公开(公告)号：US20120255768A1

公开(公告)日：2012-10-11

申请号：US13528730

申请日：2012-06-20

申请人： Stephen P. Zadesky

发明人： Stephen P. Zadesky

IPC分类号： H05K1/11 ,  B32B3/24

CPC分类号： H01R4/024 ,  H01L2924/0002 ,  H01R4/027 ,  Y10T29/49149 ,  Y10T428/24273 ,  H01L2924/00

摘要： Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

摘要翻译： 提供带焊料容纳支架的电子组件。 焊料容纳支架可以具有平面基部和垂直延伸的壁。 壁可以从基部向上突出以形成封闭区域。 基座可以具有与封闭区域的形状对应的孔。 墙可能有一个开口。 电线可以插入开口。 线可以焊接到焊料容纳支架以形成将电线电连接到支架的焊接接头。 在封闭区域内形成的焊点可以具有由支架壁限定的尺寸。 可以通过回流焊膏层将焊料容纳支架焊接到印刷电路板上的焊盘上。

公开(公告)号：US20120028502A1

公开(公告)日：2012-02-02

申请号：US13271242

申请日：2011-10-12

申请人： CHENG-CHI YEH ,  NAN-HUNG LIN ,  ANDREW CHENG ,  CHIH-PI CHENG ,  SHUO-HSIU HSU ,  TING-YAO HUNG

发明人： CHENG-CHI YEH ,  NAN-HUNG LIN ,  ANDREW CHENG ,  CHIH-PI CHENG ,  SHUO-HSIU HSU ,  TING-YAO HUNG

IPC分类号： H01R24/00

CPC分类号： H01R12/57 ,  H01R4/024 ,  H01R12/716 ,  H01R13/2442 ,  H01R43/0256 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10325 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

摘要： An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.

摘要翻译： 电连接器包括绝缘壳体，其具有穿过其中延伸的多个通孔，组装到绝缘壳体上的多个触点，以及设置在通孔中的多个焊球，并且每个焊球被尾部和绝缘壳体扣紧。 每个触点包括固定到通孔的第一侧的垂直底部，从基部的顶端延伸的触点接合臂以及从基部的底端延伸的焊接部。 焊接部分具有在基部下方的波形布置，并且从基部突出到通孔的与所述第一侧相对的第二侧，以及从波浪组件向下延伸并能够从第一侧向第 第二面。

公开(公告)号：US07448923B2

公开(公告)日：2008-11-11

申请号：US11562905

申请日：2006-11-22

申请人： Harshad K Uka

发明人： Harshad K Uka

IPC分类号： H01R4/02

CPC分类号： H05K3/363 ,  H01R4/024 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

摘要： Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

摘要翻译： 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。

公开(公告)号：US20080139011A1

公开(公告)日：2008-06-12

申请号：US11562905

申请日：2006-11-22

申请人： Harshad K. Uka

发明人： Harshad K. Uka

IPC分类号： H01R12/00

CPC分类号： H05K3/363 ,  H01R4/024 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

摘要： Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

摘要翻译： 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。

公开(公告)号：US20080132096A1

公开(公告)日：2008-06-05

申请号：US11935784

申请日：2007-11-06

申请人： Hidehisa Yamagami

发明人： Hidehisa Yamagami

IPC分类号： H01R13/60

CPC分类号： H01R4/024 ,  H01R12/716 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10909

摘要： A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector; and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

摘要翻译： 电路板安装的连接器配备有绝缘壳体，其保持多排触点并安装在电路板上。 每个触点具有接触部分，用于接触另一连接器; 以及连接到电路板的腿部。 每个腿部具有从绝缘壳体的后壁延伸的延伸部分; 柔性部分，其与所述延伸部分连续形成; 以及从柔性部分沿基本上垂直于电路板的方向延伸并且连接到电路板的孔的直线部分。 在多排触点中，至少最靠近电路板的行具有远离电路板延伸的延伸部分，直到柔性部分。 每个腿部的直线部分是部分镀锡的。

公开(公告)号：US07309243B2

公开(公告)日：2007-12-18

申请号：US11129779

申请日：2005-05-16

申请人： Hidehisa Yamagami

发明人： Hidehisa Yamagami

IPC分类号： H01R12/00

CPC分类号： H01R4/024 ,  H01R12/716 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10909

摘要： A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector, and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

摘要翻译： 电路板安装的连接器配备有绝缘壳体，其保持多排触点并安装在电路板上。 每个触点具有用于接触另一个连接器的接触部分和连接到电路板的脚部分。 每个腿部具有从绝缘壳体的后壁延伸的延伸部分; 柔性部分，其与所述延伸部分连续形成; 以及从柔性部分沿基本上垂直于电路板的方向延伸并且连接到电路板的孔的直线部分。 在多排触点中，至少最靠近电路板的行具有远离电路板延伸的延伸部分，直到柔性部分。 每个腿部的直线部分是部分镀锡的。

公开(公告)号：US20060194458A1

公开(公告)日：2006-08-31

申请号：US11362698

申请日：2006-02-27

申请人： Tatsuya Miyazaki

发明人： Tatsuya Miyazaki

IPC分类号： H01R12/00

CPC分类号： H01R4/024

摘要： A fine-pitch terminal and connector reduces the size of a connector in a direction in which a large number of terminals are arranged in parallel. A terminal is applied to a connector, to which a cable having a conductor covered with an insulator is attached, the terminal being connected to the conductor of the cable by soldering. The terminal has a soldering region which is provided in a part of the terminal and to which the conductor of the cable is soldered, and the soldering region has a depression for receiving a fillet.

摘要翻译： 细间距端子和连接器在大量端子平行布置的方向上减小了连接器的尺寸。 将端子施加到连接器，其上安装有由绝缘体覆盖的导体的电缆，该端子通过焊接连接到电缆的导体。 端子具有设置在端子的一部分中并且电缆的导体被焊接到其上的焊接区域，并且焊接区域具有用于接收焊脚的凹陷部。

公开(公告)号：US06936785B2

公开(公告)日：2005-08-30

申请号：US10461231

申请日：2003-06-13

申请人： Akinori Oishi

发明人： Akinori Oishi

IPC分类号： B23K9/00 ,  H01R4/02 ,  H01R43/02 ,  H05K7/12 ,  B23K11/14

CPC分类号： H01R43/0207 ,  H01R4/024 ,  H01R4/027

摘要： A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit (11d) is formed to extend from a left slanted edge (11b) toward a widthwise center of the weldable portion (11a), and a lead (12a) is accommodated in the slit (11d). A meltable portion (11e) is provided between the slit (11d) and the leading end of the weldable portion (11a) including a tip (11c). When an electrode (D) of an arc welding machine discharges arcs toward the leading end of the weldable portion (11a), these arcs are created toward the tip (11c) to melt the weldable portion (11e) and connect the lead (12a) and the weldable portion (11a).

摘要翻译： 焊接结构（10）包括通过弯曲导电板（11）的前端形成的可焊接部分（11a）。 该可焊接部分（11a）形成有尖端（11c）。 此外，形成从左倾斜边缘（11b）朝向可焊接部分（11a）的宽度方向中心延伸的狭缝（11d），并且引线（12a）容纳在狭缝（11d）中， 。 在狭缝（11d）和包括尖端（11c）的可焊接部分（11a）的前端之间设置有可熔部分（11e）。 当电弧焊机的电极（D）朝向可焊接部分（11a）的前端排出弧时，朝着尖端（11c）产生这些电弧，以熔化可焊接部分（11e）并将引线 （12a）和可焊接部分（11a）。

公开(公告)号：US20040003936A1

公开(公告)日：2004-01-08

申请号：US10609527

申请日：2003-07-01

发明人： Hans-Michael Schmitt ,  Klaus Hemmert ,  Bernhard Knuettel ,  Oswald Reuss ,  Annegret Suckfuell

IPC分类号： H02G015/02

CPC分类号： H01R4/024 ,  H01R4/22 ,  H01R13/405 ,  H01R13/44 ,  H01R43/02 ,  H01R43/24 ,  Y10T29/49117 ,  Y10T29/49174 ,  Y10T29/49179

摘要： The mechanical connection of contacts through induction soldering is improved. To which end, a plastic dome is produced through preliminary encapsulation by injection molding of at least one contact and subsequent final encapsulation, where the two contact geometries to be joined can, for example, be premated. With an appropriate solder preform, the plug-in connection can be secured through induction soldering by enclosing this dome. The appropriate tool is then placed over the plastic dome, by which the heat generated melts the solder preform and securely joins the two contacts to one another.

摘要翻译： 触点通过感应焊接的机械连接得到改善。 为此，通过预先包封至少一个接触件和随后的最终包封来制造塑料圆顶，其中例如要预先接合两个接触几何形状。 使用适当的焊料预成型件，可以通过包围该圆顶的感应焊接来确保插入式连接。 然后将适当的工具放置在塑料圆顶上，由此产生的热量熔化焊料预制件并将两个触点牢固地连接在一起。

公开(公告)号：US06641410B2

公开(公告)日：2003-11-04

申请号：US09877920

申请日：2001-06-07

申请人： Edward G. Marvin ,  David M. McNamara

发明人： Edward G. Marvin ,  David M. McNamara

IPC分类号： H01R1200

CPC分类号： H05K3/3426 ,  H01R4/024 ,  H01R43/0249 ,  Y02P70/613

摘要： An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.