Manufacturable laser diode formed on c-plane gallium and nitrogen material

    公开(公告)号:US10903625B2

    公开(公告)日:2021-01-26

    申请号:US16586100

    申请日:2019-09-27

    Abstract: A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch.

    Method for manufacturing gallium and nitrogen bearing laser devices with improved usage of substrate material

    公开(公告)号:US10658810B2

    公开(公告)日:2020-05-19

    申请号:US16199974

    申请日:2018-11-26

    Abstract: A plurality of dies includes a gallium and nitrogen containing substrate having a surface region and an epitaxial material formed overlying the surface region. The epitaxial material includes an n-type cladding region, an active region having at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active region. The epitaxial material is patterned to form the plurality of dies on the surface region, the dies corresponding to a laser device. Each of the plurality of dies includes a release region composed of a material with a smaller bandgap than an adjacent epitaxial material. A lateral width of the release region is narrower than a lateral width of immediately adjacent layers above and below the release region to form undercut regions bounding each side of the release region. Each die also includes a passivation region extending along sidewalls of the active region.

    Semiconductor laser diode on tiled gallium containing material

    公开(公告)号:US10431958B1

    公开(公告)日:2019-10-01

    申请号:US16032997

    申请日:2018-07-11

    Abstract: In an example, the present invention provides a gallium and nitrogen containing multilayered structure. The structure has a plurality of gallium and nitrogen containing semiconductor substrates, each of the gallium and nitrogen containing semiconductor substrates (“substrates”) having a plurality of epitaxially grown layers overlaying a top-side of each of the substrates. The structure has an orientation of a reference crystal direction for each of the substrates. The structure has a first handle substrate coupled to each of the substrates such that each of the substrates is aligned to a spatial region configured in a selected direction of the first handle substrate. The reference crystal direction for each of the substrates is parallel to the spatial region in the selected direction within 10 degrees or less. The structure has a first bonding medium provided between the first handle substrate and each of the substrate while maintaining the alignment between the reference crystal orientation and the selected direction of the first handle substrate. A processed region is formed overlying each of the substrates.

    METHOD FOR MANUFACTURING GALLIUM AND NITROGEN BEARING LASER DEVICES WITH IMPROVED USAGE OF SUBSTRATE MATERIAL

    公开(公告)号:US20190109432A1

    公开(公告)日:2019-04-11

    申请号:US16199974

    申请日:2018-11-26

    Abstract: A plurality of dies includes a gallium and nitrogen containing substrate having a surface region and an epitaxial material formed overlying the surface region. The epitaxial material includes an n-type cladding region, an active region having at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active region. The epitaxial material is patterned to form the plurality of dies on the surface region, the dies corresponding to a laser device. Each of the plurality of dies includes a release region composed of a material with a smaller bandgap than an adjacent epitaxial material. A lateral width of the release region is narrower than a lateral width of immediately adjacent layers above and below the release region to form undercut regions bounding each side of the release region. Each die also includes a passivation region extending along sidewalls of the active region.

    MANUFACTURABLE MULTI-EMITTER LASER DIODE
    50.
    发明申请
    MANUFACTURABLE MULTI-EMITTER LASER DIODE 审中-公开
    可制造的多发射体激光二极管

    公开(公告)号:US20170063047A1

    公开(公告)日:2017-03-02

    申请号:US15351326

    申请日:2016-11-14

    Abstract: A multi-emitter laser diode device includes a carrier chip singulated from a carrier wafer. The carrier chip has a length and a width, and the width defines a first pitch. The device also includes a plurality of epitaxial mesa dice regions transferred to the carrier chip from a substrate and attached to the carrier chip at a bond region. Each of the epitaxial mesa dice regions is arranged on the carrier chip in a substantially parallel configuration and positioned at a second pitch defining the distance between adjacent epitaxial mesa dice regions. Each of the plurality of epitaxial mesa dice regions includes epitaxial material, which includes an n-type cladding region, an active region having at least one active layer region, and a p-type cladding region. The device also includes one or more laser diode stripe regions, each of which has a pair of facets forming a cavity region.

    Abstract translation: 多发射体激光二极管器件包括从载体晶片分离的载体芯片。 载体芯片具有长度和宽度,宽度限定第一间距。 该器件还包括从衬底转移到载体芯片并在键合区附接到载体芯片的多个外延台面区域。 每个外延台面区域以基本上平行的构造布置在载体芯片上,并且以限定相邻外延台面区域之间的距离的第二间距定位。 多个外延台面区域中的每一个包括外延材料,其包括n型包层区域,具有至少一个有源层区域的有源区域和p型包层区域。 该器件还包括一个或多个激光二极管条纹区域,每个区域具有形成空腔区域的一对小面。

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