公开(公告)号：US20190094477A1

公开(公告)日：2019-03-28

申请号：US16199908

申请日：2018-11-26

Applicant: Sony Corporation

Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

IPC: G02B6/42 ,  H01L31/0232 ,  H01S5/00 ,  G02B6/43 ,  H04Q11/00 ,  H01L31/0203

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

公开(公告)号：US09905151B2

公开(公告)日：2018-02-27

申请号：US14758892

申请日：2013-12-20

Applicant: SONY CORPORATION

Inventor： Hideyuki Suzuki ,  Toshiyuki Miyauchi ,  Yosuke Ueno ,  Yoshifumi Miyajima ,  Masayuki Hattori ,  Kazukuni Takanohashi ,  Haruo Togashi ,  Tamotsu Ikeda ,  Hiizu Ootorii ,  Sachiya Tanaka

IPC: G09G3/20 ,  G09G3/3291 ,  G09G3/32 ,  G09G3/36

CPC classification number: G09G3/2085 ,  G09G3/2014 ,  G09G3/32 ,  G09G3/3291 ,  G09G3/36 ,  G09G2230/00 ,  G09G2310/02 ,  G09G2310/027

Abstract: A display panel includes a plurality of first unit pixels, each including: a data input terminal, a data output terminal, a display element, and a waveform shaping section. The display element is configured to perform display based on data inputted to the data input terminal. The first waveform shaping section is provided on a signal path from the data input terminal to the data output terminal.

公开(公告)号：US09257395B2

公开(公告)日：2016-02-09

申请号：US14306432

申请日：2014-06-17

Applicant: Sony Corporation

Inventor： Izuho Hatada ,  Hiizu Ootorii ,  Shuichi Oka ,  Shusaku Yanagawa

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/799 ,  H01L24/98 ,  H01L29/0657 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05568 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side.

Abstract translation: 半导体器件包括其上布置有衬底电极的基底衬底，以及包括通过焊料与衬底电极电连接并且在下表面侧形成有光吸收层的芯片电极的半导体元件。

公开(公告)号：US09164182B2

公开(公告)日：2015-10-20

申请号：US14362240

申请日：2012-12-07

Applicant: Sony Corporation

Inventor： Hiizu Ootorii ,  Norihisa Shirota ,  Haruo Togashi

IPC: G01T1/20 ,  G01T1/202 ,  H01L27/146

CPC classification number: G01T1/2018 ,  G01T1/2006 ,  G01T1/202 ,  G01T1/2023 ,  H01L27/14636 ,  H01L27/14663 ,  H01L2224/18

Abstract: An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the. receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.

Abstract translation: 一种图像拾取面板（1）包括：光电检测部分（10），每个光电检测部分（10）包括一体模制的光电检测器（11-1）和接收器（11-2），并且在其上形成有焊料凸块（12） 成为当前的信号， 接收器将电流信号转换为电压信号; 以及布线层（20），其中安装有布线图案，并且通过焊料凸块使各个像素的光电检测部分安装在其上，布线图案连接到光电检测部分。

公开(公告)号：US09033590B2

公开(公告)日：2015-05-19

申请号：US13660102

申请日：2012-10-25

Applicant: Sony Corporation

Inventor： Hiizu Ootorii ,  Kazuaki Toba ,  Kazuki Sano ,  Hideyuki Suzuki

IPC: G02B6/00 ,  G02B6/36 ,  G02B6/38 ,  H01R27/02 ,  G02B6/32

CPC classification number: G02B6/3817 ,  G02B6/32 ,  G02B6/3853 ,  G02B6/3885 ,  G02B6/3897 ,  H01R27/02

Abstract: A connector includes: an electric transmission section; an optical transmission section; and a partition section provided between the electric transmission section and the optical transmission section.

Abstract translation: 连接器包括：电气传输部分; 光传输部; 以及设置在电传输部分和光传输部分之间的分隔部分。

公开(公告)号：US20140361431A1

公开(公告)日：2014-12-11

申请号：US14294242

申请日：2014-06-03

Applicant: Sony Corporation

Inventor： Katsuji Matsumoto ,  Hiizu Ootorii

IPC: H01L23/00

CPC classification number: H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03009 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/11009 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/94 ,  H01L2924/3651 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/03 ,  H01L2224/11

Abstract: A semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal layer formed between the pad electrode and the solder bump and connected to the pad electrode, and a main metal layer formed on the underlying metal layer, and in which the main metal layer has an eave portion at an outer edge portion thereof.

Abstract translation: 一种半导体器件包括第一半导体电子部件，其包括焊盘电极，焊料凸块以及焊盘和焊料之间的金属层，其被配置为具有形成在焊盘电极和焊料凸块之间的下面的金属层， 衬垫电极和形成在下面的金属层上的主金属层，并且其中主金属层在其外边缘部分具有檐部。

公开(公告)号：US20130108219A1

公开(公告)日：2013-05-02

申请号：US13660102

申请日：2012-10-25

Applicant: Sony Corporation

Inventor： Hiizu Ootorii ,  Kazuaki Toba ,  Kazuki Sano ,  Hideyuki Suzuki

IPC: G02B6/36

CPC classification number: G02B6/3817 ,  G02B6/32 ,  G02B6/3853 ,  G02B6/3885 ,  G02B6/3897 ,  H01R27/02

Abstract: A connector includes: an electric transmission section; an optical transmission section; and a partition section provided between the electric transmission section and the optical transmission section.

Abstract translation: 连接器包括：电气传输部分; 光传输部; 以及设置在电传输部分和光传输部分之间的分隔部分。