Abstract:
A plated magnetic thin film of high saturation magnetization and low coercivity having the general form Co100-a-bFeaMb, where M can be Mo, Cr, W, Ni or Rh, which is suitable for use in magnetic recording heads that write on narrow trackwidth, high coercivity media. The plating method that produces the alloy includes four current application processes: direct current, pulsed current, pulse reversed current and conditioned pulse reversed current.
Abstract:
Apparatus and method for generating a variable-frequency clock is disclosed. A control state machine defines various commands and generates corresponding control signals. A variable-frequency clock generator then outputs the variable-frequency clock that has a specific pattern corresponding with the respective command, where the variable-frequency clock is constructed with a first clock and a second clock having a frequency different from the first clock. A control signals generator accordingly outputs the control signals that are also constructed with the first clock and the second clock.
Abstract:
A method for providing a variable frequency clock for a SDRAM. First, receiving a clock with a fixed frequency and a plurality of signals, wherein each the signal is an interlace combination of a plurality of high level signals and a plurality of low levels signals. Second, extracting a plurality of proper positions from the signals, wherein each low level of each the signal corresponds to a proper position. Third, amending the frequency of the clock such that each the proper position corresponds to a rising edge of the clock.
Abstract:
A method for manufacturing the lower electrode of a DRAM capacitor. The method includes depositing polysilicon instead of amorphous silicon to form the lower electrode. Because polysilicon has a higher depositing temperature, it has a higher depositing rate capable of shortening depositing time. After forming the polysilicon lower electrode, the upper portion of the polysilicon layer is transformed into an amorphous layer by bombarding the polysilicon layer with ions to damage its internal structure. Eventually, hemispherical grain silicon is able to grow over the lower electrode, thereby increasing its surface area.
Abstract:
A process of fabricating a bottom electrode for the storage capacitors of DRAM is disclosed. The process includes first forming an insulation layer on the surface of the device substrate, with the insulation layer patterned to form a contact opening that exposes a source/drain region of the memory cell transistor. A first conductive layer then covers the insulation layer and fills into the contact opening, with the first conductive layer contacting the exposed source/drain region. A native oxide layer is then formed on the surface of the first conductive layer. A second electrically conductive layer is then formed and patterned to form a recess substantially above the location of the contact opening in the insulation layer. A layer of HSG—Si then covers the surface of the second conductive layer and the surface of the recess, and the HSG—Si layer and the second conductive layer are patterned to form the bottom electrode of the capacitor. The recess and its covering HSG—Si layer increase the effective surface area of the bottom electrode of the capacitor.
Abstract:
The shutter construction of a tympanic thermometer comprises a base formed with a horizontal groove and a vertical slot that communicate with each other, wherein said horizontal groove is for mounting a wave guiding duct; a supporting frame formed at the rear end of said base and formed with at least a first engaging portion and at least a second engaging portion; a shutter plate mounted in said vertical slot for closing said wave guiding duct; a linking element, the fore end of the linking element being coupled to the lower portion of said shutter plate and the rear end of the linking element being engaged with said first engaging portion of said supporting frame so that the fore end of the linking element can be swayed up and down relative to the rear end thereof; a spring element, the fore end of the spring element being coupled to said linking element; and an actuating element, the fore end of the actuating element being engaged with said second engaging portion of said supporting frame and the rear end of the supporting frame being coupled to the rear end of said spring element so that the rear end of said actuating element can be swayed up and down relative to the fore end of said actuating element, thereby said linking element can be moved down by said spring element when said actuating element is pressed down.
Abstract:
A method of fabricating a node contact window. A substrate having devices and a first dielectric layer is provided. Bit lines having spacer are formed on the first dielectric layer and a second is formed on the first dielectric layer. A hard material layer is then formed on the second dielectric layer. An opening is formed within the second dielectric layer to expose the spacer and the first dielectric layer. A polysilicon spacer is then formed on the sidewalls of the opening. A node contact window is formed by etching through the first dielectric layer to expose the substrate.
Abstract:
This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
Abstract:
Nanowire-based mechanical switching devices are described. For example, a nanowire relay includes a nanowire disposed in a void disposed above a substrate. The nanowire has an anchored portion and a suspended portion. A first gate electrode is disposed adjacent the void, and is spaced apart from the nanowire. A first conductive region is disposed adjacent the first gate electrode and adjacent the void, and is spaced apart from the nanowire.