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41.
公开(公告)号:US12007916B2
公开(公告)日:2024-06-11
申请号:US18295143
申请日:2023-04-03
Applicant: Rambus Inc.
Inventor: John Eric Linstadt
CPC classification number: G06F13/1694 , G06F12/0246 , G06F12/0623 , G06F12/0646 , G11C7/10 , G11C7/1045 , G11C7/20 , G11C7/22 , G06F13/1678 , G06F2212/7206
Abstract: A memory controller interfaces with one or more memory devices having configurable width data buses and configurable connectivity between data pins of the memory devices and data pins of the memory controller. Upon initialization of the memory devices, the memory controller automatically discovers the connectivity configuration of the one or more memory devices, including both individually selected and jointly selected devices. After discovering connectivity of the connected devices, the memory controller configures the memory devices according to the discovered connectivity and assigns unique addresses to jointly selected devices.
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公开(公告)号:US11967364B2
公开(公告)日:2024-04-23
申请号:US18203511
申请日:2023-05-30
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C7/10 , G06F11/10 , G11C7/02 , G11C11/4093 , G11C11/4096 , G11C29/52 , G11C29/04
CPC classification number: G11C11/4093 , G06F11/1048 , G11C7/02 , G11C11/4096 , G11C29/52 , G11C2029/0411
Abstract: Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.
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公开(公告)号:US20240013819A1
公开(公告)日:2024-01-11
申请号:US18348716
申请日:2023-07-07
Applicant: Rambus Inc.
Inventor: Taeksang Song , Steven Woo , Craig Hampel , John Eric Linstadt
IPC: G11C7/10
CPC classification number: G11C7/1084 , G11C7/1006
Abstract: An apparatus and method for flexible metadata allocation and caching. In one embodiment of the method first and second requests are received from first and second applications, respectively, wherein the requests specify a reading of first and second data, respectively, from one or more memory devices. The circuit reads the first and second data in response to receiving the first and second requests. Receiving first and second metadata from the one or more memory devices in response to receiving the first and second requests. The first and second metadata correspond to the first and second data, respectively. The first and second data are equal in size, and the first and second metadata are unequal in size.
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公开(公告)号:US11842761B2
公开(公告)日:2023-12-12
申请号:US17390370
申请日:2021-07-30
Applicant: Rambus Inc.
Inventor: Thomas Vogelsang , John Eric Linstadt , Liji Gopalakrishnan
IPC: G06F12/00 , G11C11/408 , G11C11/4094 , G11C11/4091 , G06F13/42
CPC classification number: G11C11/4085 , G06F13/4282 , G11C11/4091 , G11C11/4094
Abstract: A dynamic random access memory (DRAM) component (e.g., module or integrated circuit) can be configured to have multiple rows in the same bank open concurrently. The controller of the component divides the address space of the banks into segments based on row address ranges. These row address ranges do not necessarily correspond to row address ranges of the bank's subarrays (a.k.a. memory array tiles—MATs). When a command is sent to open a row, the controller marks a plurality of the segments as blocked. The controller thereby tracks address ranges in a bank where it will not open a second row unless and until the first row is closed. The memory component may store information about which, and how many, segments should be blocked in response to opening a row. This information may be read by the controller during initialization.
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公开(公告)号:US11755508B2
公开(公告)日:2023-09-12
申请号:US17507588
申请日:2021-10-21
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely Tsern , John Eric Linstadt , Thomas J. Giovannini , Craig E. Hampel , Scott C. Best , John Yan
IPC: G06F13/16
CPC classification number: G06F13/1678 , G06F13/1673 , G06F13/1694
Abstract: Described are motherboards with memory-module sockets that accept legacy memory modules for backward compatibility or accept a greater number of configurable modules in support of increased memory capacity. The configurable modules can be backward compatible with legacy motherboards. Equipped with the configurable modules, the motherboards support memory systems with high signaling rates and capacities.
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公开(公告)号:US11735287B2
公开(公告)日:2023-08-22
申请号:US18074188
申请日:2022-12-02
Applicant: Rambus Inc.
Inventor: Scott C. Best , John Eric Linstadt , Paul William Roukema
CPC classification number: G11C29/4401 , G11C5/04 , G11C11/401 , G11C29/022 , G11C29/52 , G11C29/76 , G11C29/783 , G11C29/88 , G11C2029/4402
Abstract: A buffer circuit is disclosed. The buffer circuit includes a command address (C/A) interface to receive an incoming activate (ACT) command and an incoming column address strobe (CAS) command. A first match circuit includes first storage to store failure row address information associated with the memory, and first compare logic. The first compare logic is responsive to the ACT command, to compare incoming row address information to the stored failure row address information. A second match circuit includes second storage to store failure column address information associated with the memory, and second compare logic. The second compare logic is responsive to the CAS command, to compare the incoming column address information to the stored failure column address information. Gating logic maintains a state of a matching row address identified by the first compare logic during the comparison carried out by the second compare logic.
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公开(公告)号:US11653476B2
公开(公告)日:2023-05-16
申请号:US17459978
申请日:2021-08-27
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Thomas Vogelsang
IPC: H05K7/20 , G06F1/20 , H01L27/108 , H01L23/367
CPC classification number: H05K7/20372 , G06F1/20 , H01L23/3677 , H01L27/108
Abstract: The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.
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公开(公告)号:US20220382691A1
公开(公告)日:2022-12-01
申请号:US17830838
申请日:2022-06-02
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth Lee Wright
Abstract: A memory module comprises an address buffer circuit, a command/address channel, and a plurality of memory components controlled by the address buffer circuit via the command/address channel. At least one memory component comprises a plurality of data ports, a memory core to store data, and a data interface. The data interface is capable of transferring data between the memory core and the data ports. The data interface supports a first data width mode in which the data interface transfers data at a first bit width and a first burst length via the data ports. The data interface also supports a second data width mode in which the data interface transfers data at a second bit width and second burst length via the data ports. The first bit width is greater than the second bit width and the first burst length is shorter than the second burst length.
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公开(公告)号:US20220245073A1
公开(公告)日:2022-08-04
申请号:US17677714
申请日:2022-02-22
Applicant: Rambus Inc.
Inventor: Thomas J. Giovannini , John Eric Linstadt , Catherine Chen
Abstract: A memory system supports single- and dual-memory-module configurations, both supporting point-to-point communication between a host (e.g., a memory controller) and the memory module or modules. Each memory module includes an address-buffer component, data-buffer components, and two sets of memory dies, each set termed a “timing rank,” that can be accessed independently. The one memory module is configured in a wide mode for the single-memory-module configuration, in which case both timing ranks work together, as a “package rank,” to communicate full-width data. Each of two memory modules are configured in a narrow mode for the dual-memory-module configuration, in which case one timing rank from each memory module communicates data in parallel to appear to the host as single package ranks. The data-buffer components support separate and configurable write and read delays for the different timing ranks on each module to provide read and write leveling within and between memory modules.
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公开(公告)号:US11379136B2
公开(公告)日:2022-07-05
申请号:US17075357
申请日:2020-10-20
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
IPC: G06F3/06 , G11C11/4091 , G11C11/4076 , G11C7/06 , G11C7/22 , G11C7/18 , G11C11/4097
Abstract: Same sized blocks of data corresponding to a single read/write command are stored in the same memory array of a memory device, but using different formats. A first one of these formats spreads the data in the block across a larger number of memory subarrays (a.k.a., memory array tiles—MATs) than a second format. In this manner, the data blocks stored in the first format can be accessed with lower latency than the blocks stored in the second format because more data can be read from the array simultaneously. In addition, since the data stored in the second format is stored in fewer subarrays, it takes less energy to read a block stored in the second format. Thus, a system may elect, on a data block by data block basis, whether to conserve power or improve speed.
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