,填充浅沟槽区域,蚀刻软掩模,使得它 凹陷到BOX层的顶部,在某些区域蚀刻衬垫,去除软掩模,以及填充和抛光浅沟槽区域。 当触点不对准时,衬垫防止半导体器件的短路。
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公开(公告)号:US08889564B2
公开(公告)日:2014-11-18
申请号:US13600324
申请日:2012-08-31
IPC分类号: H01L21/302 , H01L21/461
CPC分类号: H01L29/775 , B82Y10/00 , B82Y40/00 , B82Y99/00 , H01L21/02532 , H01L21/0262 , H01L21/02639 , H01L21/3086 , H01L29/0669 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66742 , H01L29/78696 , Y10S977/938
摘要: A mandrel having vertical planar surfaces is formed on a single crystalline semiconductor layer. An epitaxial semiconductor layer is formed on the single crystalline semiconductor layer by selective epitaxy. A first spacer is formed around an upper portion of the mandrel. The epitaxial semiconductor layer is vertically recessed employing the first spacers as an etch mask. A second spacer is formed on sidewalls of the first spacer and vertical portions of the epitaxial semiconductor layer. Horizontal bottom portions of the epitaxial semiconductor layer are etched from underneath the vertical portions of the epitaxial semiconductor layer to form a suspended ring-shaped semiconductor fin that is attached to the mandrel. A center portion of the mandrel is etched employing a patterned mask layer that covers two end portions of the mandrel. A suspended semiconductor fin is provided, which is suspended by a pair of support structures.
摘要翻译: 具有垂直平面的心轴形成在单晶半导体层上。 通过选择性外延在单晶半导体层上形成外延半导体层。 围绕心轴的上部形成第一间隔件。 使用第一间隔物作为蚀刻掩模,外延半导体层垂直凹入。 在第一间隔物的侧壁和外延半导体层的垂直部分上形成第二间隔物。 从外延半导体层的垂直部分的下方蚀刻外延半导体层的水平底部部分,以形成附接到心轴的悬挂的环形半导体鳍片。 使用覆盖心轴的两个端部的图案化掩模层来蚀刻心轴的中心部分。 提供悬挂的半导体鳍片,其由一对支撑结构悬挂。
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公开(公告)号:US20140061794A1
公开(公告)日:2014-03-06
申请号:US13598080
申请日:2012-08-29
申请人: Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Theodorus E. Standaert , Tenko Yamashita
发明人: Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Theodorus E. Standaert , Tenko Yamashita
CPC分类号: H01L29/7851 , H01L29/0653 , H01L29/1083 , H01L29/161 , H01L29/165 , H01L29/66803 , H01L29/7848 , H01L29/7849
摘要: A finFET with self-aligned punchthrough stopper and methods of manufacture are disclosed. The method includes forming spacers on sidewalls of a gate structure and fin structures of a finFET device. The method further includes forming a punchthrough stopper on exposed sidewalls of the fin structures, below the spacers. The method further includes diffusing dopants from the punchthrough stopper into the fin structures. The method further includes forming source and drain regions adjacent to the gate structure and fin structures.
摘要翻译: 公开了具有自对准穿通塞子的finFET和制造方法。 该方法包括在栅极结构的侧壁和finFET器件的翅片结构上形成间隔物。 该方法还包括在隔片的下方在翅片结构的暴露的侧壁上形成穿通止动件。 该方法还包括将穿透止动器的掺杂剂扩散到鳍结构中。 该方法还包括形成与栅极结构和鳍结构相邻的源区和漏区。
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公开(公告)号:US08592263B2
公开(公告)日:2013-11-26
申请号:US13456921
申请日:2012-04-26
申请人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Tenko Yamashita
发明人: Theodorus Eduardus Standaert , Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Tenko Yamashita
IPC分类号: H01L21/84
CPC分类号: H01L29/861 , H01L21/845 , H01L27/0266 , H01L29/24 , H01L29/267 , H01L29/6609 , H01L29/785
摘要: A FinFET diode and method of fabrication are disclosed. In one embodiment, the diode comprises, a semiconductor substrate, an insulator layer disposed on the semiconductor substrate, a first silicon layer disposed on the insulator layer, a plurality of fins formed in a diode portion of the first silicon layer. A region of the first silicon layer is disposed adjacent to each of the plurality of fins. A second silicon layer is disposed on the plurality of fins formed in the diode portion of the first silicon layer. A gate ring is disposed on the first silicon layer. The gate ring is arranged in a closed shape, and encloses a portion of the plurality of fins formed in the diode portion of the first silicon layer.
摘要翻译: 公开了一种FinFET二极管及其制造方法。 在一个实施例中,二极管包括半导体衬底,设置在半导体衬底上的绝缘体层,设置在绝缘体层上的第一硅层,形成在第一硅层的二极管部分中的多个鳍片。 第一硅层的区域设置成与多个翅片中的每一个相邻。 第二硅层设置在形成在第一硅层的二极管部分中的多个翅片上。 栅极环设置在第一硅层上。 门环布置成闭合形状,并且包围形成在第一硅层的二极管部分中的多个翅片的一部分。
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公开(公告)号:US08703553B2
公开(公告)日:2014-04-22
申请号:US13471955
申请日:2012-05-15
申请人: Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Theodorus E. Standaert , Tenko Yamashita
发明人: Kangguo Cheng , Balasubramanian S. Haran , Shom Ponoth , Theodorus E. Standaert , Tenko Yamashita
IPC分类号: H01L21/8234 , H01L27/12
CPC分类号: H01L27/1288 , H01L21/823431 , H01L21/84 , H01L27/0629 , H01L27/1211 , H01L28/90
摘要: Methods for capacitor fabrication include doping a capacitor region of a semiconductor layer in a semiconductor-on-insulator substrate; partially etching the semiconductor layer to produce a first terminal layer comprising doped semiconductor fins on a remaining base of doped semiconductor; forming a dielectric layer over the first terminal layer; and forming a second terminal layer over the dielectric layer in a finFET process.
摘要翻译: 用于电容器制造的方法包括在绝缘体上半导体衬底中掺杂半导体层的电容器区域; 部分地蚀刻半导体层以产生在掺杂半导体的剩余基底上包括掺杂半导体鳍片的第一端子层; 在所述第一端子层上形成介电层; 以及在finFET工艺中在所述介电层上形成第二端子层。
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公开(公告)号:US20140061582A1
公开(公告)日:2014-03-06
申请号:US13600324
申请日:2012-08-31
CPC分类号: H01L29/775 , B82Y10/00 , B82Y40/00 , B82Y99/00 , H01L21/02532 , H01L21/0262 , H01L21/02639 , H01L21/3086 , H01L29/0669 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66742 , H01L29/78696 , Y10S977/938
摘要: A mandrel having vertical planar surfaces is formed on a single crystalline semiconductor layer. An epitaxial semiconductor layer is formed on the single crystalline semiconductor layer by selective epitaxy. A first spacer is formed around an upper portion of the mandrel. The epitaxial semiconductor layer is vertically recessed employing the first spacers as an etch mask. A second spacer is formed on sidewalls of the first spacer and vertical portions of the epitaxial semiconductor layer. Horizontal bottom portions of the epitaxial semiconductor layer are etched from underneath the vertical portions of the epitaxial semiconductor layer to form a suspended ring-shaped semiconductor fin that is attached to the mandrel. A center portion of the mandrel is etched employing a patterned mask layer that covers two end portions of the mandrel. A suspended semiconductor fin is provided, which is suspended by a pair of support structures.
摘要翻译: 具有垂直平面的心轴形成在单晶半导体层上。 通过选择性外延在单晶半导体层上形成外延半导体层。 围绕心轴的上部形成第一间隔件。 使用第一间隔物作为蚀刻掩模,外延半导体层垂直凹入。 在第一间隔物的侧壁和外延半导体层的垂直部分上形成第二间隔物。 从外延半导体层的垂直部分的下方蚀刻外延半导体层的水平底部部分,以形成附接到心轴的悬挂的环形半导体鳍片。 使用覆盖心轴的两个端部的图案化掩模层来蚀刻心轴的中心部分。 提供悬挂的半导体鳍片,其由一对支撑结构悬挂。
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公开(公告)号:US20130319613A1
公开(公告)日:2013-12-05
申请号:US13545456
申请日:2012-07-10
申请人: Veeraraghavan S. Basker , Huiming Bu , Kangguo Cheng , Balasubramanian S. Haran , Nicolas Loubet , Shom Ponoth , Stefan Schmitz , Theodorus E. Standaert , Tenko Yamashita
发明人: Veeraraghavan S. Basker , Huiming Bu , Kangguo Cheng , Balasubramanian S. Haran , Nicolas Loubet , Shom Ponoth , Stefan Schmitz , Theodorus E. Standaert , Tenko Yamashita
IPC分类号: H01L21/308
CPC分类号: H01L29/66795 , H01L21/823821 , H01L21/845 , H01L27/0924 , H01L27/1211 , H01L29/6681
摘要: A method for making dual-epi FinFETs is described. The method includes adding a first epitaxial material to an array of fins. The method also includes covering at least a first portion of the array of fins using a first masking material and removing the first epitaxial material from an uncovered portion of the array of fins. Adding a second epitaxial material to the fins in the uncovered portion of the array of fins is included in the method. The method also includes covering a second portion of the array of fins using a second masking material and performing a directional etch using the first masking material and the second masking material. Apparatus and computer program products are also described.
摘要翻译: 描述了制造双外延FinFET的方法。 该方法包括将第一外延材料添加到翅片阵列。 该方法还包括使用第一掩蔽材料覆盖翅片阵列的至少第一部分并且从翅片阵列的未覆盖部分移除第一外延材料。 在散热片阵列的未覆盖部分中的翅片上添加第二外延材料包括在该方法中。 该方法还包括使用第二掩模材料覆盖翅片阵列的第二部分,并使用第一掩模材料和第二掩模材料执行定向蚀刻。 还描述了装置和计算机程序产品。
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公开(公告)号:US08592290B1
公开(公告)日:2013-11-26
申请号:US13545456
申请日:2012-07-10
申请人: Veeraraghavan S. Basker , Huiming Bu , Kangguo Cheng , Balasubramanian S. Haran , Nicolas Loubet , Shom Ponoth , Stefan Schmitz , Theodorus E. Standaert , Tenko Yamashita
发明人: Veeraraghavan S. Basker , Huiming Bu , Kangguo Cheng , Balasubramanian S. Haran , Nicolas Loubet , Shom Ponoth , Stefan Schmitz , Theodorus E. Standaert , Tenko Yamashita
IPC分类号: H01L21/20
CPC分类号: H01L29/66795 , H01L21/823821 , H01L21/845 , H01L27/0924 , H01L27/1211 , H01L29/6681
摘要: A method for making dual-epi FinFETs is described. The method includes adding a first epitaxial material to an array of fins. The method also includes covering at least a first portion of the array of fins using a first masking material and removing the first epitaxial material from an uncovered portion of the array of fins. Adding a second epitaxial material to the fins in the uncovered portion of the array of fins is included in the method. The method also includes covering a second portion of the array of fins using a second masking material and performing a directional etch using the first masking material and the second masking material. Apparatus and computer program products are also described.
摘要翻译: 描述了制造双外延FinFET的方法。 该方法包括将第一外延材料添加到翅片阵列。 该方法还包括使用第一掩蔽材料覆盖翅片阵列的至少第一部分并且从翅片阵列的未覆盖部分移除第一外延材料。 在散热片阵列的未覆盖部分中的翅片上添加第二外延材料包括在该方法中。 该方法还包括使用第二掩模材料覆盖翅片阵列的第二部分,并使用第一掩模材料和第二掩模材料执行定向蚀刻。 还描述了装置和计算机程序产品。
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