Porous material for ink stamps, production method therefor, and self-inking stamp
    42.
    发明申请
    Porous material for ink stamps, production method therefor, and self-inking stamp 审中-公开
    油墨邮票的多孔材料,其生产方法和自印墨

    公开(公告)号:US20140013974A1

    公开(公告)日:2014-01-16

    申请号:US13756315

    申请日:2013-01-31

    Abstract: A porous stamp material allows only resin in a region thereof irradiated with a laser beam during laser engraving in a production process of an ink stamp to be burnt and vaporized while preventing melting in any other unwanted region. The porous material for ink stamps comprises: at least one thermoplastic resin selected from the group consisting of low-density polyethylene, linear low-density polyethylene, high-density polyethylene, ethylene-alpha-olefin copolymer, ethylene-vinyl acetate copolymer, and ethylene-acrylic copolymer; at least one thermoplastic elastomer selected from a plurality of different hydrogenated styrene based thermoplastic elastomers; and at least one filler selected from a plurality of different inorganic compounds, wherein the thermoplastic resin and/or the thermoplastic elastomer are cross-linked, and formed in a continuous pore structure.

    Abstract translation: 在油墨印版的制造过程中,激光雕刻期间,多孔印模材料仅允许在激光雕刻区域中的树脂被烧焦和汽化,同时防止任何其它不想要的区域中的熔化。 用于墨迹的多孔材料包括:至少一种选自低密度聚乙烯,线性低密度聚乙烯,高密度聚乙烯,乙烯-α-烯烃共聚物,乙烯 - 乙酸乙烯酯共聚物和乙烯的热塑性树脂 丙烯酸共聚物; 至少一种选自多种不同氢化苯乙烯的热塑性弹性体的热塑性弹性体; 和选自多种不同的无机化合物的至少一种填料,其中所述热塑性树脂和/或所述热塑性弹性体是交联的,并形成为连续的孔结构。

    Porous material and method for fabricating same
    43.
    发明授权
    Porous material and method for fabricating same 有权
    多孔材料及其制造方法

    公开(公告)号:US08383024B2

    公开(公告)日:2013-02-26

    申请号:US12092487

    申请日:2006-11-06

    Abstract: A method for fabricating a porous structure from a first material. The method comprises the acts of mixing the first material with a second material to form a mixture, the first material having a melting point which is lower than the second material, heating the mixture under pressure to a temperature between a melting point of the first material and a melting point of the second material, cooling the molten mixture until it hardens and removing the second material from the first material. The method may also include a subsequent annealing step. There is also described a material suitable for implant, illustratively vertebral or spinal implants, comprising a rigid biocompatible polymer such as PEEK comprising a plurality of interconnected pores. The polymer illustratively has a porosity of between 50% and 85% by volume and in a particular embodiment is able to withstand pressures of up to 20 MPa. The porous PEEK material may also have a minimum thickness in any dimension of one (1) inch.

    Abstract translation: 一种从第一材料制造多孔结构的方法。 该方法包括将第一材料与第二材料混合以形成混合物的行为,第一材料具有低于第二材料的熔点,将压力下的混合物加热到第一材料的熔点之间的温度 和所述第二材料的熔点,冷却所述熔融混合物直到其硬化并从所述第一材料除去所述第二材料。 该方法还可以包括随后的退火步骤。 还描述了适合于植入物,例如脊椎或脊髓植入物的材料,其包含刚性生物相容性聚合物,例如包含多个互连孔的PEEK。 该聚合物示例性地具有50体积%至85体积%之间的孔隙率,并且在特定实施方案中能够承受高达20MPa的压力。 多孔PEEK材料也可以具有一(1)英寸的任何尺寸的最小厚度。

    METHOD FOR PRODUCING POROUS DEVICE
    50.
    发明申请
    METHOD FOR PRODUCING POROUS DEVICE 有权
    生产多孔器件的方法

    公开(公告)号:US20160237236A1

    公开(公告)日:2016-08-18

    申请号:US15140018

    申请日:2016-04-27

    Applicant: Vertera, Inc.

    Abstract: A method for making a polymer with a porous layer from a solid piece of polymer is disclosed. In various embodiments, the method includes heating a surface of a solid piece of polymer to a processing temperature below a melting point of the polymer and holding the processing temperature while displacing a porogen layer through the surface of the polymer to create a matrix layer of the solid polymer body comprising the polymer and the porogen layer. In at least one embodiment, the method also includes removing at least a portion of the layer of porogen from the matrix layer to create a porous layer of the solid piece of polymer.

    Abstract translation: 公开了一种由固体聚合物制备具有多孔层的聚合物的方法。 在各种实施方案中,该方法包括将聚合物固体片的表面加热至低于聚合物熔点的加工温度,并保持加工温度,同时使致孔剂层通过聚合物表面移动以形成基体层 包含聚合物和致孔剂层的固体聚合物体。 在至少一个实施方案中,该方法还包括从基质层去除致孔剂层的至少一部分以产生固体聚合物片的多孔层。

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