Semiconductor memory devices
    41.
    发明授权

    公开(公告)号:US12066893B2

    公开(公告)日:2024-08-20

    申请号:US18226622

    申请日:2023-07-26

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    MEMORY CONTROLLERS AND MEMORY SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20240178861A1

    公开(公告)日:2024-05-30

    申请号:US18339490

    申请日:2023-06-22

    CPC classification number: H03M13/1111 H03M13/611

    Abstract: A memory controller to control a memory module including a plurality of data chips, a first parity chip and a second parity chip, includes a system error correction code (ECC) engine and a processor to control the system ECC engine. The system ECC engine includes an ECC decoder and a memory to store a parity check matrix. The ECC decoder selects one of a plurality of ECC decoding schemes based on decoding status flags and corrects a plurality of symbol errors in a read codeword set from the memory module by performing an ECC decoding on the read codeword set based on the selected decoding scheme and the parity check matrix. The decoding status flags are provided from the plurality of data chips and each of the decoding status flags indicates whether at least one error bit is detected in respective one of the plurality of data chips.

    Semiconductor memory devices
    44.
    发明授权

    公开(公告)号:US11762736B2

    公开(公告)日:2023-09-19

    申请号:US17580048

    申请日:2022-01-20

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    Methods of operating memory controllers, memory controllers performing the methods and memory systems including the memory controllers

    公开(公告)号:US11726670B2

    公开(公告)日:2023-08-15

    申请号:US17704354

    申请日:2022-03-25

    CPC classification number: G06F3/0619 G06F3/0655 G06F3/0673

    Abstract: In a method of operating a memory controller, a decoding status flag is received from a memory module including a plurality of data chips and at least one parity chip. Each of the plurality of data chips and the at least one parity chip may include an on-die error correction code (ECC) engine. The decoding status flag is generated by the on-die ECC engines. A first number and a second number may be obtained based on the decoding status flag. The first number represents a number of first chips including an uncorrectable error that is uncorrectable by the on-die ECC engine. The second number represents a number of second chips including a correctable error that is correctable by the on-die ECC engine. At least one of a plurality of decoding schemes is selected based on at least one of the first number and the second number. A system ECC engine may perform ECC decoding on at least one of the first chips and the second chips based on the selected decoding scheme.

    SEMICONDUCTOR MEMORY DEVICES
    47.
    发明申请

    公开(公告)号:US20220374309A1

    公开(公告)日:2022-11-24

    申请号:US17580048

    申请日:2022-01-20

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first coedword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    Memory controllers and memory systems including the same

    公开(公告)号:US11463110B2

    公开(公告)日:2022-10-04

    申请号:US16987554

    申请日:2020-08-07

    Abstract: A memory controller includes an error correction circuit and a central processing unit (CPU) to control the error correction circuit. The error correction circuit includes an error correction code (ECC) decoder and a memory to store a parity check matrix. The ECC decoder performs an ECC decoding on a codeword read from the memory module to: (i) generate a first syndrome and a second syndrome, (ii) generate a decoding mode flag associated with a type of errors in the codeword based on the second syndrome and a decision syndrome, (iii) operate in one of a first decoding mode and a second decoding mode based on the decoding mode flag, and (iv) selectively correct one of a chip error associated with one of the data chips and one or more symbol errors in the codeword.

    Semiconductor memory devices and methods of operating semiconductor memory devices

    公开(公告)号:US11437115B2

    公开(公告)日:2022-09-06

    申请号:US17326416

    申请日:2021-05-21

    Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) engine, row fault detector circuitry and control logic circuitry. The memory cell array includes a plurality of memory cell rows. The control logic circuitry controls the ECC engine circuitry to perform a plurality of error detection operations on each of the memory cell rows. The control logic circuitry controls the row fault detector circuitry to store an error parameter associated with each of a plurality of codewords in each of which at least one error is detected by accumulating the error parameter for each of a plurality of defective memory cell rows. The row fault detector circuitry determines whether a row fault occurs in each of the plurality of defective memory cell rows based on a number of changes of the error parameter.

    Semiconductor memory devices and memory systems with enhanced error detection and correction

    公开(公告)号:US11416335B2

    公开(公告)日:2022-08-16

    申请号:US16934677

    申请日:2020-07-21

    Abstract: A semiconductor memory device includes a memory cell array, an error correction circuit, an input/output (I/O) gating circuit and a control logic circuit. The memory cell array is coupled to word-line and bit-lines and is divided into sub array blocks. The error correction circuit generates parity data based on main data using an error correction code (ECC). The control logic circuit controls the error correction circuit and the I/O gating circuit based on a command and address. The control logic circuit stores the main data and the parity data in (k+1) target sub array blocks in the second direction among the sub array blocks, and controls the I/O gating circuit such that a portion of the (k+1) target sub array blocks store both of a portion of the main data and a portion of the parity data.

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