公开(公告)号：US20100314655A1

公开(公告)日：2010-12-16

申请号：US12561955

申请日：2009-09-17

Applicant: Joseph B. Thompson

Inventor： Joseph B. Thompson

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L33/62 ,  F21K9/00 ,  F21V19/004 ,  F21V19/0055 ,  F21V29/70 ,  F21V29/86 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/64 ,  H01L2224/73265 ,  H05K1/189 ,  H05K3/325 ,  H05K3/3431 ,  H05K2201/09027 ,  H05K2201/10106 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Apparatus may be provided including a high power light emitting diode (LED) unit, at least one printed circuit board, and an interfacing portion of a heat sink structure. The high power LED unit includes at least one LED die, at least one first lead and at least one second lead, and a heat sink interface. The at least one printed circuit board includes a conductive pattern configured to connect both the at least one first lead and the at least one second lead to a current source. The interfacing portion of the heat sink structure is that portion through which a majority of heat of the heat sink interface is transmitted. The interfacing portion is directly in touching contact with a majority of a heat transfer area of the heat sink interface.

Abstract translation: 可以提供包括大功率发光二极管（LED）单元，至少一个印刷电路板和散热器结构的接口部分的装置。 大功率LED单元包括至少一个LED管芯，至少一个第一引线和至少一个第二引线以及散热器接口。 所述至少一个印刷电路板包括被配置为将所述至少一个第一引线和所述至少一个第二引线连接到电流源的导电图案。 散热器结构的接口部分是传播散热器接口的大部分热量的部分。 接口部分与散热器接口的大部分传热区域直接接触。

公开(公告)号：US20100265711A1

公开(公告)日：2010-10-21

申请号：US12622036

申请日：2009-11-19

Applicant: Wei-Long Lee

Inventor： Wei-Long Lee

IPC: F21V21/00

CPC classification number: H05K1/142 ,  F21Y2115/10 ,  H05K3/0052 ,  H05K2201/09027 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/10363

Abstract: A substrate of the present invention is provided with a plurality of parallel-arranged functional sections. First and second connecting sections are provided on both ends of the functional sections. Every two adjacent functional sections are separable from one another and are respectively connected with different connecting sections so that the substrate can be separated into two daughter substrates having identical areas. The two daughter substrates of the substrate can be processed simultaneously before separated from each other, thus saving the processing time. When used by a user, one daughter substrate can be used independently as a light source or the two daughter substrates can be used opposite to each other so that the functional sections of the two daughter substrates are staggered.

Abstract translation: 本发明的基板具有多个平行排列的功能部。 第一和第二连接部分设置在功能部分的两端。 每两个相邻的功能部分彼此分离并且分别与不同的连接部分连接，使得基板可以分离成具有相同面积的两个子基板。 基板的两个子基板可以在彼此分离之前同时被处理，从而节省了处理时间。 当用户使用时，可以独立地使用一个子基板作为光源，或者可以将两个子基板彼此相对地使用，使得两个子基板的功能部分交错。

公开(公告)号：US20100046174A1

公开(公告)日：2010-02-25

申请号：US12340760

申请日：2008-12-22

Applicant: BAO-SHUAI LIU

Inventor： BAO-SHUAI LIU

IPC: H05K1/11 ,  H05K5/00

CPC classification number: H05K7/1417 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2203/167

Abstract: An electronic device includes chassis, a first printed circuit board, a second printed circuit board and a shell. The chassis includes a locating surface on which the first printed circuit board is mounted. The second printed circuit board is substantially perpendicularly mounted on the first circuit board and electrically coupled it. The shell is positioned on the locating surface to cover and receive the first and second printed circuit boards.

Abstract translation: 电子设备包括底盘，第一印刷电路板，第二印刷电路板和外壳。 底盘包括安装第一印刷电路板的定位表面。 第二印刷电路板基本垂直地安装在第一电路板上并电耦合。 壳体定位在定位表面上以覆盖和接收第一和第二印刷电路板。

公开(公告)号：US07614760B2

公开(公告)日：2009-11-10

申请号：US11710791

申请日：2007-02-26

Applicant: Raymond L. Sharrah ,  John C. DiNenna ,  C. Bradford Penney

Inventor： Raymond L. Sharrah ,  John C. DiNenna ,  C. Bradford Penney

IPC: F41G1/34

CPC classification number: H05K1/147 ,  F21S9/02 ,  F21V21/088 ,  F21V21/34 ,  F21V33/00 ,  F21V33/0064 ,  F21Y2115/10 ,  F21Y2115/30 ,  F41G1/35 ,  F41G11/003 ,  H05K1/189 ,  H05K2201/09027 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: A light comprises a light body for supporting an illumination light source and for receiving a battery, a first light source disposed in the light body for selectively providing illumination; a cover for receiving an optional second light source; a switch for selectively energizing the first light source, the optional second light source, or both; and a circuit structure for receiving electrical potential and providing electrical connections among the first light source, the optional second light source, the switch, and the terminals. The circuit structure may include portions in different planes, and may include a separable connector whereby the optional second light source may be removable.

Abstract translation: 光包括用于支撑照明光源并用于接收电池的灯体，设置在灯体中的用于选择性地提供照明的第一光源; 用于接收任选的第二光源的盖; 用于选择性地激励第一光源，可选的第二光源或两者的开关; 以及用于接收电位并在第一光源，可选的第二光源，开关和端子之间提供电连接的电路结构。 电路结构可以包括不同平面中的部分，并且可以包括可分离连接器，由此可选的第二光源可以是可移除的。

公开(公告)号：US20090151424A1

公开(公告)日：2009-06-18

申请号：US12000347

申请日：2007-12-12

Applicant: Chin-Ying Huang ,  Hsin-Ming Huang ,  Johnson Yen ,  Yen-Jen Yeh

Inventor： Chin-Ying Huang ,  Hsin-Ming Huang ,  Johnson Yen ,  Yen-Jen Yeh

IPC: G01N37/00

CPC classification number: H05K1/18 ,  H05K2201/09027 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: A detecting and measuring device includes a base member, a circuit board secured on the base member, and a covering member secured on the base member to cover the circuit board; the circuit board has a detecting and measuring component fitted on a middle portion thereof; the detecting and measuring component is easily replaceable, and it is used to detect and measure oxygen concentration and other data; a power supply and a wireless communication module are connected to the detecting and measuring component; in use, the detecting and measuring component will continue detecting and measuring oxygen concentration and other data in the surroundings, and the wireless communication module will continue transferring the data obtained through the detecting and measuring component so that a person can receive the data by means of internet in other places or with a wireless communication device such as a cellular phone at a distance away.

Abstract translation: 一种检测和测量装置，包括基座构件，固定在基座构件上的电路板和固定在基座构件上以覆盖电路板的覆盖构件; 电路板具有安装在其中间部分上的检测和测量部件; 检测和测量部件易于更换，用于检测和测量氧浓度等数据; 电源和无线通信模块连接到检测和测量部件; 在使用中，检测和测量部件将继续检测和测量周围环境中的氧浓度和其他数据，并且无线通信模块将继续传送通过检测和测量部件获得的数据，以便人可以通过以下方式接收数据： 在其他地方使用互联网，或者使用无线通信设备，例如远离手机的无线通信设备。

公开(公告)号：US20080112136A1

公开(公告)日：2008-05-15

申请号：US12013228

申请日：2008-01-11

Applicant: Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Chen-Lin Huang

Inventor： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Chen-Lin Huang

IPC: H05K7/20

CPC classification number: H05K1/0272 ,  F04B15/08 ,  F04D25/0633 ,  F04D25/068 ,  F04D29/5813 ,  F04D29/5853 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.

Abstract translation: 适于风扇的电路板包括电路区域和散热膜。 电路区域设置在电路板的第一表面上，并且在其上包括至少一个发热部件。 散热膜涂覆在第一表面的边缘部分上并与发热部件接触。 为了提高散热效率，已经公开并要求了通过散热膜的多个开口，电路板的突起，突起中的切口以将发热部件暴露于气流等。 也可以在与电路板的第一表面相对的第二表面上设置散热器。 散热器连接到散热片，以帮助消散风扇运行产生的热量。

公开(公告)号：US07108526B2

公开(公告)日：2006-09-19

申请号：US11004340

申请日：2004-12-03

Applicant: Josef Loibl ,  Georg Mentzel

Inventor： Josef Loibl ,  Georg Mentzel

IPC: H01R3/00

CPC classification number: H01R4/027 ,  H05K1/117 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10287

Abstract: A component, equipped for rotational insertion into a circuit module, has at least one contact electrically coupled to a first terminus of a connecting wire. The connection wire has a second terminus electrically coupled to a counter-contact on the circuit module. The contact has an annular extension in the circumferential direction which encloses the counter-contact even when a radial center line of the contact area angular extension lies outside the counter-contact angular extension. The contact may be ring-segment shaped or ring shaped. Numerous contacts may be arranged at different radial distances from the component's axis of rotation.

Abstract translation: 配备用于旋转插入电路模块的部件具有电连接到连接线的第一端的至少一个触头。 连接线具有电耦合到电路模块上的反接触的第二端。 即使当接触区域角延伸部的径向中心线位于反接触角延伸部分的外侧时，接触件也在圆周方向上具有包围反接触的环形延伸部。 触点可以是环形的或环形的。 可以将多个触点布置在与部件的旋转轴线不同的径向距离处。

公开(公告)号：US20060164820A1

公开(公告)日：2006-07-27

申请号：US11328737

申请日：2006-01-10

Applicant: Donald Mecker

Inventor： Donald Mecker

IPC: H05K7/08 ,  H05K7/02 ,  H05K7/06 ,  H05K7/10

CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/063 ,  H05K1/144 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10689 ,  Y02P70/611

Abstract: The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.

Abstract translation: 本发明涉及具有径向排列的部件的电路板。 一个具体实施例是具有诸如DRAM芯片的存储器组件的存储器电路板，其围绕中心点径向排列。 本发明还涉及堆叠并连接具有径向排列的部件的多个电路板。 本发明的另一实施例涉及在电路板模块上准备径向排列的部件的方法，该组件具有基本上等距离的部件路径。

公开(公告)号：US20060016069A1

公开(公告)日：2006-01-26

申请号：US11104634

申请日：2005-04-11

Applicant: Harold Kent ,  James LeVante ,  Joseph Layton ,  Aaron Fine

Inventor： Harold Kent ,  James LeVante ,  Joseph Layton ,  Aaron Fine

IPC: H01R43/00

CPC classification number: H05K1/02 ,  H01R9/032 ,  H01R13/502 ,  H01R13/5224 ,  H01R13/6658 ,  H05K3/0052 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2203/167 ,  H05K2203/168 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: An intelligent connector assembly for use in an interface between a device and a cable, including: a block having a circuit thereon, the block being configured to be received onto a housing, with alignment features on the housing and the block such that the block is receivable in only one orientation into the housing, and a plurality of external interfaces on the block. A method of simultaneously fabricating a plurality of circuit blocks for aligned positioning onto the housing of individual connectors, by: simultaneously fabricating a plurality of blocks on a single sheet of material; cutting a repeating pattern of holes across the single sheet; and separating the single sheet into sections such that each individual block is disposed on an identically shaped section of the single sheet.

公开(公告)号：US20050124194A1

公开(公告)日：2005-06-09

申请号：US11004340

申请日：2004-12-03

Applicant: Josef Loibl ,  Georg Mentzel

Inventor： Josef Loibl ,  Georg Mentzel

IPC: H01R4/02 ,  H05K1/11 ,  H05K3/36 ,  H01R3/00

CPC classification number: H01R4/027 ,  H05K1/117 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10287

Abstract: A component (5) which can be screwed into a circuit module (1) with a circuit board (3) has ring-segment shaped contacts (9, 10, 11), which allow contacting between the circuit board (3) and component (5) irrespective of the rotational position of the component (5).

Abstract translation: 可以用电路板（3）拧入电路模块（1）的部件（5）具有环形形状的触点（9,10,11），其允许电路板（3）和部件 5），而与组件（5）的旋转位置无关。