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公开(公告)号：US5300588A
公开(公告)日：1994-04-05
申请号：US863271
申请日：1992-04-03
CPC分类号： C08L79/085 , C08L83/10
摘要： A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.
摘要翻译： 热固性树脂组合物含有（A）具有马来酰亚胺基团的酰亚胺化合物，（B）环氧树脂，（C）酚醛树脂和任选的（D）芳族聚合物/有机聚硅氧烷共聚物，其中组分（B）和/或 （C）具有与芳族基团共轭的双键和（B）成分和/或（C）具有萘环。 该组合物易于加工和固化，具有改进的粘合性，耐热性，低热膨胀性和低吸水性的产品。
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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44.发明申请SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION METHOD, AND SEMICONDUCTOR DEVICE 有权半导体封装环氧树脂组合物，制备方法和半导体器件公开(公告)号：US20090192258A1
公开(公告)日：2009-07-30
申请号：US12357764
申请日：2009-01-22
申请人： Tomoyoshi Tada , Shoichi Osada , Miyuki Wakao , Kazutoshi Tomiyoshi , Kenichi Totsuka , Tadaharu Ikeda
发明人： Tomoyoshi Tada , Shoichi Osada , Miyuki Wakao , Kazutoshi Tomiyoshi , Kenichi Totsuka , Tadaharu Ikeda
IPC分类号： C08L63/00
CPC分类号： C08G59/621 , C08K3/04 , C08L63/00
摘要： A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.
摘要翻译： 包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料和（D）炭黑）的半导体封装环氧树脂组合物通过将炭黑原料和固化剂与 将有机溶剂过滤掉残留在20微米开口的网片上的粗炭黑，从滤液中除去溶剂，得到固化剂和炭黑的预混合物，并将预混合物与剩余的组分捏合。
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公开(公告)号：US20100081748A1
公开(公告)日：2010-04-01
申请号：US12569433
申请日：2009-09-29
CPC分类号： H01L23/296 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L83/04 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , H01L2924/00014
摘要： The present invention provides a silicone resin composition for an optical semiconductor device, comprising(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c
摘要翻译： 本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由 下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基 具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。
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46.发明申请WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTICAL SEMICONDUCTOR CASE AND OPTICAL SEMICONDUCTOR CASE 有权白色热固性硅树脂组合物，用于模制光学半导体器件和光学半导体器件公开(公告)号：US20090239997A1
公开(公告)日：2009-09-24
申请号：US12405589
申请日：2009-03-17
IPC分类号： C08L83/06
CPC分类号： C08L83/06 , C08G77/26 , C08G77/28 , H01L2224/48091 , H01L2924/00014
摘要： A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.
摘要翻译： 提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。 组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。 固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。
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公开(公告)号：US09303115B2
公开(公告)日：2016-04-05
申请号：US12637359
申请日：2009-12-14
IPC分类号： C08K5/10 , C08L63/00 , C08G59/32 , C08G59/18 , C08G59/42 , C08L63/06 , H01L23/29 , H01L23/00 , H01L23/24
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译： 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。
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48.发明授权White heat-curable silicone resin composition, optoelectronic part case, and molding method 有权白色可热固化硅树脂组合物，光电部件外壳和成型方法公开(公告)号：US08013056B2
公开(公告)日：2011-09-06
申请号：US12344048
申请日：2008-12-24
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/011 , C08K3/10 , C08K3/22 , C08K5/0025 , C08K5/56 , C08K2003/2241 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
摘要翻译： 一种有机硅树脂组合物，其包含（A）熔点为40-130℃的可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）固化催化剂的转移或压缩 在高温下成型为具有白色，耐热性，耐光性和最小黄化的固化产物。 固化产品适用于封装有光电子部件的情况。
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49.发明授权White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case 有权用于模制光学半导体外壳和光学半导体外壳的白色热固性硅树脂组合物公开(公告)号：US08013057B2
公开(公告)日：2011-09-06
申请号：US12405589
申请日：2009-03-17
CPC分类号： C08L83/06 , C08G77/26 , C08G77/28 , H01L2224/48091 , H01L2924/00014
摘要： A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.
摘要翻译： 提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。 组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。 固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。
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公开(公告)号：US20100148380A1
公开(公告)日：2010-06-17
申请号：US12637359
申请日：2009-12-14
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12 (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译： 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。
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