Abstract:
Various embodiments of a millimeter-wave system operative to enhance propagation of millimeter-waves inside a laminate waveguide structure, in which electrical energy has leaked outside the laminated waveguide structure. The system comprises a laminate waveguide structure inside a printed circuit board, and an electrically conductive fence also inside the printed circuit board but outside the laminate waveguide structure. In various embodiments, the electrical energy of millimeter-waves leaks outside the laminate waveguide structure and is reflected by the electrically conducive fence back into the laminate waveguide structure.
Abstract:
A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.
Abstract:
A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.
Abstract:
A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
Abstract:
A system includes a networking enabled system and a packet radio system. The packet radio system includes a wireless interface and a packet interface. The packet interface includes at least two queues, each queue configured to store a certain class of packets of Ethernet. A cable is operative to transport the packets from the networking enabled system to the packet interface using Ethernet signaling. The packet interface is configured to ascertain from time to time the rate at which the packets are sent from the queues over the wireless interface, and according to the rate, indicate dynamically to the network enabled system the classes of packets for which packets are to be sent over the cable for storage in the appropriate queues. The network enabled system is configured to send, over the cable, packets of classes indicated by the packet interface, while holding back other packets.
Abstract:
A clock extractor extracts clock frequency f2, from a wired data connection feeding the transmitter with data clocked at the clock frequency f2. A clock error estimator estimates clock frequency error between the clock frequency f2 and a clock frequency f1 derived from a local clock of the transmitter. Clock adder adds the clock frequency error to the clock frequency f1, resulting in a synthesized clock frequency f2. A modulator uses the synthesized clock frequency f2, to modulate a data stream into a modulated signal.
Abstract:
A Point-to-Point communication system includes (i) a millimeter-wave channel having a substantially flat channel transfer function between a first frequency of millimeter-waves and a second frequency of millimeter-waves, the two frequencies are separated by at least 500 MHz, (ii) a transmission system configured to transmit an Orthogonal Frequency Division Multiplexing (OFDM) signal having a bandwidth of at least 100 MHz over the millimeter-wave channel as a millimeter-wave signal located between the first frequency and the second frequency, and (iii) a reception system comprising a radio receiver having a substantially non-flat reception transfer function over the bandwidth of the OFDM signal, configured to receive the millimeter-wave signal via the millimeter-wave channel and down-convert the millimeter-wave signal into a reconstruction of the OFDM signal having a bandwidth of at least 100 MHz, and an OFDM de-modulator configured to compensate for the substantially non-flat reception transfer function, by de-modulating the reconstruction of the OFDM signal.
Abstract:
Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.
Abstract:
A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
Abstract:
A method of automatic alignment of two directional beams having a known path attenuation, and an antenna gain pattern, for mutual transmission, comprises: determining a beam width between two angles of minimal detectable connection on either side of a beam maximum; then mapping points onto a scan field in a regular pattern, the pattern based on the beam width, such that a beam with the determined beam width is detected once if the beam is in the scan field at all; scanning the first antenna over the mapped scan points; and for each point allowing the second antenna to scan over all of its own set of mapped scan points, thereby providing a coarse alignment of the two antennas to achieve at least a minimal mutual connection. The coarse alignment may be followed by a fine alignment to maximize the signal.