LIQUID-TIGHT STRUCTURE WITH A FASTENER COMPONENT

    公开(公告)号:US20240237281A1

    公开(公告)日:2024-07-11

    申请号:US18151833

    申请日:2023-01-09

    发明人: Po-Cheng Tsai

    IPC分类号: H05K7/20 F16J15/02 G06F1/20

    摘要: A liquid-tight structure includes a stepped fastener having a first shank and a second shank. The stepped fastener is threadingly engaged with an opening that includes a first step and a second step. A first diameter of the first shank is larger than a second diameter of the second shank. The liquid-tight structure includes a first seal seated on and in physical communication with a first top surface of the first step of the opening. The first seal is compressed between a first side of the opening and the first shank. The liquid-tight structure includes a second seal seated on and in physical communication with a second top surface of the second step of the opening. The second seal is compressed between a second side of the opening and the second shank.

    SYSTEM AND METHOD FOR MANAGING RETAINING COOLING COMPONENTS IN DATA PROCESSING SYSTEMS

    公开(公告)号:US20240237274A9

    公开(公告)日:2024-07-11

    申请号:US18048149

    申请日:2022-10-20

    IPC分类号: H05K7/20 G06F1/20

    CPC分类号: H05K7/20172 G06F1/20

    摘要: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may cool the hardware components to dissipate heat from the hardware components. The data processing system may include a fan retention mechanism that facilitates orientation of positioning of cooling components used to dissipate the heat from the hardware components.

    SYSTEM LEVEL ADAPTIVE DTR CONTROL MECHANISM TO EXTEND DYNAMIC TEMPERATURE RANGE

    公开(公告)号:US20240231455A1

    公开(公告)日:2024-07-11

    申请号:US18558180

    申请日:2021-09-01

    申请人: Intel Corporation

    IPC分类号: G06F1/20

    CPC分类号: G06F1/206

    摘要: Apparatus and methods for implementing an adaptive Dynamic Temperature Range (DTR) control mechanism to extend dynamic temperature range. A DTR control manager is provided to initiate retrain/recalibrate high-speed IO (input-output) links without link reset and extend the dynamic temperature range to the entire operating range based on thermal and other conditions. The DTR control manager ensures optimized retraining/recalibration of the link, which is based on system level parameters (like ambient temperature, fan speed, thermal zone of the devices etc.) and other environmental conditions. In some embodiments the mechanism or algorithm of the DTR control manager can be implemented in a BMC (Baseboard Management controller) or the like and hence enables the adaptive DTR solution in an operating system (OS) agnostic and seamless manner.

    AIR BAFFLE FIXING STRUCTURE AND AIR GUIDING DEVICE

    公开(公告)号:US20240231446A1

    公开(公告)日:2024-07-11

    申请号:US18403841

    申请日:2024-01-04

    IPC分类号: G06F1/20 H05K7/20

    CPC分类号: G06F1/20 H05K7/20145

    摘要: An air baffle fixing structure is configured to be disposed on a board for fixing an air baffle. The air baffle fixing structure includes at least one fixing part, at least one supporting part and at least two ring parts. The fixing part, the supporting part and the ring parts are integrally formed by a metal wire. The fixing part is used for being connected to the board. The supporting part is connected to the fixing part along a standing direction. At least one of the ring parts is connected to the supporting part. The ring parts overlap in a clamping direction and a clamping gap is formed between the ring parts. The clamping gap is used for fixing the air baffle along an air direction, and the air direction is perpendicular to the clamping direction.

    Electronic device
    47.
    发明授权

    公开(公告)号:US12027444B2

    公开(公告)日:2024-07-02

    申请号:US17305951

    申请日:2021-07-19

    IPC分类号: H01L23/40 G06F1/20 H05K1/18

    摘要: An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.

    SYSTEM FOR COOLING CIRCUIT BOARDS
    50.
    发明公开

    公开(公告)号:US20240201759A1

    公开(公告)日:2024-06-20

    申请号:US18286993

    申请日:2022-03-09

    IPC分类号: G06F1/20 H05K7/20

    摘要: A system for improved air cooling of circuit boards such as cryptographic hash boards is disclosed. The system may comprise a tubular case and a number of circuit board support brackets affixed to the inside of the case in a radial pattern. Fans may be coupled to one or both ends of the tubular case to draw air through the tubular case. The tubular case may be cylindrical or a regular polygonal prism and may have a central channel for cables and controller cards.