公开(公告)号：US20100233243A1

公开(公告)日：2010-09-16

申请号：US12161503

申请日：2007-01-18

申请人： Shinya Izumida ,  Takashi Iwade

发明人： Shinya Izumida ,  Takashi Iwade

IPC分类号： A61K47/00 ,  B32B37/14

CPC分类号： A61K9/5089 ,  A61J3/077 ,  A61K9/50 ,  A61K9/7007 ,  B01J13/043

摘要： Disclosed is a laminated microcapsule sheet which is produced using a lamination apparatus B and a water repellency imparting apparatus A, wherein the lamination apparatus B is used for laminating multiple types of materials at multiple parts on an edible film to form a laminated microcapsule sheet and the water repellency imparting apparatus A is used for imparting water repellency to the surface of the edible sheet. The sheet is improved in the disadvantages attributable to the water soluble property of an edible film.

摘要翻译： 公开了使用层压装置B和拒水赋予装置A制造的层压微胶囊片，其中层压装置B用于在可食用膜上的多个部分层叠多种材料以形成层压微胶囊片，并且 防水性赋予装置A用于赋予可食用片材的表面防水性。 改善了可食用膜的水溶性的缺点。

公开(公告)号：US07753253B2

公开(公告)日：2010-07-13

申请号：US11594766

申请日：2006-11-09

申请人： Katsumi Terada ,  Takashi Takei

发明人： Katsumi Terada ,  Takashi Takei

IPC分类号： B29C31/00 ,  H01L23/29 ,  B23K1/012

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

摘要： A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

摘要翻译： 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。

公开(公告)号：US20090321895A1

公开(公告)日：2009-12-31

申请号：US12304957

申请日：2007-05-30

申请人： Masamichi Yamashita ,  Takashi Iwade ,  Kohshi Taguchi ,  Mitsuo Yamazaki

发明人： Masamichi Yamashita ,  Takashi Iwade ,  Kohshi Taguchi ,  Mitsuo Yamazaki

IPC分类号： H01L21/31 ,  H01L29/06

CPC分类号： C23C16/30 ,  C23C16/401 ,  H01L51/5256

摘要： Issue Providing a silicon film which can prevent damage of electronic devices formed on a substrate from occurrence, can prevent apparatus arrangement from becoming large-scale one, can improve coherency of a silicon thin film to a substrate, and is hardly happened crack and/or flaking, and providing a method for forming the silicon thin film.Solving Means A method for forming a silicon thin film according to the present invention is a method for forming a silicon thin film having isolation function or barrier function, on a substrate K using CVD method, and comprises a step for forming a first thin film on the substrate using plasma CVD method employing gas containing hydrogen element and a gas containing silicon element; a step for forming a second thin film using plasma CVD method employing a gas containing nitrogen element and a gas containing silicon element; and a step for forming a third thin film using plasma CVD method employing a gas containing oxygen element and a gas containing silicon element.

摘要翻译： 问题提供能够防止在基板上形成的电子器件的损坏的硅膜可以防止装置排列变大，可以提高硅薄膜与基板的一致性，并且几乎不发生裂纹和/或 剥离，提供形成硅薄膜的方法。 解决方法根据本发明的形成硅薄膜的方法是使用CVD法在基板K上形成具有隔离功能或阻挡功能的硅薄膜的方法，并且包括用于形成第一薄膜的步骤 使用等离子体CVD法的基板，其使用含有氢元素的气体和含有硅元素的气体; 使用含有氮元素的气体和含有硅元素的气体的等离子体CVD法形成第二薄膜的工序; 以及使用含有氧元素的气体和含有硅元素的气体的等离子体CVD法形成第三薄膜的工序。

公开(公告)号：US20090071703A1

公开(公告)日：2009-03-19

申请号：US11910981

申请日：2006-04-04

申请人： Makoto Imahori ,  Takashi Nakaya ,  Masanori Akita ,  Kousei Nogami ,  Teruo Tagai

发明人： Makoto Imahori ,  Takashi Nakaya ,  Masanori Akita ,  Kousei Nogami ,  Teruo Tagai

IPC分类号： H05K1/11 ,  H05K1/00 ,  B29C65/00 ,  B29C65/02

CPC分类号： H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K1/095 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0145 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K2203/1453 ,  H01L2224/2919 ,  H01L2924/00014

摘要： The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 μm or more and 10 μm or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1′) is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C. smaller than that of the resin constituting the conductive paste may be provided.

摘要翻译： 本发明提供一种适于形成和保护电路，电极等的导电膏，并且能够在短时间内连接多个电路板的电极，电路板，耐湿性优异的电路构件 耐热性等，以及电路用品的制造方法。 本发明的导电性糊剂包括鳞片状的平均粒径为1μm以上且10μm以下的导电性材料，并且为选自Ag，Ag合金，Ag涂层 材料和Ag合金涂覆材料，以及在25℃下的储能模量为100MPa以上的树脂。 本电路板（1'）设有基板（11）和使用上述导电浆料形成在基板（11）的至少一侧上的电极（12）。 在电极（12）的表面上，可以设置由比构成导电性浆料的树脂小25℃的储能模量的组合物构成的粘合绝缘区域。

公开(公告)号：US07279358B2

公开(公告)日：2007-10-09

申请号：US10511986

申请日：2003-04-22

申请人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

发明人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L21/67092 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.

摘要翻译： 安装方法包括以下步骤：在定位被相对于彼此粘合的物体之后，移动位于其周围的可动壁直到与一个物体保持装置接触以形成具有局部封闭空间的局部室， 室，减小了室中的压力，使物体保持装置沿着减小室的体积的方向移动，并且随着物体保持装置的移动而移动可移动壁，并且通过按压将两个物体彼此粘合。 由于接合部分和接合部分附近可以局部地且有效地从周围环绕，所以局部室也可以在接合时保持封闭状态的同时通过接合操作改变封闭空间的形状。

公开(公告)号：US20060219166A1

公开(公告)日：2006-10-05

申请号：US11387865

申请日：2006-03-24

申请人： Junichi Uehara ,  Takashi Iwade

发明人： Junichi Uehara ,  Takashi Iwade

IPC分类号： B05B13/02

CPC分类号： B05C11/10 ,  B05C5/0254 ,  G03F7/16

摘要： An applicator device comprises a reservoir tank trapping embrocation, a stage holding a substrate, a ferrule having a slit-shaped opening section above the stage, a fluid transfer pump guiding the embrocation within the reservoir tank to the ferrule, a first opening and closing valve between a suction opening of the fluid transfer pump and the reservoir tank, opening when a suction operation is carried out and closing when a discharge operation is carried out, a second opening and closing valve between a discharge opening of the fluid transfer pump and the ferrule, opening when a discharge operation is carried out and closing when a suction operation is carried out, and driving means relatively moving the ferrule and/or substrate when the slit-shaped opening section and the substrate are adjacent to one another, wherein the fluid transfer pump comprises a membranous sealing member sealing a gap between a cylinder and a plunger.

公开(公告)号：US06993832B2

公开(公告)日：2006-02-07

申请号：US10469299

申请日：2002-02-28

申请人： Akira Yamauchi

发明人： Akira Yamauchi

IPC分类号： B23P19/00

CPC分类号： H01L21/67259 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/681 ,  H01L24/81 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/5136 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip mounting device of the present invention includes: an adhesive application unit 11; a temporary crimp unit 12; and a main crimp unit 13. In the unit 11, a camera 21 is used for detecting base material marks for each section region on a film base material 1 and substrate marks for each substrate pattern in the section region. The detected results are transferred to the unit 12. In the unit 12, a camera 45 is used for detecting base material marks, and the position of each substrate pattern is recognized on the basis of on the detection results and the positional data of each substrate pattern transmitted from the unit 11, thereby crimping chips temporarily. This enables the chips to be mounted with high precision even when the film base material 1 is expanded and contracted. In the unit 12, there is no detection of substrate marks, which minimizes a decrease in processing efficiency.

摘要翻译： 本发明的芯片安装装置包括：粘合剂施加单元11; 临时压接单元12; 和主压接单元13。 在单元11中，相机21用于检测薄膜基材1上的每个区域的基材标记以及在区域中的每个基板图案的基板标记。 检测到的结果被传送到单元12。 在单元12中，使用照相机45来检测基材标记，并且基于从单元11发送的每个基板图案的检测结果和位置数据来识别每个基板图案的位置，由此压接芯片 暂时。 这使得即使当胶片基材1膨胀和收缩时，也能高精度地安装芯片。 在单元12中，没有检测到衬底标记，这使得处理效率的降低最小化。

公开(公告)号：US5900553A

公开(公告)日：1999-05-04

申请号：US750444

申请日：1997-02-05

申请人： Katsumi Hasegawa

发明人： Katsumi Hasegawa

IPC分类号： B65H54/70 ,  B65H54/22 ,  B65H63/00 ,  B65H67/04 ,  D01D7/00 ,  D01H13/32 ,  G01H1/00 ,  G01H13/00

CPC分类号： B65H54/22 ,  B65H63/00 ,  B65H2551/21 ,  B65H2557/65 ,  B65H2601/524 ,  B65H2701/31

摘要： A vibration pickup sensor 2, which captures vibration information generated from a winding apparatus, is affixed to a winding apparatus 1. This vibration information is sent to a center station 5 via a LAN 4, and stored therewithin. A host computer 8 outputs a yarn-switching command when the amount of yarn wound on the winding apparatus reaches a prescribed amount. Then, after the winding spindle of the winding apparatus 1 reaches stable rotation after a given amount of time, the center station 5 stores the above-noted vibration information from the vibration pickup sensor 2 into a storage apparatus 6 in a pre-established format. The winding apparatus is configured so as to output this stored information as appropriate to printer 7, display apparatus 10 of the like. This not only enables a maintenance system, which provides a grasp of the current operating condition of the winding apparatus, but also enables both easy detection of an abnormality occurring in a short period of time during spindle operation, and easy provision of abnormality location data in the case of an occurrence of an abnormality in a short period of time.

摘要翻译： PCT No.PCT / JP96 / 01168 Sec。 371日期1997年2月5日 102（e）日期1997年2月5日PCT提交1996年4月26日PCT公布。 公开号WO96 / 33939 日期：1996年10月31日收集从卷绕装置产生的振动信息的振动拾取传感器2固定在卷绕装置1上。该振动信息经由LAN4发送到中心站5，并存储在其中。 当卷绕在卷绕装置上的纱线的数量达到规定量时，主机8输出纱线切换指令。 然后，在给定时间后，卷绕装置1的卷绕主轴达到稳定旋转后，中心站5以预先确定的格式将来自振动拾取传感器2的上述振动信息存储到存储装置6中。 卷绕装置被配置为将该存储的信息适当地输出到打印机7，类似的显示装置10。 这不仅能够提供对卷绕装置的当前运行状况的掌握的维护系统，而且能够容易地检测主轴运转期间在短时间内发生的异常，并且容易地提供异常位置数据 在短时间内发生异常的情况。

公开(公告)号：US5566905A

公开(公告)日：1996-10-22

申请号：US211671

申请日：1994-04-12

申请人： Takashi Iwade ,  Jun Takagi ,  Yoshiro Migaki

发明人： Takashi Iwade ,  Jun Takagi ,  Yoshiro Migaki

IPC分类号： B65H54/28 ,  B65H54/38

CPC分类号： B65H54/2839 ,  B65H54/381 ,  B65H2701/31

摘要： To provide a traverse-motion mechanism capable of easing the threading operation by reducing the heights of the yarn-separating fulcrum and the godet roller disposed upstream of a yarn-traversing fulcrum, of reducing times required for the manufacturing and assembling operation by simplifying the structure due to the reduction of the overall machine height, of minimizing the rise of selvage and ribbon wind generated in a package, and of readily adjusting the position of yarn turning point. A traversing unit 6-1 disposed at one end of the traverse-motion mechanism is offset from a regular position toward another traversing unit 6-4 so that a straight line connecting the opposite traverse ends (A) and (B) in the traversing unit 6-1 with each other is not parallel to an axis of a touch roller 7. In the traversing unit 6-1, three blades 15-1 through 15-3 are fixed on a first rotor 13 and two blades 20-1 and 20-2 are fixed on a second rotor 18 at equiangular positions in a rotary plane thereof, while the rotary centers of the first and second rotors 13, 18 are defined so that a rotary angle of the respective rotor, through which the yarn is conveyed by one blade on the one rotor while being in contact with the yarn-guiding surface 23 until released therefrom, is about 60.degree. in the first rotor 13 and 90.degree. in the second rotor 18 and a rotational ratio of the first rotor 13 relative to the second rotor 18 is 2:3.

摘要翻译： PCT No.PCT / JP93 / 01163 Sec。 371日期1994年04月12日 102（e）日期1994年4月12日PCT 1993年8月19日PCT公布。 公开号WO94 / 04452 日期1994年3月3日为了提供一种能够通过降低分支支点和设置在纱线横动支点上游的导丝辊的高度来减轻穿线操作的横动运动机构，减少制造和组装所需的时间 通过简化由于整个机器高度的降低而导致的结构的操作，使包装中产生的边缘和带状风的上升最小化，并且容易地调节纱线转向点的位置。 设置在横动运动机构的一端的横动部6-1从规定位置朝向另一个横动部6-4偏移，使得在横动部中连接相反横动端（A）和（B）的直线 6-1彼此不平行于触摸辊7的轴线。在横动单元6-1中，三个叶片15-1至15-3固定在第一转子13上，两个叶片20-1和20 -2在其旋转平面中的等角位置处固定在第二转子18上，而第一和第二转子13,18的旋转中心被限定为使得转子的旋转角度 一个转子上的一个叶片与纱线引导表面23直接释放在一起，在第一转子13中为约60°，在第二转子18中为约90°，第一转子13相对于第一转子13的旋转比为 第二转子18为2:3。

公开(公告)号：US5179764A

公开(公告)日：1993-01-19

申请号：US735806

申请日：1991-07-25

申请人： Takashi Iwade ,  Kosei Nagata

发明人： Takashi Iwade ,  Kosei Nagata

IPC分类号： D01H5/60 ,  D01H5/64 ,  D01H11/00

CPC分类号： D01H5/64

摘要： A cleaner for a spinning machine which includes a plurality of drafting mechanisms arranged along an axis of the spinning machine. The cleaner includes a cleaning belt, arranged in each one of the drafting mechanisms to contact at least one drafting roller in the one drafting mechanism, for cleaning fiber dust and lint from at least one drafting roller in the one drafting mechanism; a transporting belt, arranged to contact each of the cleaning belts, for transporting the fiber dust and lint from each of the cleaning belts along the axis of the spinning machine; a scratch-off roller, which contacts the transporting belt and rotates at an angle relative to a running direction of the transporting belt, for removing the fiber dust and lint from the transporting roller; a mechanism for wiping fiber dust and lint from the scratch-off roller; and a mechanism for suctioning the fiber dust and lint which is wiped from the scratch-off roller by the wiping mechanism.