Abstract:
Negative working photoresist compositions containing:a) a polyimide primer containing recurring structural units of formula (I) in the specification as well asb) a photoinitiator for polymerizing olefin double bonds, which are characterized by in that they containat least one other component c), which is selected from the group consisting ofc1) organosilicon compounds with one or more hydroxyl groups,c2) compounds of formula (IIa) in the specification,c3) compounds of formula (IIb) as in the specification,c4) mixtures comprised of two or more components selected from components of c1), c2) and c3),have the advantage that they can be developed with a developer, which comprises up to 50 to 100 wt. % of an aqueous-alkaline medium, whereby the balance to 100 wt. % is formed by one or more organic solvents.
Abstract:
This invention relates to a photosensitive polymer composition containing as essential components (A) a soluble polymer, (B) a photopolymerizable compound having an ethylenic double bond in the molecule there of and (C) a photopolymerization initiator, the soluble polymer comprising a water-soluble polymer and an alcohol-soluble polymer, the composition having a sea-and-islands structure comprising sea containing the water-soluble polymer as a main component and islands containing the alcohol-soluble polymer as a main component, and the islands are independently in the form of sphere or oval having a diameter of 0.1 to 20 microns. The photosensitive polymer composition affords a printing plate having high image reproducibility and water-developability and capable of withstanding the coating of an aqueous polymer according to a printing method.
Abstract:
Novel photopolymerizable compositions are provided which comprise a dye sensitizer, a linear polyethylenimine as a polymerization initiator and a free radical polymerizable ethylenic unsaturated monomer.In the preferred embodiments, the linear polyethylenimine is used in combination with lithium acrylate.
Abstract:
A photosensitive polyamic acid derivative, compounds used in the manufacture of the derivative, method of manufacturing a polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method.
Abstract:
An improved process for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of a composition a polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups is applied to substrate such as a coated silicon wafer, which forms the base an electrical device, and is dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure having a sharp definition and good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.
Abstract:
A photosensitive resin composition comprising a polyamide containing 10 to 70% by weight of a polyoxyethylene segment or poly(oxyethylene/oxypropylene) copolymer segment having a number average molecular weight of from 150 to 1,500 in its molecular chain, and a photopolymerizable unsaturated compound. This composition exhibits excellent flexibility and water- and alcohol-developability, and results in a printing plate exhibiting excellent transparency, toughness and printing durability.
Abstract:
An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 - positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.
Abstract:
A photosensitive resin composition which comprises a polymer having a basic nitrogen atom in the main or side chain, which is represented by the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are each a hydrogen atom or a substituted or unsubstituted hydrocarbon group, at least one of R.sub.1 to R.sub.3 representing a polymeric chain, a photopolymerizable unsaturated monomer and a photosensitizer.
Abstract:
An onium salt having a partial structure of formula (A) is provided wherein Ra1 and Ra2 are hydrogen or a C1-C10 hydrocarbyl group in which hydrogen may be substituted by halogen and —CH2— may be replaced by —O— or —C(═O)—, both Ra1 and Ra2 are not hydrogen at the same time, Ra1 and Ra2 may bond together to form an aliphatic ring. A chemically amplified negative resist composition comprising the onium salt as acid generator forms a pattern of good profile having a high sensitivity, improved dissolution contrast, reduced LWR and improved CDU.
Abstract:
A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an alicyclic skeleton; (C) a photopolymerization initiator; and (D) one or more compounds selected from the group consisting of tetrazole and a tetrazole derivative.