公开(公告)号：US10237638B2

公开(公告)日：2019-03-19

申请号：US15126111

申请日：2015-02-18

申请人： Epcos AG

发明人： Pirmin Hermann Otto Rombach

IPC分类号： H04R1/04 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  H04R19/04

摘要： In order to adjust an electric device, it is proposed to integrate a programmable memory unit into the device and to address said programmable memory unit without enlarging the footprint, via contact areas that are obtained by dividing previous contact areas. In this case, an adjustment value in particular for compensating for a fault tolerance is fed into the memory unit, an operating parameter being readjusted with the aid of said adjustment value. In each case two divided contact areas are short-circuited via a common soldering location during the mounting of the device.

公开(公告)号：US10211028B2

公开(公告)日：2019-02-19

申请号：US15173387

申请日：2016-06-03

申请人： Norsam Technologies Inc.

发明人： Patrick J Deshaye

IPC分类号： H01J37/30 ,  B23K26/08 ,  B23K26/362 ,  B23K26/40 ,  B81C99/00 ,  H01J37/305 ,  B23B5/00 ,  B23K26/352 ,  B23K26/361 ,  B23K26/36 ,  B23K103/00

摘要： Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining.

公开(公告)号：US10202278B2

公开(公告)日：2019-02-12

申请号：US15255606

申请日：2016-09-02

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Jung-Huei Peng ,  Yi-Chien Wu ,  Yu-Chia Liu ,  Chun-Wen Cheng

IPC分类号： B81B7/00 ,  B81C1/00 ,  B81C99/00

摘要： The present disclosure provides a semiconductor structure. The semiconductor structure includes a cavity disposed in a substrate and enclosed by a first surface and a second surface opposite to the first surface. The semiconductor structure also includes a first electrode pair having a first electrode on the first surface and a second electrode on the second surface. The first electrode pair is configured to measure a first spacing between the first surface and the second surface. The semiconductor structure further includes a second electrode pair having a third electrode on the first surface and a fourth electrode on the second surface. The second electrode pair is configured to measure a second spacing between the first surface and the second surface.

公开(公告)号：US10147621B2

公开(公告)日：2018-12-04

申请号：US15700982

申请日：2017-09-11

申请人： SEIKO EPSON CORPORATION

发明人： Akira Takada ,  Kazuyuki Harayama

IPC分类号： H01L21/78 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B41J2/16 ,  B81C99/00 ,  H01L21/687

摘要： Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the work, in which a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, and the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work.

公开(公告)号：US10141285B2

公开(公告)日：2018-11-27

申请号：US14031529

申请日：2013-09-19

申请人： Palo Alto Research Center Incorporated

发明人： JengPing Lu ,  David K. Biegelsen ,  Jason Thompson

IPC分类号： B23P19/00 ,  H01L23/00 ,  B81C3/00 ,  B81C99/00

摘要： A system and method form charge patterns on micro objects. The system and method employ a micro object including a rectifying device. The rectifying device exhibits an asymmetric current-voltage (I-V) response curve. Further, the system and method employ a device external to the micro object to induce the flow of charge through the rectifying device.

公开(公告)号：US10124332B2

公开(公告)日：2018-11-13

申请号：US14724123

申请日：2015-05-28

申请人： THE GOVERNORS OF THE UNIVERSITY OF ALBERTA

发明人： Daniel Elliot Sameoto

IPC分类号： B01L3/00 ,  B29C59/00 ,  B29C33/38 ,  B29C33/40 ,  B81C99/00 ,  B81C3/00 ,  B29C33/42 ,  B29C47/00 ,  B29C41/00 ,  B29L7/00 ,  B29L9/00

摘要： A reversible bonded microfluidic structure comprises an overhanging cap or gasket structure atop a continuous microfluidic channel wall. An overhanging gasket structure may reduce stress concentrations at the edge of the channel wall and can permit improved reversible adhesion of the channel wall and adjacent dry adhesive fibers. In one example, reversible adhesion of the overhanging channel wall gasket and adjacent dry adhesive fibers may approach 1 MPa in axial loading. An overhanging gasket structure of the microfluidic channel wall may comprise a single “fiber” that is continuous around the perimeter of the desired microfluidic channel shape, and may define a self-sealing gasket which will contain fluid. The overhanging gasket structure may be surrounded by further overhanging or undercut dry adhesive fibers to enhance the adhesion and help make the rest of the surface more tolerant to defects and surface roughness.

公开(公告)号：US10109536B2

公开(公告)日：2018-10-23

申请号：US15589594

申请日：2017-05-08

申请人： Infineon Technologies AG

发明人： Christoph Glacer ,  Alfons Dehe ,  John Brueckner

IPC分类号： H01L21/66 ,  H01L21/02 ,  H01L21/3205 ,  B81C99/00 ,  G01N3/08

摘要： According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.

公开(公告)号：US10106400B2

公开(公告)日：2018-10-23

申请号：US15030710

申请日：2014-10-06

申请人： NIVAROX-FAR S.A.

发明人： Philippe Dubois ,  Sebastiano Merzaghi ,  Christian Charbon

IPC分类号： B81C99/00 ,  G04B13/00 ,  G04B15/14 ,  G04B19/12

摘要： A method for fabrication of a micromechanical part made of a one-piece synthetic carbon allotrope based material, the method including: forming a substrate with a negative cavity of the micromechanical part to be fabricated; coating the negative cavity of the substrate with a layer of the synthetic carbon allotrope based material in a smaller thickness than the depth of the negative cavity; and removing the substrate to release the one-piece micromechanical part formed in the negative cavity.

公开(公告)号：US10071518B2

公开(公告)日：2018-09-11

申请号：US14640949

申请日：2015-03-06

申请人： Palo Alto Research Center Incorporated

发明人： David K. Fork ,  Karl Littau

IPC分类号： B05D5/00 ,  B05D5/12 ,  B05C9/00 ,  B29C47/00 ,  B01F5/06 ,  B29C47/02 ,  B29C47/06 ,  B29C47/70 ,  B81C99/00 ,  B29L31/34 ,  B29L31/00 ,  B29L9/00

CPC分类号： B29C48/0021 ,  B01F5/0604 ,  B29C48/07 ,  B29C48/155 ,  B29C48/185 ,  B29C48/19 ,  B29C48/21 ,  B29C48/255 ,  B29C48/71 ,  B29L2009/00 ,  B29L2031/3468 ,  B29L2031/7146 ,  B29L2031/737 ,  B81C99/0015 ,  Y10S425/049

摘要： A method for depositing a structure comprising interdigitated materials includes merging flows of at least two materials in a first direction into a first combined flow, dividing the first combined flow in a second direction to produce at least two separate flows, wherein the second direction is perpendicular to the first direction, and merging the two separate flows into a second combined flow.

公开(公告)号：US10046966B2

公开(公告)日：2018-08-14

申请号：US15479154

申请日：2017-04-04

申请人： mCube, Inc.

发明人： Ben Lee ,  Ming Hong Kuo ,  Wen-Chih Chen ,  Wensen Tsai

IPC分类号： G01R31/26 ,  B81C99/00 ,  G01R1/04

摘要： A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.