公开(公告)号：US08010222B2

公开(公告)日：2011-08-30

申请号：US12032112

申请日：2008-02-15

Applicant: Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

Inventor： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC: G06F19/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

Abstract: Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

Abstract translation: 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US07893703B2

公开(公告)日：2011-02-22

申请号：US11465893

申请日：2006-08-21

Applicant: Jeffrey A. Rzepiela ,  Yiping Feng ,  Shiyou Pei ,  Alexander Kagan ,  Jianou Shi ,  Sergio Edelstein

Inventor： Jeffrey A. Rzepiela ,  Yiping Feng ,  Shiyou Pei ,  Alexander Kagan ,  Jianou Shi ,  Sergio Edelstein

IPC: G01R31/308

CPC classification number: G01R31/2831 ,  G01R31/2856 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.

Abstract translation: 提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源，其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。

公开(公告)号：US07751046B2

公开(公告)日：2010-07-06

申请号：US10401242

申请日：2003-03-27

Applicant: Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdulhalim

Inventor： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdulhalim

IPC: G01B11/00 ,  G01N21/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/02

CPC classification number: G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract translation: 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07747062B2

公开(公告)日：2010-06-29

申请号：US11270771

申请日：2005-11-09

Applicant: Da Chen ,  Christophe Fouquet ,  Saibal Banerjee ,  Santosh Bhattacharyya ,  Joe Wang ,  Lian Yao ,  Mike van Riet ,  Igor Germanenko

Inventor： Da Chen ,  Christophe Fouquet ,  Saibal Banerjee ,  Santosh Bhattacharyya ,  Joe Wang ,  Lian Yao ,  Mike van Riet ,  Igor Germanenko

IPC: G06K9/00

CPC classification number: G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/95607 ,  G06T2207/30148

Abstract: Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.

Abstract translation: 提供了用于定位缺陷评估过程中的缺陷的方法，缺陷评估工具和系统。 一种方法包括从检查工具获取一个或多个图像和数据。 一个或多个图像示出了待检查的缺陷所在的样本上的区域。 数据表示该区域内缺陷的位置和特征。 该方法还包括使用缺陷评估工具的成像子系统获取在数据中指示的缺陷的位置附近的样本的一个或多个附加图像。 此外，该方法包括识别对应于一个或多个图像的一个或多个附加图像的一部分。 所述方法还包括使用所述数据确定所述一个或多个附加图像的所述部分内的所述缺陷的位置。

公开(公告)号：US07746459B2

公开(公告)日：2010-06-29

申请号：US11837220

申请日：2007-08-10

Applicant: Azmi Kadkly ,  Stephen Biellak ,  Mehdi Vaez-Iravani

Inventor： Azmi Kadkly ,  Stephen Biellak ,  Mehdi Vaez-Iravani

IPC: G01N21/00

CPC classification number: G01N21/9501

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.

Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括照明子系统，该照明子系统被配置为以倾斜的入射角将光引导到晶片上来照射晶片上的区域。 该系统还包括收集子系统，其被配置为同时收集从照明区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的相应位置。 另外，该系统包括检测子系统，该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光，并且响应于聚焦到图像平面中的对应位置的光单独产生输出。 该输出可用于检测晶圆上的缺陷。

公开(公告)号：US07728969B2

公开(公告)日：2010-06-01

申请号：US11949473

申请日：2007-12-03

Applicant: Jason Saito ,  Wei-Ning Shen

Inventor： Jason Saito ,  Wei-Ning Shen

IPC: G01N21/00

CPC classification number: G01N21/9501

Abstract: Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.

Abstract translation: 提供了用于识别晶片上的缺陷类型的各种方法和系统。 用于识别晶片上的缺陷类型的一种计算机实现的方法包括获取检查系统在晶片上检测到的缺陷的输出。 输出通过检查系统的照明和收集通道的不同组合来获取。 该方法还包括基于由一组不同组合获取的输出来识别缺陷的缺陷类型。 基于要在晶片上识别的缺陷类型和晶片类型来选择不同组合的集合，使得使用不同组合的照明和采集通道的不同组合来识别不同的不同缺陷类型 晶圆类型。

公开(公告)号：US07728965B2

公开(公告)日：2010-06-01

申请号：US11145874

申请日：2005-06-06

Applicant: Kurt Lindsay Haller ,  Steve Yifeng Cui ,  Jared Lera

Inventor： Kurt Lindsay Haller ,  Steve Yifeng Cui ,  Jared Lera

IPC: G01N21/00

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/95623 ,  G01N2021/8822 ,  H01L22/12

Abstract: Systems and methods for inspecting an edge of a specimen are provided. One system includes an illumination subsystem configured to direct light to the edge of the specimen at an oblique angle of incidence. The plane of incidence of the light is substantially perpendicular to a plane substantially tangent to the edge of the specimen. The system also includes a detection subsystem configured to collect light scattered from the edge and to generate signals responsive to the scattered light. One method includes directing light to the edge of the specimen at an oblique angle of incidence. The plane of incidence is substantially perpendicular to a plane substantially tangent to the edge of the specimen. The method also includes collecting light scattered from the edge and generating signals responsive to the scattered light. The signals described above can be used to detect defects on the edge of the specimen.

Abstract translation: 提供了用于检查试样边缘的系统和方法。 一个系统包括照明子系统，其构造成以倾斜的入射角将光引导到样品的边缘。 光的入射面基本上垂直于基本上与试样边缘相切的平面。 该系统还包括检测子系统，该检测子系统被配置为收集从边缘散射的光并产生响应于散射光的信号。 一种方法包括以倾斜的入射角将光引导到样品的边缘。 入射平面基本上垂直于基本上与样品边缘相切的平面。 该方法还包括收集从边缘散射的光并产生响应于散射光的信号。 上述信号可用于检测样品边缘的缺陷。

公开(公告)号：US07711177B2

公开(公告)日：2010-05-04

申请号：US11422955

申请日：2006-06-08

Applicant: Brian Leslie ,  Ashok Kulkarni

Inventor： Brian Leslie ,  Ashok Kulkarni

IPC: G06K9/00 ,  G01N37/00 ,  G01D3/00

CPC classification number: G01N21/9501 ,  G01N2021/8825

Abstract: Various methods, carrier media, and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data are provided. One computer-implemented method includes combining pixel-level data acquired for the specimen by a bright field channel and a dark field channel of an inspection system. The method also includes detecting defects on the specimen by applying a two-dimensional threshold to the combined data. The two-dimensional threshold is defined as a function of a threshold for the data acquired by the bright field channel and a threshold for the data acquired by the dark field channel.

Abstract translation: 提供了使用明场通道数据和暗场通道数据的组合来检测样本上的缺陷的各种方法，载体介质和系统。 一种计算机实现的方法包括将通过亮场通道获取的像素级数据和检查系统的暗场通道组合。 该方法还包括通过对组合数据应用二维阈值来检测样本上的缺陷。 二维阈值被定义为由亮场通道获取的数据的阈值和由暗场通道获取的数据的阈值的函数。

公开(公告)号：US07705331B1

公开(公告)日：2010-04-27

申请号：US11771430

申请日：2007-06-29

Applicant: Greg Kirk ,  Rich Solarz ,  Chris Kirk ,  Gil Delgado ,  Anatoly Schemelinin ,  Jim Li ,  Qibiao Chen ,  Charles Nenghe Wang

Inventor： Greg Kirk ,  Rich Solarz ,  Chris Kirk ,  Gil Delgado ,  Anatoly Schemelinin ,  Jim Li ,  Qibiao Chen ,  Charles Nenghe Wang

IPC: G21G4/00

CPC classification number: G03F7/70616 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8825 ,  G01N2201/061 ,  G03F7/70033 ,  G03F7/70575 ,  H01J65/04

Abstract: Methods and systems for providing illumination of a specimen for a process performed on the specimen are provided. One system configured to provide illumination of a specimen for a process performed on the specimen includes a laser configured to generate excitation light. The system also includes focusing optics configured to focus the excitation light to a plasma in an electrodeless lamp such that the plasma generates light. The system is also configured such that the light illuminates the specimen during the process.

Abstract translation: 提供了用于提供用于对样本进行的处理的样本的照明的方法和系统。 被配置为提供对于在样本上执行的处理的样本的照明的一个系统包括被配置为产生激发光的激光器。 该系统还包括配置成将激发光聚焦到无电极灯中的等离子体的聚焦光学元件，使得等离子体产生光。 该系统还被配置为使得该光在该过程期间照射样本。

公开(公告)号：US07580124B2

公开(公告)日：2009-08-25

申请号：US11974033

申请日：2007-10-10

Applicant: Zongqiang Yu

Inventor： Zongqiang Yu

IPC: G01N21/88

CPC classification number: G03F1/84 ,  G01N21/95607

Abstract: A method and apparatus for inspecting patterned substrates, such as photomasks, for unwanted particles and features occurring on the transmissive as well as pattern defects. A transmissive substrate is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and reflected light collection optics and detectors collect and generate signals representative of the light transmitted and reflected by the substrate. The defect identification of the substrate is performed using transmitted and reflected light signals from a baseline comparison between two specimens, or one specimen and a database representation, to form a calibration pixelated training set including a non-defective region. This calibration pixilated training set is compared to a transmitted-reflected plot map of the subject specimen to assess surface quality.

Abstract translation: 用于检查诸如光掩模的图案化衬底的方法和装置，用于在透射以及图案缺陷上出现的不期望的颗粒和特征。 透射式衬底由激光器通过由激光扫描系统，单独透射和反射光收集光学器件组成的光学系统照射，并且检测器收集和产生表示由衬底透射和反射的光的信号。 使用来自两个样本之间的基线比较的透射和反射光信号，或一个样本和数据库表示来执行衬底的缺陷识别，以形成包括无缺陷区域的校准像素化训练集。 将该校准像素化训练集与主体样本的透射反射曲线图进行比较，以评估表面质量。