公开(公告)号：US20140008691A1

公开(公告)日：2014-01-09

申请号：US13928508

申请日：2013-06-27

Applicant: Sony Corporation

Inventor： Katsuhiro Tomoda ,  Naoki Hirao ,  Izuho Hatada

IPC: H01L31/02 ,  H01L33/62

CPC classification number: H01L33/38 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/29 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/78663 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/16

Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being provided avoiding a neighborhood of an end of the functional element among opposed side sections of the first and second seed metals.

Abstract translation: 一种器件包括：衬底; 和安装的功能元件，功能元件包括电极。 基板包括支撑基板，并且在支撑基板上包括第一种子金属，第二种子金属和树脂部件，第一种子金属设置在与电极之间的第一电极的一部分或全部相对的部分中， 并且通过电镀与所述第一电极连接，所述第二晶种金属设置在与所述电极之间的第二电极的一部分或全部相对的部分中，并且通过电镀连接到所述第二电极，并且所述树脂部件设置在 在所述功能元件和所述支撑基板之间，并且将所述功能元件固定到所述支撑基板，并且设置为避免所述第一和第二种子金属的相对侧部中的所述功能元件的端部附近。

公开(公告)号：US09257395B2

公开(公告)日：2016-02-09

申请号：US14306432

申请日：2014-06-17

Applicant: Sony Corporation

Inventor： Izuho Hatada ,  Hiizu Ootorii ,  Shuichi Oka ,  Shusaku Yanagawa

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/799 ,  H01L24/98 ,  H01L29/0657 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05568 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side.

Abstract translation: 半导体器件包括其上布置有衬底电极的基底衬底，以及包括通过焊料与衬底电极电连接并且在下表面侧形成有光吸收层的芯片电极的半导体元件。

公开(公告)号：US09929199B2

公开(公告)日：2018-03-27

申请号：US14908319

申请日：2014-08-21

Applicant: SONY CORPORATION

Inventor： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootorii ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

公开(公告)号：US20160172347A1

公开(公告)日：2016-06-16

申请号：US15050265

申请日：2016-02-22

Applicant: SONY CORPORATION

Inventor： Katsuhiro TOMODA ,  Naoki Hirao ,  Izuho Hatada

IPC: H01L25/16 ,  H01L29/786 ,  H01L31/02 ,  H01L31/0232 ,  H01L33/62 ,  H01L33/58

CPC classification number: H01L33/38 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/29 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/78663 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/16

Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being, provided avoiding a neighborhood of an end of the functional element among, opposed side sections of the first and second seed metals.

Abstract translation: 一种器件包括：衬底; 和安装的功能元件，功能元件包括电极。 基板包括支撑基板，并且在支撑基板上包括第一种子金属，第二种子金属和树脂部件，第一种子金属设置在与电极之间的第一电极的一部分或全部相对的部分中， 并且通过电镀与所述第一电极连接，所述第二晶种金属设置在与所述电极之间的第二电极的一部分或全部相对的部分中，并且通过电镀连接到所述第二电极，并且所述树脂部件设置在 在所述功能元件和所述支撑基板之间，并且将所述功能元件固定到所述支撑基板，并且设置为避免所述第一和第二种子金属的相对侧部分中的所述功能元件的端部附近。

公开(公告)号：US09911894B2

公开(公告)日：2018-03-06

申请号：US14689892

申请日：2015-04-17

Applicant: Sony Corporation

Inventor： Akira Ohmae ,  Michinori Shiomi ,  Noriyuki Futagawa ,  Takaaki Ami ,  Takao Miyajima ,  Yuuji Hiramatsu ,  Izuho Hatada ,  Nobukata Okano ,  Shigetaka Tomiya ,  Katsunori Yanashima ,  Tomonori Hino ,  Hironobu Narui

IPC: H01L33/00 ,  H01L31/0328 ,  C30B23/04 ,  C30B25/04 ,  C30B29/40 ,  H01L21/02 ,  H01L33/08 ,  H01L27/15 ,  H01L33/24 ,  H01L33/32 ,  H01L33/12 ,  H01L33/22 ,  H01L33/46

CPC classification number: H01L33/0025 ,  C30B23/04 ,  C30B25/04 ,  C30B29/403 ,  H01L21/02439 ,  H01L21/02458 ,  H01L21/02507 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02642 ,  H01L21/02647 ,  H01L27/15 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/12 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/46

Abstract: A method for manufacturing a light-emitting diode, which includes the steps of: providing a substrate having a plurality of protruded portions on one main surface thereof wherein the protruded portion is made of a material different in type from that of the substrate and growing a first nitride-based III-V Group compound semiconductor layer on each recess portion of the substrate through a state of making a triangle in section wherein a bottom surface of the recess portion becomes a base of the triangle; laterally growing a second nitride-based III-V Group compound semiconductor layer on the substrate from the first nitride-based III-V Group compound semiconductor layer; and successively growing, on the second nitride-based III-V Group compound semiconductor layer, a third nitride-based III-V Group compound semiconductor layer of a first conduction type, an active layer, and a fourth nitride-based III-V compound semiconductor layer of a second conduction type.

公开(公告)号：US20150228846A1

公开(公告)日：2015-08-13

申请号：US14689892

申请日：2015-04-17

Applicant: Sony Corporation

Inventor： Akira Ohmae ,  Michinori Shiomi ,  Noriyuki Futagawa ,  Takaaki Ami ,  Takao Miyajima ,  Yuuji Hiramatsu ,  Izuho Hatada ,  Nobukata Okano ,  Shigetaka Tomiya ,  Katsunori Yanashima ,  Tomonori Hino ,  Hironobu Narui

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/32 ,  H01L33/08 ,  H01L33/24

CPC classification number: H01L33/0025 ,  C30B23/04 ,  C30B25/04 ,  C30B29/403 ,  H01L21/02439 ,  H01L21/02458 ,  H01L21/02507 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02642 ,  H01L21/02647 ,  H01L27/15 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/12 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/46

Abstract: A method for manufacturing a light-emitting diode, which includes the steps of: providing a substrate having a plurality of protruded portions on one main surface thereof wherein the protruded portion is made of a material different in type from that of the substrate and growing a first nitride-based III-V Group compound semiconductor layer on each recess portion of the substrate through a state of making a triangle in section wherein a bottom surface of the recess portion becomes a base of the triangle; laterally growing a second nitride-based III-V Group compound semiconductor layer on the substrate from the first nitride-based III-V Group compound semiconductor layer; and successively growing, on the second nitride-based III-V Group compound semiconductor layer, a third nitride-based III-V Group compound semiconductor layer of a first conduction type, an active layer, and a fourth nitride-based III-V compound semiconductor layer of a second conduction type.

Abstract translation: 一种制造发光二极管的方法，包括以下步骤：在其一个主表面上提供具有多个突出部分的基板，其中突出部分由与基板不同的材料制成并生长 第一氮化物系III-V族化合物半导体层，其通过在凹部的底面成为三角形的基部的截面为三角形状的基板的每个凹部上; 在第一氮化物基III-V族化合物半导体层上在衬底上横向生长第二氮化物III-V族化合物半导体层; 并且在第二氮化物III-V族化合物半导体层上依次生长第一导电类型，有源层和第四氮化物III-V族化合物的第三氮化物基III-V族化合物半导体层 第二导电类型的半导体层。

公开(公告)号：US20150001718A1

公开(公告)日：2015-01-01

申请号：US14306432

申请日：2014-06-17

Applicant: Sony Corporation

Inventor： Izuho Hatada ,  Hiizu Ootorii ,  Shuichi Oka ,  Shusaku Yanagawa

IPC: H01L23/552 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/799 ,  H01L24/98 ,  H01L29/0657 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05568 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side.

Abstract translation: 半导体器件包括其上布置有衬底电极的基底衬底，以及包括通过焊料与衬底电极电连接并且在下表面侧形成有光吸收层的芯片电极的半导体元件。

公开(公告)号：US09991422B2

公开(公告)日：2018-06-05

申请号：US15050265

申请日：2016-02-22

Applicant: SONY CORPORATION

Inventor： Katsuhiro Tomoda ,  Naoki Hirao ,  Izuho Hatada

IPC: H01L33/00 ,  H01L33/38 ,  H01L31/02 ,  H01L33/62 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/075 ,  H01L25/16 ,  H01L29/786 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L33/38 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/29 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/78663 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/16

Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being, provided avoiding a neighborhood of an end of the functional element among, opposed side sections of the first and second seed metals.

公开(公告)号：US20160163754A1

公开(公告)日：2016-06-09

申请号：US14908319

申请日：2014-08-21

Applicant: SONY CORPORATION

Inventor： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootoril ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

Abstract translation: 提供了一种辐射检测器，包括：多个光电转换装置，每个光电转换装置至少部分地形成在嵌入层内并且具有至少部分位于嵌入层外部的光接收表面，以及多个闪烁体晶体， 所述多个闪烁器晶体中的至少第一闪烁体晶体与近端的至少一个光接收表面接触，其中所述第一闪烁体晶体在所述近端处的横截面小于所述第一闪烁体晶体的截面， 闪烁体晶体在远端。

公开(公告)号：US09293434B2

公开(公告)日：2016-03-22

申请号：US13928508

申请日：2013-06-27

Applicant: Sony Corporation

Inventor： Katsuhiro Tomoda ,  Naoki Hirao ,  Izuho Hatada

IPC: H01L33/00 ,  H01L23/48 ,  H01L23/00 ,  H01L31/02 ,  H01L33/38 ,  H01L23/498 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/38 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/29 ,  H01L25/0753 ,  H01L25/167 ,  H01L29/78663 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/16

Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being provided avoiding a neighborhood of an end of the functional element among opposed side sections of the first and second seed metals.

Abstract translation: 一种器件包括：衬底; 和安装的功能元件，功能元件包括电极。 基板包括支撑基板，并且在支撑基板上包括第一种子金属，第二种子金属和树脂部件，第一种子金属设置在与电极之间的第一电极的一部分或全部相对的部分中， 并且通过电镀与所述第一电极连接，所述第二晶种金属设置在与所述电极之间的第二电极的一部分或全部相对的部分中，并且通过电镀连接到所述第二电极，并且所述树脂组分设置在 在所述功能元件和所述支撑基板之间，并且将所述功能元件固定到所述支撑基板，并且设置为避免所述第一和第二种子金属的相对侧部中的所述功能元件的端部附近。