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公开(公告)号:US20150041801A1
公开(公告)日:2015-02-12
申请号:US14447875
申请日:2014-07-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Takuya HIROHASHI , Masahiro TAKAHASHI , Motoki NAKASHIMA , Ryosuke WATANABE , Masashi TSUBUKU
IPC: H01L29/792 , H01L29/24
CPC classification number: H01L29/792 , H01L29/24 , H01L29/4908 , H01L29/513 , H01L29/66969 , H01L29/7869
Abstract: A semiconductor device includes a semiconductor layer, a gate electrode overlapping with the semiconductor layer, a first gate insulating layer between the semiconductor layer and the gate electrode, and a second gate insulating layer between the first gate insulating layer and the gate electrode. The first gate insulating layer includes an oxide in which the nitrogen content is lower than or equal to 5 at. %, and the second gate insulating layer includes charge trap states.
Abstract translation: 半导体器件包括半导体层,与半导体层重叠的栅极电极,在半导体层和栅电极之间的第一栅极绝缘层,以及位于第一栅极绝缘层和栅电极之间的第二栅极绝缘层。 第一栅极绝缘层包括其中氮含量低于或等于5at的氧化物。 %,第二栅极绝缘层包括电荷陷阱状态。
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公开(公告)号:US20140306221A1
公开(公告)日:2014-10-16
申请号:US14247676
申请日:2014-04-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Junichi KOEZUKA , Yasutaka NAKAZAWA , Yukinori SHIMA , Masami JINTYOU , Masayuki SAKAKURA , Motoki NAKASHIMA
IPC: H01L27/12 , H01L29/786
CPC classification number: H01L27/1225 , H01L27/1229 , H01L29/04 , H01L29/045 , H01L29/7869 , H01L29/78696
Abstract: The stability of a step of processing a wiring formed using copper, aluminum, gold, silver, molybdenum, or the like is increased. Moreover, the concentration of impurities in a semiconductor film is reduced. Moreover, the electrical characteristics of a semiconductor device are improved. In a transistor including an oxide semiconductor film, an oxide film in contact with the oxide semiconductor film, and a pair of conductive films being in contact with the oxide film and including copper, aluminum, gold, silver, molybdenum, or the like, the oxide film has a plurality of crystal parts and has c-axis alignment in the crystal parts, and the c-axes are aligned in a direction parallel to a normal vector of a top surface of the oxide semiconductor film or the oxide film.
Abstract translation: 处理使用铜,铝,金,银,钼等形成的布线的步骤的稳定性增加。 此外,半导体膜中的杂质浓度降低。 此外,提高了半导体器件的电特性。 在包括氧化物半导体膜,与氧化物半导体膜接触的氧化物膜和与氧化膜接触并包括铜,铝,金,银,钼等的一对导电膜的晶体管中, 氧化物膜具有多个晶体部分,并且在晶体部分中具有c轴取向,并且c轴在与氧化物半导体膜或氧化物膜的顶表面的法向量平行的方向上排列。
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公开(公告)号:US20240314999A1
公开(公告)日:2024-09-19
申请号:US18596907
申请日:2024-03-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Hidekazu MIYAIRI , Motoki NAKASHIMA
IPC: H10B12/00
CPC classification number: H10B12/00
Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a first transistor, a capacitor, and a second transistor stacked in this order. The first and second transistors each include a semiconductor layer, a first conductor over the semiconductor layer, a first insulator, and a second conductor over the first insulator. In each of the first and second transistors, a side surface of the semiconductor layer is aligned with a side surface of the first conductor; the semiconductor layer and the first conductor each have an opening; the first insulator is inside the opening; the first insulator has a depressed portion reflecting the shape of the opening; and a second conductor fills the depressed portion. The second conductor of the first transistor, one of a pair of electrodes of the capacitor, and the semiconductor layer of the second transistor are connected to each other.
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公开(公告)号:US20230246034A1
公开(公告)日:2023-08-03
申请号:US18134117
申请日:2023-04-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Motoki NAKASHIMA , Haruyuki BABA
IPC: H01L27/12 , H01L29/786 , H01L29/66
CPC classification number: H01L27/1225 , H01L29/7869 , H01L29/78648 , H01L29/78696 , H01L29/66757 , H01L29/78693 , G02F2201/44 , G02F1/136222
Abstract: A novel metal oxide is provided. The metal oxide has a plurality of energy gaps, and includes a first region having a high energy level of a conduction band minimum and a second region having an energy level of a conduction band minimum lower than that of the first region. The second region comprises more carriers than the first region. A difference between the energy level of the conduction band minimum of the first region and the energy level of the conduction band minimum of the second region is 0.2 eV or more. The energy gap of the first region is greater than or equal to 3.3 eV and less than or equal to 4.0 eV and the energy gap of the second region is greater than or equal to 2.2 eV and less than or equal to 2.9 eV.
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公开(公告)号:US20220359575A1
公开(公告)日:2022-11-10
申请号:US17861430
申请日:2022-07-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Masashi OOTA , Noritaka ISHIHARA , Motoki NAKASHIMA , Yoichi KUROSAWA , Shunpei YAMAZAKI , Yasuharu HOSAKA , Toshimitsu OBONAI , Junichi KOEZUKA
IPC: H01L27/12 , H01L21/02 , H01L49/02 , H01L29/66 , H01L29/786 , H01L21/425 , H01L21/477
Abstract: To provide a method for manufacturing a semiconductor device including an oxide semiconductor film having conductivity, or a method for manufacturing a semiconductor device including an oxide semiconductor film having a light-transmitting property and conductivity. The method for manufacturing a semiconductor device includes the steps of forming an oxide semiconductor film over a first insulating film, performing first heat treatment in an atmosphere where oxygen contained in the oxide semiconductor film is released, and performing second heat treatment in a hydrogen-containing atmosphere, so that an oxide semiconductor film having conductivity is formed.
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公开(公告)号:US20190207033A1
公开(公告)日:2019-07-04
申请号:US16295365
申请日:2019-03-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Motoki NAKASHIMA , Masahiro TAKAHASHI
IPC: H01L29/786 , H01L29/423 , H01L29/417 , H01L29/36 , H01L29/06 , H01L29/24 , H01L29/66
CPC classification number: H01L29/7869 , H01L29/0692 , H01L29/24 , H01L29/36 , H01L29/41733 , H01L29/42356 , H01L29/42384 , H01L29/66969 , H01L29/78606 , H01L29/78693
Abstract: A highly reliable semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device is manufactured with a high yield, so that high productivity is achieved. In a semiconductor device including a transistor in which a source electrode layer and a drain electrode layer are provided over and in contact with an oxide semiconductor film, entry of impurities and formation of oxygen vacancies in an end face portion of the oxide semiconductor film are suppressed. This can prevent fluctuation in the electric characteristics of the transistor which is caused by formation of a parasitic channel in the end face portion of the oxide semiconductor film.
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公开(公告)号:US20190185986A1
公开(公告)日:2019-06-20
申请号:US16285297
申请日:2019-02-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Tetsunori MARUYAMA , Yuki IMOTO , Hitomi SATO , Masahiro WATANABE , Mitsuo MASHIYAMA , Kenichi OKAZAKI , Motoki NAKASHIMA , Takashi SHIMAZU
IPC: C23C14/08 , C23C14/34 , H01L29/786 , H01L29/24 , H01L29/66 , H01L21/02 , C04B35/453 , B28B11/24 , C04B35/64
CPC classification number: C23C14/08 , B28B11/243 , C04B35/453 , C04B35/64 , C04B2235/3284 , C04B2235/3286 , C04B2235/76 , C23C14/086 , C23C14/3414 , C23C14/345 , H01L21/02565 , H01L21/02631 , H01L29/24 , H01L29/66969 , H01L29/7869
Abstract: There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
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公开(公告)号:US20180197995A1
公开(公告)日:2018-07-12
申请号:US15911681
申请日:2018-03-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Motoki NAKASHIMA , Masahiro TAKAHASHI
IPC: H01L29/786 , H01L29/66 , H01L29/423 , H01L29/06 , H01L29/417 , H01L29/36 , H01L29/24
CPC classification number: H01L29/7869 , H01L29/0692 , H01L29/24 , H01L29/36 , H01L29/41733 , H01L29/42356 , H01L29/42384 , H01L29/66969 , H01L29/78606 , H01L29/78693
Abstract: A highly reliable semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device is manufactured with a high yield, so that high productivity is achieved. In a semiconductor device including a transistor in which a source electrode layer and a drain electrode layer are provided over and in contact with an oxide semiconductor film, entry of impurities and formation of oxygen vacancies in an end face portion of the oxide semiconductor film are suppressed. This can prevent fluctuation in the electric characteristics of the transistor which is caused by formation of a parasitic channel in the end face portion of the oxide semiconductor film.
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公开(公告)号:US20180175210A1
公开(公告)日:2018-06-21
申请号:US15896925
申请日:2018-02-14
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Akiharu MIYANAGA , Yasuharu HOSAKA , Toshimitsu OBONAI , Junichi KOEZUKA , Motoki NAKASHIMA , Masahiro TAKAHASHI , Shunsuke ADACHI , Takuya HIROHASHI
CPC classification number: H01L29/78606 , H01L27/1225 , H01L29/045 , H01L29/24 , H01L29/4908 , H01L29/66969 , H01L29/7869 , H01L29/78696
Abstract: In a semiconductor device using a transistor including an oxide semiconductor, a change in electrical characteristics is suppressed and reliability is improved. The semiconductor device includes a gate electrode over an insulating surface; an oxide semiconductor film overlapping with the gate electrode; a gate insulating film that is between the gate electrode and the oxide semiconductor film and in contact with the oxide semiconductor film; a protective film in contact with a surface of the oxide semiconductor film that is an opposite side of a surface in contact with the gate insulating film; and a pair of electrodes in contact with the oxide semiconductor film. The spin density of the gate insulating film or the protective film measured by electron spin resonance spectroscopy is lower than 1×1018 spins/cm3, preferably higher than or equal to 1×1017 spins/cm3 and lower than 1×1018 spins/cm3.
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公开(公告)号:US20180012739A1
公开(公告)日:2018-01-11
申请号:US15642652
申请日:2017-07-06
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Motoki NAKASHIMA , Haruyuki BABA
IPC: H01J37/34 , B28B1/00 , H01L29/24 , H01L27/12 , H01L21/02 , B28B11/24 , C23C14/08 , C23C14/34 , H01L29/786 , H01L29/66 , G02F1/1368 , G02F1/1333 , G02F1/1335
CPC classification number: H01J37/3429 , B28B1/008 , B28B11/24 , C04B35/01 , C04B35/453 , C04B35/58 , C04B2235/3205 , C04B2235/3206 , C04B2235/3217 , C04B2235/3232 , C04B2235/3239 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3279 , C04B2235/3284 , C04B2235/3286 , C04B2235/3287 , C04B2235/3293 , C04B2235/3409 , C04B2235/3418 , C04B2235/3852 , C04B2235/72 , C04B2235/781 , C04B2235/785 , C04B2235/786 , C04B2235/80 , C23C14/086 , C23C14/3414 , G02F1/133345 , G02F1/133514 , G02F1/133553 , G02F1/1368 , G02F2203/02 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L27/1225 , H01L27/127 , H01L29/24 , H01L29/42384 , H01L29/66969 , H01L29/78648 , H01L29/7869 , H01L29/78696
Abstract: A novel metal oxide or a novel sputtering target is provided. A sputtering target includes a conductive material and an insulating material. The insulating material includes an oxide, a nitride, or an oxynitride including an element M1. The element M1 is one or more kinds of elements selected from Al, Ga, Si, Mg, Zr, Be, and B. The conductive material includes an oxide, a nitride, or an oxynitride including indium and zinc. A metal oxide film is deposited using the sputtering target in which the conductive material and the insulating material are separated from each other.
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