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    Cohesively failing, non-staining hot melt adhesives
    51.
    发明授权
    Cohesively failing, non-staining hot melt adhesives 有权

    公开(公告)号：US10081212B2

    公开(公告)日：2018-09-25

    申请号：US14789727

    申请日：2015-07-01

    Applicant: Bostik, Inc.

    Inventor： Monina D. Kanderski ,  Michael D. Vitrano

    IPC: C09J153/00 ,  C09J153/02 ,  B42D15/04 ,  B42D15/00

    CPC classification number: B42D15/04 ,  B42D15/0093 ,  C08L23/0815 ,  C08L91/00 ,  C08L91/06 ,  C09J153/025

    Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear. In addition, the presence of the secondary polymer allows additional oil absorption into the polymer, thus preventing oil from staining the substrates or surfaces without significantly increasing the viscosity.

    Hot melt adhesive with functionalized metallocene catalyzed polyolefins
    52.
    发明授权
    Hot melt adhesive with functionalized metallocene catalyzed polyolefins 有权

    公开(公告)号：US09982171B2

    公开(公告)日：2018-05-29

    申请号：US14497175

    申请日：2014-09-25

    Applicant: Bostik, Inc.

    Inventor： Monina D. Kanderski ,  Michael D. Vitrano

    IPC: C09J123/20 ,  C08K5/134 ,  C09J123/08

    CPC classification number: C09J123/20 ,  C08K5/1345 ,  C08L51/06 ,  C08L91/00 ,  C08L2314/06 ,  C09J123/0815

    Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

    SOLVENT-BASED LOW TEMPERATURE HEAT SEAL COATING
    54.
    发明申请
    SOLVENT-BASED LOW TEMPERATURE HEAT SEAL COATING 审中-公开

    公开(公告)号：US20170198171A1

    公开(公告)日：2017-07-13

    申请号：US15469928

    申请日：2017-03-27

    Applicant: Bostik, Inc.

    Inventor： Darius K. Deak ,  Thomas L. Ruppert ,  Elaine Lo

    IPC: C09J7/02 ,  B05D3/14 ,  C09D167/02 ,  B05D3/00 ,  C08J7/04 ,  C09D167/00

    Abstract: A low temperature heat seal coating solution which contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating solution can be applied to a packaging web such as a foil or film by converters using conventional methods such as gravure, rod, slot die, or printing process. The heal seal coating can be sealed to itself or another substrate to manufacture food packaging bags or pharmaceutical blister packaging. The heat seal temperature can be as low as 70° C. under conventional equipment and conditions in the industry.

    HOT MELT ADHESIVE BASED ON LOW MELTING POINT POLYPROPYLENE HOMOPOLYMERS AND METHODS FOR MAKING AND USING THE ADHESIVE
    56.
    发明申请
    HOT MELT ADHESIVE BASED ON LOW MELTING POINT POLYPROPYLENE HOMOPOLYMERS AND METHODS FOR MAKING AND USING THE ADHESIVE 有权
    基于低熔点聚丙烯共聚物的热熔粘合剂及其制备和使用粘合剂的方法

    公开(公告)号：US20160230055A1

    公开(公告)日：2016-08-11

    申请号：US15134517

    申请日：2016-04-21

    Applicant: Bostik, Inc.

    Inventor： Richard Hamann ,  Lianne Rachow

    IPC: C09J157/02 ,  B32B7/12 ,  A61F13/515 ,  B32B27/12 ,  B32B27/32 ,  A61F13/49 ,  C09J11/08 ,  B32B5/02

    CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

    Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

    Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; 约10％至约60％的具有环球软化点的第一增粘树脂约95℃至约140℃; 约0％至约65％的与第一增粘树脂不同的第二增粘树脂; 约5％至约50％的增塑剂; 约1％至约40％重量的二级聚合物，其为半结晶聚合物或蜡，其熔融焓大于30焦耳/克; 约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

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