Negative working photoresist composition based on polyimide primers
    41.
    发明授权
    Negative working photoresist composition based on polyimide primers 失效
    基于聚酰亚胺引物的负性光刻胶组合物

    公开(公告)号:US5856065A

    公开(公告)日:1999-01-05

    申请号:US800319

    申请日:1997-02-14

    CPC classification number: G03F7/0387 G03F7/037

    Abstract: Negative working photoresist compositions containing:a) a polyimide primer containing recurring structural units of formula (I) in the specification as well asb) a photoinitiator for polymerizing olefin double bonds, which are characterized by in that they containat least one other component c), which is selected from the group consisting ofc1) organosilicon compounds with one or more hydroxyl groups,c2) compounds of formula (IIa) in the specification,c3) compounds of formula (IIb) as in the specification,c4) mixtures comprised of two or more components selected from components of c1), c2) and c3),have the advantage that they can be developed with a developer, which comprises up to 50 to 100 wt. % of an aqueous-alkaline medium, whereby the balance to 100 wt. % is formed by one or more organic solvents.

    Abstract translation: 负性工作光致抗蚀剂组合物,其包含:a)在说明书中含有式(I)的重复结构单元的聚酰亚胺引物以及b)用于聚合烯烃双键的光引发剂,其特征在于它们含有至少一种其它组分c ),其选自c1)具有一个或多个羟基的有机硅化合物,c2)说明书中式(IIa)化合物,c3)如说明书中的式(IIb)化合物,c4)包含的混合物 的两种或更多种选自c1),c2)和c3)组分的组分具有的优点是它们可以用显影剂显影,显影剂包含至多50至100wt。 %的水性 - 碱性介质,其中余量为100wt。 %由一种或多种有机溶剂形成。

    Photosensitive polymer composition containing a soluble polymer of
islands-in-a-sea structure, a photopolymerizable polymer, and a
photopolymerization initiator
    42.
    发明授权
    Photosensitive polymer composition containing a soluble polymer of islands-in-a-sea structure, a photopolymerizable polymer, and a photopolymerization initiator 失效
    含有海岛结构的可溶性聚合物,可光聚合的聚合物和光聚合引发剂的光敏聚合物组合物

    公开(公告)号:US5688632A

    公开(公告)日:1997-11-18

    申请号:US277922

    申请日:1994-07-20

    CPC classification number: G03F7/037

    Abstract: This invention relates to a photosensitive polymer composition containing as essential components (A) a soluble polymer, (B) a photopolymerizable compound having an ethylenic double bond in the molecule there of and (C) a photopolymerization initiator, the soluble polymer comprising a water-soluble polymer and an alcohol-soluble polymer, the composition having a sea-and-islands structure comprising sea containing the water-soluble polymer as a main component and islands containing the alcohol-soluble polymer as a main component, and the islands are independently in the form of sphere or oval having a diameter of 0.1 to 20 microns. The photosensitive polymer composition affords a printing plate having high image reproducibility and water-developability and capable of withstanding the coating of an aqueous polymer according to a printing method.

    Abstract translation: 本发明涉及一种感光性聚合物组合物,其含有(A)可溶性聚合物,(B)在其分子中具有烯属双键的光聚合性化合物,(C)光聚合引发剂,所述可溶性聚合物包含水溶性聚合物, 可溶性聚合物和醇可溶性聚合物,所述组合物具有海岛结构,其包含含有水溶性聚合物作为主要成分的海藻和包含醇可溶性聚合物作为主要成分的岛,岛独立地在 直径为0.1至20微米的球形或卵形的形式。 感光性聚合物组合物提供具有高图像再现性和显色性的印刷版,并能够耐受根据印刷方法的水性聚合物的涂布。

    Photopolymerizable composition
    43.
    发明授权
    Photopolymerizable composition 失效
    可光聚合组合物

    公开(公告)号:US4696876A

    公开(公告)日:1987-09-29

    申请号:US862022

    申请日:1986-05-12

    Applicant: John J. Cael

    Inventor: John J. Cael

    Abstract: Novel photopolymerizable compositions are provided which comprise a dye sensitizer, a linear polyethylenimine as a polymerization initiator and a free radical polymerizable ethylenic unsaturated monomer.In the preferred embodiments, the linear polyethylenimine is used in combination with lithium acrylate.

    Abstract translation: 提供了新的可光聚合组合物,其包含染料敏化剂,作为聚合引发剂的线性聚乙烯亚胺和可自由基聚合的烯属不饱和单体。 在优选的实施方案中,线性聚乙烯亚胺与丙烯酸锂组合使用。

    Process of producing relief structures using polyamide ester resins
    45.
    发明授权
    Process of producing relief structures using polyamide ester resins 失效
    使用聚酰胺酯树脂生产浮雕结构的方法

    公开(公告)号:US4369247A

    公开(公告)日:1983-01-18

    申请号:US334163

    申请日:1981-12-24

    CPC classification number: C08F290/145 G03F7/037 H01L21/312

    Abstract: An improved process for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of a composition a polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups is applied to substrate such as a coated silicon wafer, which forms the base an electrical device, and is dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure having a sharp definition and good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition:a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

    Abstract translation: 用于在诸如电容器,集成电路,印刷电路和半导体的电气装置上形成浮雕结构的改进方法; 将包含可光聚合基团的聚酰胺酯树脂的聚合物耐热可光聚合组合物的组合物溶液施加到基底上,例如形成基底的电子器件的被覆硅晶片,并干燥以形成膜,该膜暴露 通过图案辐射和光聚合; 将未曝光和未聚合的薄膜部分溶解掉,将得到的浮雕结构转变成具有清晰清晰度和良好机械,化学和电学性能的聚酰亚胺结构; 为了减少辐射暴露时间并增加光聚合速率,在组合物中使用以下成分:辐射敏感的可聚合多官能丙烯酸酯化合物和芳族联咪唑的光聚合引发剂。

    Photosensitive polyamide resin composition
    46.
    发明授权
    Photosensitive polyamide resin composition 失效
    光敏聚酰胺树脂组合物

    公开(公告)号:US4323639A

    公开(公告)日:1982-04-06

    申请号:US202381

    申请日:1980-07-24

    CPC classification number: G03F7/037

    Abstract: A photosensitive resin composition comprising a polyamide containing 10 to 70% by weight of a polyoxyethylene segment or poly(oxyethylene/oxypropylene) copolymer segment having a number average molecular weight of from 150 to 1,500 in its molecular chain, and a photopolymerizable unsaturated compound. This composition exhibits excellent flexibility and water- and alcohol-developability, and results in a printing plate exhibiting excellent transparency, toughness and printing durability.

    Abstract translation: 一种感光性树脂组合物,其包含含有10〜70重量%的分子链中数均分子量为150〜1500的聚氧乙烯链段或聚(氧乙烯/氧丙烯)共聚物链段的聚酰胺和光聚合性不饱和化合物。 该组合物显示出优异的柔软性和水和醇显影性,并且导致显示出优异的透明性,韧性和印刷耐久性的印刷版。

    Water soluble photosensitive resin composition comprising a polyamide or
its ammonium salt
    48.
    发明授权
    Water soluble photosensitive resin composition comprising a polyamide or its ammonium salt 失效
    包含聚酰胺或其铵盐的水溶性感光性树脂组合物

    公开(公告)号:US4145222A

    公开(公告)日:1979-03-20

    申请号:US781307

    申请日:1977-03-25

    CPC classification number: G03F7/037 Y10S430/107

    Abstract: A photosensitive resin composition which comprises a polymer having a basic nitrogen atom in the main or side chain, which is represented by the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are each a hydrogen atom or a substituted or unsubstituted hydrocarbon group, at least one of R.sub.1 to R.sub.3 representing a polymeric chain, a photopolymerizable unsaturated monomer and a photosensitizer.

    Abstract translation: 一种感光性树脂组合物,其包含在主链或侧链具有碱性氮原子的聚合物,其由下式表示:其中R 1,R 2和R 3各自为氢原子或取代或未取代的烃基, 代表聚合物链的R1至R3中的至少一个,可光聚合的不饱和单体和光敏剂。

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