公开(公告)号：US20190181046A1

公开(公告)日：2019-06-13

申请号：US15839769

申请日：2017-12-12

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chung-Liang Chu ,  Yu-Ruei Chen ,  Yu-Hsiang Lin

IPC: H01L21/82 ,  H01L27/02 ,  H01L27/088 ,  H01L27/092 ,  H01L23/528 ,  H01L23/50 ,  H01L23/522

Abstract: A method of fabricating an integrated circuit includes the following steps. A first reticle is used to form a first pattern, wherein the first pattern includes a first feature and a first jog part protruding from and orthogonal to the first feature. A second reticle is used to form a second pattern, wherein the second pattern includes a second feature, and the first feature is between the second feature and the first jog part. A third reticle is used to form a third pattern, wherein the third pattern includes a third-one feature overlapping the first jog part and a third-two feature overlapping the second feature.

公开(公告)号：US10249488B1

公开(公告)日：2019-04-02

申请号：US15866489

申请日：2018-01-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chih-Kai Hsu ,  Ssu-I Fu ,  Chun-Ya Chiu ,  Chin-Hung Chen ,  Chi-Ting Wu ,  Yu-Hsiang Lin

IPC: H01L21/02 ,  H01L21/67 ,  H01L29/49 ,  H01L29/66 ,  H01L29/78 ,  H01L21/762 ,  H01L27/088 ,  H01L29/165

Abstract: A semiconductor device with three transistors of same conductive type but different threshold voltage is provided in the present invention, wherein the first transistor includes a high-k dielectric layer, a first bottom barrier metal layer, a second bottom barrier metal layer, a work function metal layer and a low resistance metal. The second transistor includes the high-k dielectric layer, the first bottom barrier metal layer, the second bottom barrier metal layer and the low resistance metal, and a third transistor on the substrate. The third transistor includes the high-k dielectric layer, the first bottom barrier metal layer and the low resistance metal.

公开(公告)号：US09876116B2

公开(公告)日：2018-01-23

申请号：US15617099

申请日：2017-06-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yu-Ping Wang ,  Jyh-Shyang Jenq ,  Yu-Hsiang Lin ,  Hsuan-Hsu Chen ,  Chien-Hao Chen ,  Yi-Han Ye

IPC: H01L29/78 ,  H01L29/66

CPC classification number: H01L29/785 ,  H01L29/66795

Abstract: A semiconductor structure and a manufacturing method for the same are disclosed. The semiconductor structure includes a first gate structure, a second gate structure and a second dielectric spacer. Each of the first gate structure and the second gate structure adjacent to each other includes a first dielectric spacer. The second dielectric spacer is on one of opposing sidewalls of the first gate structure and without being disposed on the dielectric spacer of the second gate structure.

公开(公告)号：US20170271504A1

公开(公告)日：2017-09-21

申请号：US15617099

申请日：2017-06-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yu-Ping Wang ,  Jyh-Shyang Jenq ,  Yu-Hsiang Lin ,  Hsuan-Hsu Chen ,  Chien-Hao Chen ,  Yi-Han Ye

IPC: H01L29/78 ,  H01L29/66

CPC classification number: H01L29/785 ,  H01L29/66795

Abstract: A semiconductor structure and a manufacturing method for the same are disclosed. The semiconductor structure includes a first gate structure, a second gate structure and a second dielectric spacer. Each of the first gate structure and the second gate structure adjacent to each other includes a first dielectric spacer. The second dielectric spacer is on one of opposing sidewalls of the first gate structure and without being disposed on the dielectric spacer of the second gate structure.

公开(公告)号：US20160315171A1

公开(公告)日：2016-10-27

申请号：US14727853

申请日：2015-06-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yu-Hsiang Hung ,  Chao-Hung Lin ,  Chih-Kai Hsu ,  Ssu-I Fu ,  Jyh-Shyang Jenq ,  Jun-Jie Wang ,  En-Chiuan Liou ,  Chih-Wei Yang ,  Chih-Sen Huang ,  Ching-Wen Hung ,  Hung-Chan Lin ,  Yu-Hsiang Lin

IPC: H01L29/66 ,  H01L29/49 ,  H01L29/423 ,  H01L21/28

CPC classification number: H01L29/66545 ,  H01L21/28088 ,  H01L21/28114 ,  H01L21/823842 ,  H01L27/092 ,  H01L29/42376 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/6653

Abstract: A method for manufacturing a semiconductor device having a metal gate includes forming a filling layer and a high-K gate dielectric layer in the first recess between a pair of spacers, wherein the high-K gate dielectric layer and the filling layer are stacked in the first recess sequentially, and an exposed top surface of the high-K gate dielectric layer and a top surface of the filling layer are lower than a top surface of each spacer; and removing a part of each spacer and widening the first recess on the top surface of the filling layer to form a second recess, wherein a width of the second recess is larger than a width of the first recess.

Abstract translation: 一种具有金属栅极的半导体器件的制造方法包括在一对间隔物之间​​的第一凹部中形成填充层和高K栅极电介质层，其中高K栅极介电层和填充层堆叠在 第一凹部，高K栅极电介质层的露出顶表面和填充层的顶表面比每个间隔物的顶表面低; 并且移除每个间隔物的一部分并加宽填充层的顶表面上的第一凹部以形成第二凹部，其中第二凹部的宽度大于第一凹部的宽度。

公开(公告)号：US20240371703A1

公开(公告)日：2024-11-07

申请号：US18773598

申请日：2024-07-16

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chih-Kai Hsu ,  Ssu-I Fu ,  Chun-Ya Chiu ,  Chi-Ting Wu ,  Chin-Hung Chen ,  Yu-Hsiang Lin

IPC: H01L21/8234 ,  H01L27/088 ,  H01L29/06

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, a first isolation structure on the SDB structure, a shallow trench isolation (STI) adjacent to the SDB structure, and a second isolation structure on the STI. Preferably, the first isolation structure further includes a cap layer on the SDB structure and a dielectric layer on the cap layer.

公开(公告)号：US20240355894A1

公开(公告)日：2024-10-24

申请号：US18757573

申请日：2024-06-28

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Hua Tsai ,  Jung Han ,  Ming-Chi Li ,  Chih-Mou Lin ,  Yu-Hsiang Hung ,  Yu-Hsiang Lin ,  Tzu-Lang Shih

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/08 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/42368 ,  H01L29/0607 ,  H01L29/0847 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7833

Abstract: A semiconductor device includes a semiconductor substrate, a first gate oxide layer, and a first source/drain doped region. The first gate oxide layer is disposed on the semiconductor substrate, and the first gate oxide layer includes a main portion and an edge portion having a sloping sidewall. The first source/drain doped region is disposed in the semiconductor substrate and located adjacent to the edge portion of the first gate oxide layer. The first source/drain doped region includes a first portion and a second portion. The first portion is disposed under the edge portion of the first gate oxide layer in a vertical direction, and the second portion is connected with the first portion.

公开(公告)号：US20240313046A1

公开(公告)日：2024-09-19

申请号：US18134555

申请日：2023-04-13

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Guang-Yu Lo ,  Chun-Tsen Lu ,  Chung-Fu Chang ,  Chih-Shan Wu ,  Yu-Hsiang Lin ,  Wei-Hao Chang

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/0649 ,  H01L29/66795 ,  H01L29/7851

Abstract: A method for fabricating a semiconductor device includes the steps of forming a fin-shaped structure on a substrate, forming a first trench and a second trench in the fin-shaped structure, forming a first dielectric layer in the first trench and the second trench, removing part of the first dielectric layer, forming a second dielectric layer in the first trench and the second trench to form a first single diffusion break (SDB) structure and a second SDB structure, and then forming a gate structure on the fin-shaped structure, the first SDB structure, and the second SDB structure.

公开(公告)号：US20230326805A1

公开(公告)日：2023-10-12

申请号：US18209490

申请日：2023-06-14

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chih-Kai Hsu ,  Ssu-I Fu ,  Chun-Ya Chiu ,  Chi-Ting Wu ,  Chin-Hung Chen ,  Yu-Hsiang Lin

IPC: H01L21/8234 ,  H01L29/06 ,  H01L27/088

CPC classification number: H01L21/823481 ,  H01L21/823431 ,  H01L29/0649 ,  H01L27/0886

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a single diffusion break (SDB) structure in the substrate to divide the fin-shaped structure into a first portion and a second portion; forming a first gate structure on the SDB structure; forming an interlayer dielectric (ILD) layer around the first gate structure; transforming the first gate structure into a first metal gate; removing the first metal gate to form a first recess; and forming a dielectric layer in the first recess.

公开(公告)号：US20230270017A1

公开(公告)日：2023-08-24

申请号：US17703967

申请日：2022-03-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hung-Yi Wu ,  Jia-Rong Wu ,  Yu-Hsiang Lin ,  Yi-Wen Chen ,  Kun-Sheng Yang

IPC: H01L43/12 ,  H01L21/308

CPC classification number: H01L43/12 ,  H01L21/308

Abstract: A method for fabricating a semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) on a substrate, forming a spin orbit torque (SOT) layer on the MTJ, forming an inter-metal dielectric (IMD) layer around the MTJ and the SOT layer, forming a first hard mask on the IMD layer, forming a semiconductor layer on the first hard mask, and then patterning the first hard mask.