摘要:
An image forming apparatus includes a molded frame 52 as a first structure fixed on a metal base plate 50 and a metal frame 54 as a second structure fixed on the metal base plate 50. The molded frame 52 is disposed in the metal frame 54 so that the molded frame 52 is not directly brought into contact with the metal frame 54. The mold frame 52 supports a plurality of parts which are related to an image forming portion and which are capable of being commonly used for operating the copying function, operating the printing function, and operating the facsimile-function. The metal frame 54 supports the other parts, such as a controlling device, reading device, an outer cover, and other parts. A rail member 60, which supports a sheet-supplying cassette so that the sheet-supplying cassette is freely moved in and out, is positioned with respect to the molded frame 52.
摘要:
An optical semiconductor module including a housing (54), an optical semiconductor assembly (56), a movable ferrule (84), and a sleeve (60). The housing (54) has a hole (80) into which a connector ferrule (76) is inserted. The optical semiconductor assembly (56) is accommodated in the housing (54). An optical fiber (74,82) having a first end (82a) and a second end (82b) is fixed in the movable ferrule (84). The movable ferrule (84) has a thin hole (84a) in which the second end (82b) of the optical fiber (82) is inserted and fixed. The first end (82a) of the optical fiber (82) is supported so as to be optically coupled to the optical semiconductor assembly (36). The sleeve (60) is accommodated in the hole (80) of the housing (54), so as to align the movable ferrule (84) and the connector ferrule (76) with each other. The movable ferrule (84) is biased so as to be pressed against the connector ferrule (76) in the sleeve (60). With this configuration, even if an optical connector is repeatedly mounted/demounted with respect to the optical semiconductor module, a high efficiency of optical coupling between the optical connector and the optical semiconductor assembly (56) can be stably maintained, thus providing an optical semiconductor module having a high reliability.
摘要:
Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.
摘要:
A helical scan type digital recording/reproducing apparatus arranged such that data corresponding to m fields/frames are divisionally recorded in n tracks on a magnetic tape and a slow, still or frame advance reproduction mode is effected in response to an instruction from an external input. The apparatus is equipped with a signal processing circuit coupled to a rotary head for inputting data reproduced from the magnetic tape by the rotary head to store the reproduced data in a memory. In response to the instruction for the slow, still or frame advance reproduction mode, the signal processing circuit outputs a control signal when the data corresponding to one or more frames/fields are stored in the memory. Also included is a servo circuit coupled through a signal line to the signal processing circuit to be responsive to the control signal from the signal processing circuit. The servo circuit controls a capstan motor in accordance with the control signal and the reproduction mode instruction.
摘要:
YMedical instruments, e.g., syringes, which can be sterilized by gamma irradiation and which are made of polyolefin resins (preferably a polypropylene polymer) which are resistant to gamma irradiation. The polyolefin is compounded with a specific hindered amine and a specific phenol or its phosphorous ester, each in an amount of from 0.01 to 1 part by weight per 100 parts of the polyolefin.
摘要:
A process and apparatus for the electrical discharge shaping of a workpiece to a shape corresponding to an electrode shape by sequentially applying an intermittent pulse voltage across the working gap between the workpiece and the electrode and wherein a pulse current having a special slant line waveform, e.g. a triangular waveform, which is different from a rectangular waveform is passed across the working gap from the initiation of discharge so as to minimize the electrode consumption ratio.
摘要:
A three-dimensional measurement apparatus selects points corresponding to geometric features of a three-dimensional shape model of a target object, projects a plurality of selected points corresponding to the geometric features onto a range image based on approximate values indicating the position and orientation of the target object and imaging parameters at the time of imaging of the range image, searches regions of predetermined ranges respectively from the plurality of projected points for geometric features on the range image which correspond to the geometric features of the three-dimensional shape model, and associates these geometric features with each other. The apparatus then calculates the position and orientation of the target object using differences of distances on a three-dimensional space between the geometric features of the three-dimensional shape model and those on the range image, which are associated with each other.
摘要:
The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.
摘要:
A coasting control device capable of avoiding coasting control during running on road having a small coefficient of friction between a tire and a road surface (“low μ roads”) includes a low μ road running recognition unit which recognizes that a vehicle is running on a low μ road and a unit for prohibiting coasting control during low μ road running when the low μ road running recognition unit recognizes that the vehicle is running on a low μ road.
摘要:
An image forming apparatus includes a plurality of image bearing members, each of which is configured to bear a portion of a pattern image including a plurality of reference images in a given form, an endless moving member facing the plurality of image bearing members and configured to receive the pattern image, an image detecting unit configured to detect the plurality of reference images, a rotational angle detecting unit configured to separately detect each image bearing member at a given rotational angle, and a controller configured to detect a speed deviation pattern for each revolution of each image bearing member. The controller is configured to detect the speed deviation pattern based on a result obtained from a phase component and a quadrature component of a frequency signal generated from the detection result obtained by the rotational angle detecting unit and a result of detecting the plurality of reference images in the pattern image transferred onto the endless moving member.