摘要:
Circuit designs and methods are provided for matching device characteristics for, e.g., analog or mixed-signal semiconductor integrated circuit designs. In particular, circuit layout patterns and layout methods are provided which enable precise or proportional matching of circuit components by uniformly distributing circuit components in a manner that eliminates or significantly minimizes the sensitivity of such circuit components to environmental effects and process variations, thereby improving the performance of analog and mixed-signal circuits.
摘要:
An N-channel metal oxide semiconductor (NMOS) driver circuit (and method for making the same), includes a boost gate stack formed on a substrate and having a source and drain formed by a low concentration implantation, and an N-driver coupled to the boost gate stack.
摘要:
An electronic structure that has in-situ formed unit resistors and a method for fabricating such structure are disclosed. The electronic structure that has in-situ formed unit resistors consists of a first plurality of conductive elements formed in an insulating material layer, a plurality of electrically resistive vias formed on top and in electrical communication with at least one of the first plurality of conductive elements, and a second plurality of conductive elements formed on top of and in electrical communication with at least one of the plurality of electrically resistive vias. The present invention novel structure may further be formed in a multi-level configuration such that multi-level resistors may be connected in-series to provide larger resistance values. The present invention novel structure may further be combined with a capacitor network to form desirable RC circuits.
摘要:
In a high density dynamic memory circuit, the sense amplifiers are shared by several bitlines in order to maintain a high density and low power design. However, the bitline equalization level drifts after several cycles of operation, caused by an unbalanced capacitance resulting from a size difference of n-FET and p-FET latches in the sense amplifiers. An extra compensating capacitance Ce is added to the NCS node to adjust the loading capacitance to eliminate the bitline drifting.
摘要:
A defect management engine (DME) for memories integrates a plurality of redundancy data cells and a plurality of redundancy address cells in the same array. The redundancy data cells are used for replacing defective cells in the memories. The redundancy address cells store the addresses of the defective cells. The memories are preferably sub-divided into a plurality of domains. A plurality of defective cells in each domain are supported by a plurality of repair units, each consisting of one or more redundancy data bits and redundancy address bits in the DME. When one or more data bits are read from a domain in the memory, the corresponding wordline in the DME simultaneously activates a plurality of repair units coupling to the wordline (self-contained domain selection). The redundancy data bits and the redundancy address bits are also read from the redundancy data cells and redundancy address cells, respectively. The DME logic detects whether or not the redundancy address bits match or do not match the address inputs of each repair unit (self contained redundancy match detection). This couples either redundancy data bits from the DME (i.e., a matching condition) or the data bits from the domain in the memories (i.e., a no match condition) to the corresponding DQ (self-contained redundancy replacement). The DME enables an integrated redundancy means (self-contained domain selection, self-contained redundancy match detection, and self-contained redundancy replacement). Single bit replacement, multi-bit replacement, line replacement, and variable bit size replacement are discussed. Finally, an extension of the DME concept to a memory system is also discussed.
摘要:
Improved packing density as well as improved performance and manufacturing yield is achieved in an electrically programmable memory by confining floating gate structures between isolation structures covered with a thin nitride layer. The confinement of the floating gate is achieved by planarization, preferably with a self-limiting chemical/mechanical polishing process, to the surface of the nitride layer covering the isolation structures. Gate oxide and control electrode connections can then be formed on a substantially planar surface without compromising the quality of the gate oxide or breakdown voltage the device must withstand for programming. Since severe topology is avoided over which these connections are formed, improved formation of low resistance connections, possibly including metal connections, are possible and allow scaling of transistors of the memory cells to be scaled to sizes not previously possible.
摘要:
An SOI transistor has a self-aligned body contact formed through an extension to the gate, thereby forming the body contact with minimal increase in area and also avoiding the need to tie the source to the body, as in prior art schemes that passed the body contact through the source. The body contact aperture is formed by raising the source and drain to define an initial aperture, depositing a conformal layer that is etched to create aperture-defining sidewalls and etching the contact aperture using these sidewalls to define sidewall support members that support insulating sidewalls to isolate the collection electrode from both the gate and from the source and drain.
摘要:
A method of forming a three-dimensional (3D) chip is provided in which a second chip is present embedded within a first chip. In one embodiment, the method includes forming a first chip including first electrical devices and forming a recess extending from a surface of the first chip. A second chip is formed having second electrical devices. The second chip is then encapsulated within the recess of the first chip. Interconnects are then formed through the first chip into electrical communication with at least one of the second devices on the second chip. A three-dimensional (3D) chip is also provided in which a second chip is embedded within a first chip.
摘要:
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
摘要:
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.