摘要:
An integrated circuit is formed thereof a conductive wiring pattern. On the conductive wiring semiconductor layer is directly formed in a form of amorphous on the substrate. The amorphous semiconductor layer is annealed to form a polycrystalline structure while avoiding influence of annealing heat for the substrate. In the polycrystalline semiconductor layer is formed a semiconductor element, such as MOS transistor, MIS transistor, TFT and so forth. The semiconductor element is directly connected to the wiring pattern on the substrate.
摘要:
An improved injection molding process for producing a substrate of an optical disc having a high quality is disclosed. The process includes the steps of: fixing a stamper having protrusions corresponding to pits for recorded information or a groove for tracking onto one mold unit of a pair of mold units of an injection molding machine; combining the mold units to form a closed cavity between the pair of mold units; charging a molten molding resin into the cavity; cooling the resin in the cavity to form a molded substrate; separating one mold unit from another mold unit; and releasing the molded substrate simultaneously from both mold units when the two mold units are separated from each other by applying pressurized air onto both sides of the substrate.
摘要:
The present invention is an apparatus for detecting a surface flaw in hot metal including a particularly designed television camera, a shutter means and a control circuit which compensates the television camera's shading as well as the temperature difference among normal parts of the observed material.The apparatus makes it possible to conduct clear detection of a flaw on the surface of the hot material as it is so that yield loss at the time of scarfing can be avoided while heat energy can effectively be utilized.
摘要:
A method to inexpensively and efficiently produce conductive materials on the surface of which a nano-level fine structure is formed includes surface modification including immersing a stable anode electrode and a workpiece as a cathode electrode, the workpiece including a conductive material with a work surface, in an electrolytic solution, then applying a voltage not less than a first voltage and less than a second voltage between the stable anode electrode and the workpiece as the cathode electrode immersed in the electrolytic solution, thereby modifying the work surface, the first voltage being a voltage corresponding to a current value that is ½ of the sum of a first maximum current value appearing first in a positive voltage region and a first minimum current value appearing first in the positive voltage region with respect to voltage-current characteristics of a surface modification treatment system, the second voltage exhibiting a complete-state plasma.
摘要:
The invention provides a method for subjecting laminated thin films disposed below a photoresist mask pattern to plasma processing, wherein the roughness on the side walls of the formed pattern is reduced, and the LER and LWR are reduced. When etching a material to be processed to form a gate electrode including thin films such as a gate insulating film 205, a conducting layer 204, a mask layer 203 and an antireflection film 202 laminated on a semiconductor substrate 206 and a photoresist mask pattern 201 disposed on the antireflection film, prior to etching the mask pattern 201, plasma is generated from nitrogen gas or a mixed gas including nitrogen gas and deposition gas to subject the mask pattern 201 to a plasma curing process so as to reduce the roughness on the surface and side walls of the mask pattern 201, and then the laminated thin films 202, 203 and 204 disposed below the mask pattern 201 are subjected to a plasma etching process.
摘要:
An object of the present invention is to provide an electronic component using a Cu-based conductive material that can suppress oxidization even in a heat treatment in an oxidizing atmosphere and that can suppress an increase in an electrical resistance. In an electronic component having an electrode or a wiring, a ternary alloy made from three elements consisting of Cu, Al, and Co is used as a Cu-based wiring material that can prevent oxidization of the electrode or the wiring. Specifically, part or the whole of the electrode or the wiring has a chemical composition in which an Al content is 10 at % to 25 at %, a Co content is 5 at % to 20 at %, and the balance is composed of Cu and unavoidable impurities, and the chemical composition represents a ternary alloy in which two phases of a Cu solid solution formed by Al and Co being dissolved into Cu and a CoAl intermetallic compound coexist together.
摘要:
This invention relates to DNA encoding a novel enzyme having activity of synthesizing D-serine from formaldehyde and glycine, recombinant DNA constructed by integrating such DNA into a vector, a transformant transformed with the recombinant DNA, and a method for producing D-serine from formaldehyde and glycine with the use of the enzyme.
摘要:
A method of smelting copper includes: a generating step of generating blister and slag from copper matte by charging the copper matte into a smelting furnace and oxidizing the copper matte; a first refining step of refining another blister from the slag by reduction in an electrical furnace; and a charging step of charging the slag into one of the smelting furnace or another smelting furnace for treating copper concentrate and generating matte as repeating flux if copper grade of slag generated in the first refining step is higher than 0.8 weight %.
摘要:
The invention provides: an isopropyl alcohol-producing bacterium which has an acetoacetate decarboxylase activity, an isopropyl alcohol dehydrogenase activity, a CoA transferase activity and a thiolase activity having been imparted thereto and is capable of producing isopropyl alcohol from a plant-derived material; a method of producing isopropyl alcohol whereby isopropyl alcohol is produced from a plant-derived material by using this isopropyl alcohol-producing bacterium; and an apparatus therefor.
摘要:
The present invention provides a plasma processing apparatus or a plasma processing method that can etch a multilayer film structure for constituting a gate structure with high accuracy and high efficiency. A plasma processing method of, on processing a sample on a sample stage 112 in a depressurized discharge room 117, etching a multilayer film (including a high-k and a metal gate) at 0.1 Pa or less and with the sample stage 112 temperature-regulated by using a pressure gauge 133 to be used for pressure regulation and connected to the processing room and a main pump for exhaustion 130.