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公开(公告)号:US20190058303A1
公开(公告)日:2019-02-21
申请号:US16103905
申请日:2018-08-14
Applicant: Nichia Corporation
Inventor: Soichiro MIURA
Abstract: A light emitting device includes: one or more semiconductor laser elements, each configured to emit laser light; one or more light-reflecting parts, each having a light-reflecting surface configured to reflect the laser light emitted from a corresponding one of the one or more semiconductor laser elements; and a fluorescent part having a light-receiving surface configured to be irradiated with the laser light reflected at the light-reflecting surface of each of the one or more light-reflecting parts; wherein an irradiated region is formed on the light-reflecting surface when the light-reflecting surface is irradiated with the laser light, the irradiated region including a first end and a second end opposite the first end; and wherein the light-reflecting surface of each of the one or more light-reflecting parts is arranged such that a portion of the laser light reflected at at least a first end of the irradiated region and a portion of the laser light reflected at a location other than the first end of the irradiated region are overlapped with each other on the light-receiving surface.
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公开(公告)号:US20240363788A1
公开(公告)日:2024-10-31
申请号:US18769527
申请日:2024-07-11
Applicant: NICHIA CORPORATION
Inventor: Takuya HASHIMOTO , Soichiro MIURA
IPC: H01L31/12 , H01L27/15 , H01L31/0203 , H01L31/0216 , H01L31/0232
CPC classification number: H01L31/12 , H01L27/15 , H01L31/0203 , H01L31/02162 , H01L31/02327
Abstract: A package includes: a bottom portion having a mounting surface on which a light emitting element is arranged; and a lateral wall portion having a top surface and including: a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and a stepped portion formed along the lateral wall below the top surface. In the top view, the stepped portion includes a wide portion and a narrow portion that are two regions having different widths. The wide portion has a region on which a protecting element to protect the light emitting element is arranged and the narrow portion does not have the region on which the protecting element is arranged.
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公开(公告)号:US20240291229A1
公开(公告)日:2024-08-29
申请号:US18570536
申请日:2022-06-21
Applicant: NICHIA CORPORATION
Inventor: Soichiro MIURA
IPC: H01S5/02253 , H01S5/02257 , H01S5/023 , H01S5/042
CPC classification number: H01S5/02253 , H01S5/02257 , H01S5/023 , H01S5/042
Abstract: A light emitting device includes three or more light emitting elements, and a package that includes a base having a mounting face on which the three or more light emitting elements are disposed and a lateral wall part disposed around the light emitting elements and having a light transmitting incident face. The three or more light emitting elements include a first light emitting element that emits first light having an emission peak at a first wavelength along a first optical axis, a second light emitting element that emits second light having an emission peak at a second wavelength along a second optical axis, and a third light emitting element that emits third light having an emission peak at a third wavelength along a third optical axis. An angle formed by the first optical axis and the second optical axis in a top view is 3° to 45°. As the first light and the second light respectively travel along the first optical axis and the second optical axis, a first interval between the first optical axis and the second optical axis increases. The exiting first, second, and third lights are incident on the incident face.
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公开(公告)号:US20240178352A1
公开(公告)日:2024-05-30
申请号:US18519900
申请日:2023-11-27
Applicant: NICHIA CORPORATION
Inventor: Soichiro MIURA
CPC classification number: H01L33/507 , H01L33/483 , H01L33/502 , H01L33/58
Abstract: A light emitting device includes a base, a light emitting element, a wavelength conversion member, a lens member, and a frame part. The light emitting element is disposed on an upper surface of the base and configured to emit light. The wavelength conversion member is disposed on the upper surface of the base. The wavelength conversion member has an incident surface on which the light is to be incident, and a light emission surface through which the light is extracted out of the wavelength conversion member. The light emission surface is different from the incident surface. The lens member is bonded to the wavelength conversion member on a light emission surface side of the wavelength conversion member. The frame part is connected to the base and forms a sealed space in which the light emitting element, the wavelength conversion member, and the lens member are sealed.
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公开(公告)号:US20240113503A1
公开(公告)日:2024-04-04
申请号:US18472990
申请日:2023-09-22
Applicant: NICHIA CORPORATION
Inventor: Soichiro MIURA
CPC classification number: H01S5/0611 , H01S5/028 , H01S5/2018
Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion as in the specification. The wavelength conversion portion includes a light incident surface and a light-emitting surface as in the specification. The package includes a disposition region as in the specification. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. In a plan view perpendicular to the light-emitting surface, the light-emitting surface has a shape that has a first region as in the specification, and a region of at least 80% or more of the light incident surface overlaps an imaginary line that passes through a point of the light-emitting surface closest to the semiconductor laser element and that is parallel to the second direction.
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公开(公告)号:US20240113492A1
公开(公告)日:2024-04-04
申请号:US18473012
申请日:2023-09-22
Applicant: NICHIA CORPORATION
Inventor: Tadayuki KITAJIMA , Soichiro MIURA , Munetake FUKUNAGA , Yusuke MORI
IPC: H01S5/00
CPC classification number: H01S5/0087
Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.
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公开(公告)号:US20230387355A1
公开(公告)日:2023-11-30
申请号:US18323335
申请日:2023-05-24
Applicant: NICHIA CORPORATION
Inventor: Soichiro MIURA
CPC classification number: H01L33/483 , H01L33/505 , H01L33/60
Abstract: A light emitting device includes a package including a base member, a frame member having a plurality of inner lateral surfaces, and a cover, a light emitting element surrounded by the frame member and disposed on an upper surface of the base member, the light emitting element configured to emit directional light traveling in a lateral direction, and a light receiving body surrounded by the frame member and disposed on the upper surface of the base member in the lateral direction of the light emitting element to receive the light. The light receiving body has a first lateral surface facing the light emitting element and a second lateral surface opposite to the first lateral surface. The second lateral surface of the light receiving body faces a first opposing surface arranged adjacent to the second lateral surface with a space between the second lateral surface and the first opposing surface.
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公开(公告)号:US20230369824A1
公开(公告)日:2023-11-16
申请号:US18358019
申请日:2023-07-24
Applicant: NICHIA CORPORATION
Inventor: Masatoshi NAKAGAKI , Soichiro MIURA
IPC: H01S5/0239 , H01S5/40 , H01S5/02355 , H01S5/022 , H01S5/0233 , H01S5/02345
CPC classification number: H01S5/0239 , H01S5/40 , H01S5/02355 , H01S5/022 , H01S5/0233 , H01S5/4031 , H01S5/02345
Abstract: A light emitting device includes first and second semiconductor laser elements, first and second light-reflective members, and a basal part. The light emitted from the first semiconductor laser element irradiates a first light-reflective surface of the first light-reflective member at a first position. The light emitted from the second semiconductor laser element irradiates a second light-reflective surface of the second light-reflective member at a second position. A height of the first position is different from a height of the second position. With respect to a virtual axis extending along the prescribed direction, the first position and the second position have the same coordinates. A mounting position of the first light-reflective member and a mounting position of the second light-reflective member are different with respect to the prescribed direction.
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公开(公告)号:US20230359052A1
公开(公告)日:2023-11-09
申请号:US18246305
申请日:2021-08-25
Applicant: NICHIA CORPORATION
Inventor: Soichiro MIURA
IPC: G02B27/10
CPC classification number: G02B27/1006
Abstract: A light-emitting device includes: a first light-emitting element to emit first light having a first peak wavelength; a second light-emitting element to emit second light having a second peak wavelength; and an optical control unit to receive the first light and second light having non-parallel optical axes and emit the first light and second light such that the first light and second light have parallel optical axes. The optical control unit includes: one or two first optical members which create a first region to reflect the first light at a first optical path length, a second region to reflect the first light at a second optical path length which emitting longer than the first optical path length, and a third region to transmit the first light and reflect the second light; and a second optical member having a reflective surface to reflect the second light.
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公开(公告)号:US20230125799A1
公开(公告)日:2023-04-27
申请号:US18146070
申请日:2022-12-23
Applicant: NICHIA CORPORATION
Inventor: Shota MURAKAMI , Soichiro MIURA
Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.
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