公开(公告)号：US20120024456A1

公开(公告)日：2012-02-02

申请号：US12844113

申请日：2010-07-27

Applicant: Yu-Liang LIN ,  Weng-Jin WU ,  Jing-Cheng LIN

Inventor： Yu-Liang LIN ,  Weng-Jin WU ,  Jing-Cheng LIN

IPC: B32B37/02 ,  B30B15/34

CPC classification number: H01L21/6835 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/26 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.

Abstract translation: 所描述的实施例提供了将晶片接合到载体上的装置和方法，其中面向基板或载体的板的表面轮廓通过重新成形，通过使用高度调节器，通过添加垫片或通过分区的温度控制来改变。 这种板的改进的表面轮廓补偿可能导致键合衬底的非平面性的影响。

公开(公告)号：US08105655B2

公开(公告)日：2012-01-31

申请号：US12164613

申请日：2008-06-30

Applicant: Jin Wu

Inventor： Jin Wu

IPC: B05D3/02

CPC classification number: B29D29/00 ,  G03G15/2057 ,  Y10T428/3154

Abstract: Exemplary embodiments provide a belt material and methods for making and using the belt material. In one embodiment, the belt material can be a fast and low-temperature cured polyimide belt that includes a plurality of thermally-conductive species dispersed in a polyimide resin. In another embodiment, the belt material can include one or more layers formed over the fast and low-temperature cured polyimide belt substrate that includes a plurality of thermally-conductive species dispersed in the polyimide resin. For example, the fast and low-temperature cured polyimide belt or belt substrate can be cured at a temperature of about 300° C. or lower for a time length of less than about one hour. The belt material can be suitable for use in an electrostatographic printing process as a fuser belt, a fixing belt, a pressure belt, and/or a release agent donor belt.

Abstract translation: 示例性实施例提供了一种带材料和用于制造和使用带材料的方法。 在一个实施方案中，带材料可以是快速和低温固化的聚酰亚胺带，其包含分散在聚酰亚胺树脂中的多个导热物质。 在另一个实施例中，带材料可以包括形成在快速和低温固化的聚酰亚胺带基底上的一层或多层，其包括分散在聚酰亚胺树脂中的多种导热物质。 例如，快速和低温固化的聚酰亚胺带或带基材可以在约300℃或更低的温度下固化约一小时的时间长度。 带材料可以适用于作为定影带，定影带，压力带和/或脱模剂供体带的静电印刷工艺。

公开(公告)号：US20120021604A1

公开(公告)日：2012-01-26

申请号：US12841874

申请日：2010-07-22

Applicant: Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

Inventor： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC: H01L21/306 ,  H01L21/302 ,  H01L21/3065

CPC classification number: H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: A method includes bonding a wafer on a carrier through an adhesive, and performing a thinning process on the wafer. After the step of performing the thinning process, a portion of the adhesive not covered by the wafer is removed, while the portion of the adhesive covered by the wafer is not removed.

Abstract translation: 一种方法包括通过粘合剂将晶片接合在载体上，并在晶片上进行稀化处理。 在进行稀化处理的步骤之后，去除未被晶片覆盖的粘合剂的一部分，同时由晶片覆盖的粘合剂部分未被除去。

公开(公告)号：US20120015153A1

公开(公告)日：2012-01-19

申请号：US12835104

申请日：2010-07-13

Applicant: Satchidanand Mishra ,  Edward A. Domm ,  Jin Wu ,  Geoffrey M.T. Foley ,  Edward F. Grabowski

Inventor： Satchidanand Mishra ,  Edward A. Domm ,  Jin Wu ,  Geoffrey M.T. Foley ,  Edward F. Grabowski

IPC: B32B1/00 ,  B29C35/08

CPC classification number: G03G15/161 ,  B29C41/265 ,  B29C2035/0827 ,  B29D29/00 ,  B29L2031/324 ,  G03G15/162 ,  G03G2215/1623 ,  Y10S977/742 ,  Y10T428/24628

Abstract: Described herein is a method of forming a seamless transfer member suitable for use with an image forming system. The method includes spray coating a UV curable polymer and conductive particles onto an inner surface of a rotating cylindrical mandrel. The UV curable polymer is cured with ultra violet energy. The cured UV polymer is removed from the cylindrical rotatable mandrel.

Abstract translation: 这里描述了一种形成适于与图像形成系统一起使用的无缝转印部件的方法。 该方法包括将UV可固化聚合物和导电颗粒喷涂到旋转圆柱形心轴的内表面上。 紫外线固化聚合物用紫外线能量固化。 固化的UV聚合物从圆柱形可旋转心轴移除。

公开(公告)号：US08098925B2

公开(公告)日：2012-01-17

申请号：US12269762

申请日：2008-11-12

Applicant: Markus R. Silvestri ,  Jin Wu ,  M. John Hinckel ,  David M. Skinner ,  Kent J. Evans ,  Robert J. Meyer ,  Kathleen M. Carmichael ,  Dale S. Renfer

Inventor： Markus R. Silvestri ,  Jin Wu ,  M. John Hinckel ,  David M. Skinner ,  Kent J. Evans ,  Robert J. Meyer ,  Kathleen M. Carmichael ,  Dale S. Renfer

IPC: G06K7/10

CPC classification number: G03G5/047 ,  G03G5/05 ,  G03G5/0525 ,  G03G5/147

Abstract: The presently disclosed embodiments relate in general to electrophotographic imaging members, such as layered photoreceptor structures, and processes for making and using the same. More particularly, the embodiments pertain to an improved photoreceptor that exhibits little to no response to injected charges and demonstrates excellent ghosting properties.

Abstract translation: 目前公开的实施例一般涉及电子照相成像构件，例如层状感光体结构，以及制造和使用它们的方法。 更具体地，实施方案涉及对注入的电荷几乎没有或没有反应的改进的感光体，并且显示出优异的重影性质。

公开(公告)号：US20120009352A1

公开(公告)日：2012-01-12

申请号：US12832322

申请日：2010-07-08

Applicant: Geoffrey M.T. Foley ,  Jin Wu ,  Satchidanand Mishra ,  Kent J. Evans

Inventor： Geoffrey M.T. Foley ,  Jin Wu ,  Satchidanand Mishra ,  Kent J. Evans

IPC: C08J7/04 ,  B05B5/025

CPC classification number: G03G15/162 ,  C09D4/00 ,  C09D133/06 ,  C09D133/08 ,  C09D133/14

Abstract: Various embodiments provide methods and apparatus for forming intermediate transfer belts (ITBs) by combining a dip-coating process with a UV-curing process.

Abstract translation: 各种实施例提供了通过将浸涂工艺与UV固化工艺组合来形成中间转印带（ITB）的方法和装置。

公开(公告)号：US20120002551A1

公开(公告)日：2012-01-05

申请号：US13078588

申请日：2011-04-01

Applicant: Mattias LAMPE ,  Juan Juan Li ,  Jie Tong ,  Jin Wu ,  Fang Yan

Inventor： Mattias LAMPE ,  Juan Juan Li ,  Jie Tong ,  Jin Wu ,  Fang Yan

IPC: H04W52/02 ,  H04W24/00

CPC classification number: H04W52/0229 ,  H04W48/12 ,  Y02D70/00

Abstract: A method for communicating in a low power communication network, a corresponding low power communication network system and a network node, where the method enables low power consumption by the data transmission node in the low power communication network while ensuring the low power communication network communicates efficiently. The network comprises a first network node and a second network node, where the first network node transmits a beacon frame that is used to indicate the time for data transmission by the first network node, and the second network node detects the beacon frame to synchronize its data transmission with the first network node.

Abstract translation: 一种用于在低功率通信网络，相应的低功率通信网络系统和网络节点中进行通信的方法，其中该方法能够实现低功率通信网络中的数据传输节点的低功耗，同时确保低功率通信网络有效地通信 。 网络包括第一网络节点和第二网络节点，其中第一网络节点发射用于指示第一网络节点进行数据传输的时间的信标帧，而第二网络节点检测信标帧以使其同步 数据传输与第一个网络节点。

公开(公告)号：US20120001337A1

公开(公告)日：2012-01-05

申请号：US12827563

申请日：2010-06-30

Applicant: Chen-Yu Tsai ,  Shih-Hui Wang ,  Chien-Ming Chiu ,  Chia-Ho Chen ,  Fang Wen Tsai ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Chen-Yu Tsai ,  Shih-Hui Wang ,  Chien-Ming Chiu ,  Chia-Ho Chen ,  Fang Wen Tsai ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/532 ,  H01L21/71 ,  H01L23/522

CPC classification number: H01L23/481 ,  H01L21/30604 ,  H01L21/6835 ,  H01L21/76831 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2224/13

Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Abstract translation: 根据实施例，结构包括具有第一区域和第二区域的基板; 穿过基板的第一区域的贯穿基板通孔（TSV）; 在所述衬底的所述第二区域上方的隔离层，所述隔离层具有凹部; 以及在所述隔离层的所述凹部中的导电材料，所述隔离层设置在所述凹部中的所述导电材料和所述基板之间。

公开(公告)号：US08088542B2

公开(公告)日：2012-01-03

申请号：US12059669

申请日：2008-03-31

Applicant: Jin Wu ,  John F. Yanus ,  Kenny-Tuan Dinh ,  Kent J Evans ,  Min-Hong Fu ,  Susan M. Vandusen

Inventor： Jin Wu ,  John F. Yanus ,  Kenny-Tuan Dinh ,  Kent J Evans ,  Min-Hong Fu ,  Susan M. Vandusen

IPC: G03G5/047

CPC classification number: G03G5/14791 ,  G03G5/0614 ,  G03G5/14704 ,  G03G5/14708 ,  G03G5/1473 ,  G03G5/14734 ,  G03G5/1476

Abstract: A photoconductor that includes, for example, a supporting substrate, a photogenerating layer, a charge transport layer, and an overcoat layer that contains a titanocene.

Abstract translation: 包括例如支撑基板，光生成层，电荷输送层和含有二茂钛的外涂层的感光体。

公开(公告)号：US20110318680A1

公开(公告)日：2011-12-29

申请号：US12825453

申请日：2010-06-29

Applicant: Jin Wu

Inventor： Jin Wu

IPC: G03G5/047

CPC classification number: G03G5/0696 ,  G03G5/0517 ,  G03G5/0521 ,  G03G5/0578 ,  G03G5/0642 ,  G03G5/0662

Abstract: A photoconductor containing an optional supporting substrate, a photogenerating layer, and at least one charge transport layer comprised of at least one charge transport component, and wherein the photogenerating layer contains a hydroxygallium phthalocyanine, a hydroxyaluminum phthalocyanine, a polymeric binder, and a silanol.

Abstract translation: 包含任选的支撑基底，光生成层和至少一个电荷传输层的感光体，所述至少一个电荷传输层由至少一个电荷传输组分组成，并且其中所述光生成层含有羟基镓酞菁，羟基铝酞菁，聚合物粘合剂和硅烷醇。