公开(公告)号：US20180299673A1

公开(公告)日：2018-10-18

申请号：US15945830

申请日：2018-04-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Uli Hiller ,  Stefan Morgott

IPC: G02B27/01 ,  G02B27/09 ,  G02B27/30

Abstract: An apparatus for presenting an image for a heads-up display includes three arrays of light-emitting diodes, wherein the light-emitting diodes of an array are arranged and output electromagnetic beams in an emission direction of an emission side of the array, the light-emitting diodes output an electromagnetic beam with a first opening angle in the emission direction, a collimation apparatus provided on the emission side at a specified spacing in front of the array of the light-emitting diodes, wherein the collimation apparatus reduces the first opening angles of the beams of the light-emitting diodes downstream of the collimation apparatus in the emission direction to a second opening angle, the second opening angle is smaller than the first opening angle, and a combination optical unit arranged downstream of the collimation apparatus in the emission direction, the combination optical unit superposes the electromagnetic rays from the three arrays to form an image for the head-up display.

公开(公告)号：US09985188B2

公开(公告)日：2018-05-29

申请号：US15510468

申请日：2015-09-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Ulrich Streppel

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/483 ,  H01L33/507 ,  H01L33/58 ,  H01L2933/0091

Abstract: An optoelectronic component includes a housing including a base section and a cover section that delimit an interior of the housing, wherein an optoelectronic semiconductor chip is arranged on the base section, the cover section is formed by an optical element, and a reflective element including openings is arranged between the optoelectronic semiconductor chip and an outer side of the optical element.

公开(公告)号：US20150207294A1

公开(公告)日：2015-07-23

申请号：US14672947

申请日：2015-03-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Peter Brick ,  Uwe Strauss

IPC: H01S5/10

CPC classification number: H01S5/1082 ,  H01S5/0035 ,  H01S5/10 ,  H01S5/1017 ,  H01S5/204 ,  H01S5/3095 ,  H01S5/32 ,  H01S5/3215 ,  H01S5/4043 ,  H01S2301/18 ,  H01S2301/185 ,  H01S2301/206

Abstract: A method proposed for manufacturing a radiation-emitting component in which a field distribution of a near field in a direction perpendicular to a main emission axis of the component is specified. From the field distribution of the near field, an index of refraction profile along this direction is determined. A structure is determined for the component such that the component will have the previously determined index of refraction profile. The component is constructed according to the previously determined structure. A radiation-emitting component is also disclosed.

Abstract translation: 一种提出用于制造辐射发射部件的方法，其中规定了垂直于部件的主发射轴的方向上的近场的场分布。 根据近场的场分布，确定沿该方向的折射率曲线。 确定组件的结构，使得组件将具有先前确定的折射率曲线。 该组件根据先前确定的结构构造。 还公开了一种辐射发射元件。

公开(公告)号：US20140312774A1

公开(公告)日：2014-10-23

申请号：US14322992

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Francis Nguyen ,  John McNatt ,  Sven Weber-Rabsilber ,  Peter Brick

IPC: H05B33/08

CPC classification number: H05B33/0851 ,  G09G3/3406 ,  G09G2320/041 ,  G09G2320/0633 ,  G09G2320/064 ,  G09G2360/145 ,  H05B33/0824 ,  H05B33/089

Abstract: A light-emitting diode includes at least one light-emitting diode chip, a carrier for the at least one light-emitting diode chip, and at least one control device integrated into the carrier, wherein each of the light-emitting diode chips is electrically connected to one of the at least one control devices, each of the at least one control devices includes a data storage device in which brightness data for each light-emitting diode chip which is connected to the control device is stored, and the control device drives the connected light-emitting diode chip with a current which is selected according to stored brightness data for the light-emitting diode chip.

Abstract translation: 发光二极管包括至少一个发光二极管芯片，用于至少一个发光二极管芯片的载体和集成到载体中的至少一个控制装置，其中每个发光二极管芯片是电气 连接到所述至少一个控制装置中的一个，所述至少一个控制装置中的每一个包括数据存储装置，其中存储连接到所述控制装置的每个发光二极管芯片的亮度数据，并且所述控制装置驱动 所连接的发光二极管芯片具有根据存储的用于发光二极管芯片的亮度数据选择的电流。

公开(公告)号：US20140158875A1

公开(公告)日：2014-06-12

申请号：US14177591

申请日：2014-02-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Julius Muschaweck ,  Joachim Frank

IPC: G02B19/00 ,  G01J1/04 ,  F21K99/00

CPC classification number: G02B19/0028 ,  F21K9/60 ,  G01J1/0411 ,  G01J1/0422 ,  H01L31/022408 ,  H01L31/022433 ,  H01L31/0547 ,  H01L33/38 ,  H01L33/58 ,  H01L2924/0002 ,  Y02E10/52 ,  H01L2924/00

Abstract: An optoelectronic apparatus includes an optical device with an optical structure including a plurality of optical elements and a concentrator which is a hollow body having a reflective inner area, and a radiation-emitting or radiation-receiving semiconductor chip with a contact structure including a plurality of contact elements that make electrical contact with the semiconductor chip and are spaced apart vertically from the optical structure, wherein the contact elements are arranged in interspaces between the optical elements upon projection of the contact structure into a plane of the optical structure, wherein the concentrator has an aperture on a side facing the semiconductor chip that is smaller than a side facing away from the semiconductor chip, and the optical structure is arranged on a side of the concentrator facing the semiconductor chip.

Abstract translation: 一种光电子器件包括具有包括多个光学元件的光学结构的光学器件和具有反射内部区域的中空本体的集中器，以及具有接触结构的辐射发射或辐射接收半导体芯片，该接触结构包括多个 接触元件，其与所述半导体芯片电接触并且与所述光学结构垂直地间隔开，其中所述接触元件在所述接触结构突出到所述光学结构的平面中之后布置在所述光学元件之间的间隙中，其中所述聚光器具有 在面向半导体芯片的一侧上的孔径小于远离半导体芯片的一侧的光圈，并且光学结构被布置在集中器面向半导体芯片的一侧上。

公开(公告)号：US12298528B2

公开(公告)日：2025-05-13

申请号：US17615722

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Dobner ,  Uli Hiller ,  Peter Brick ,  Hubert Halbritter ,  Thomas Schwarz ,  Michael Wittmann ,  Stefan Groetsch ,  Simon Schwalenberg ,  Sebastian Wittmann

IPC: G02B27/12 ,  F21S8/00 ,  G02B1/04 ,  G02B5/26 ,  B60K35/00 ,  B60K35/22 ,  B60K35/60

Abstract: An optoelectronic device, in particular a display device, comprises: at least one optoelectronic light source, an at least partially transparent front layer, an at least partially transparent support layer, wherein the light source is arranged between the front layer and the support layer, wherein a front side of the light source faces the front layer and a rear side of the light source faces the support layer, and wherein a limiting device is provided in a circumferential direction around the light source, wherein the limiting device limits a spatial region, in which the light source emits light such that total internal reflection of the emitted light, in particular at an interface between the front layer and the outside, is avoided or at least reduced.

公开(公告)号：US12249807B2

公开(公告)日：2025-03-11

申请号：US17414671

申请日：2019-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sperl ,  Hubert Halbritter ,  Peter Brick ,  Philipp McCaw ,  Dennis Sprenger

IPC: H01S5/42 ,  G02B1/00 ,  G02B27/09 ,  H01S5/02345 ,  H01S5/183

Abstract: A laser device comprises a carrier, an optoelectronic component provided on the carrier, said component being designed to emit laser radiation, and an optical element designed to form the laser radiation emitted by the optoelectronic component, wherein: the optical element has a first layer that is at least partially transparent to the laser radiation, with a first refractive index, and a second layer that is at least partially transparent to the laser radiation, with a second refractive index; the first layer being applied to the optoelectronic component and having a surface with an imprinted structure; and the second layer is applied to the first layer, on the surface (24) having the imprinted structure.

公开(公告)号：US11480723B2

公开(公告)日：2022-10-25

申请号：US17475030

申请日：2021-09-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Jean-Jacques Drolet ,  Hubert Halbritter ,  Laura Kreiner ,  Thomas Schwarz ,  Tilman Ruegheimer ,  Frank Singer

IPC: F21V8/00 ,  G02B27/01 ,  H01L25/075

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US20220254304A1

公开(公告)日：2022-08-11

申请号：US17677870

申请日：2022-02-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thorsten Baumheinrich ,  Peter Brick ,  Jean-Jacques Drolet ,  Hubert Halbritter ,  Laura Kreiner ,  Jens Richter ,  Thomas Schwarz ,  Paul Ta ,  Kilian Regau ,  Christopher Soell ,  Hoa Vu ,  Christopher Wiesmann ,  Patrick Hoerner ,  Jong Park ,  Kanishk Chand

IPC: G09G3/32 ,  G09G5/10 ,  B60K35/00

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US11233373B2

公开(公告)日：2022-01-25

申请号：US16480071

申请日：2018-01-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Hubert Halbritter

IPC: H01S5/00 ,  G01J3/10 ,  G01J3/28 ,  H01S5/40 ,  H01S5/42

Abstract: A radiation-emitting semiconductor arrangement includes at least one semiconductor body having an active region that generates a primary radiation, and includes a radiation conversion element, wherein the radiation conversion element converts the primary radiation at least partially into a secondary radiation during operation of the semiconductor arrangement, the radiation conversion element emits the secondary radiation at a narrow angle, the radiation conversion element emits the secondary radiation into a projected spatial angle of not more than π/5, and the semiconductor arrangement includes an optical deflector movable during operation of the semiconductor arrangement.