公开(公告)号：US10471545B2

公开(公告)日：2019-11-12

申请号：US15360471

申请日：2016-11-23

申请人： Rohinni, LLC.

发明人： Justin Wendt ,  Andrew Huska ,  Cody Peterson

IPC分类号： B23K26/351 ,  H01L21/683 ,  H01L21/687 ,  B23K26/70 ,  B23K26/08

摘要： An apparatus includes a needle including a hole extending from a first end to a second end through the needle and an energy-emitting device arranged in the hole of the needle. The energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at an electrically-actuatable element to bond a circuit trace and the electrically-actuatable element.

公开(公告)号：US10373937B2

公开(公告)日：2019-08-06

申请号：US15796533

申请日：2017-10-27

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/544 ,  H01L21/67 ,  H01L33/62 ,  G02F1/1335 ,  H01L23/532

摘要： An apparatus includes a frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the first side of the wafer tape. A support member supports a product substrate having a circuit trace thereon. The support member is configured to hold the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device dies on the wafer tape. A plurality of needles are disposed adjacent the second side of the wafer tape. A needle actuator is connected to the plurality of needles and is configured to move at least one needle of the plurality of needles to a die transfer position at which the at least one needle presses on the second side of the wafer tape to press a semiconductor device die into contact with the circuit trace.

公开(公告)号：US10361176B2

公开(公告)日：2019-07-23

申请号：US15951094

申请日：2018-04-11

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska

IPC分类号： H01L21/02 ,  H01L23/02 ,  H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/544 ,  H01L21/67 ,  H01L33/62 ,  G02F1/1335 ,  H01L23/532

摘要： An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.

公开(公告)号：US10359860B2

公开(公告)日：2019-07-23

申请号：US15681211

申请日：2017-08-18

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andy Huska

IPC分类号： G06F3/02 ,  H01H13/70 ,  F21V8/00

摘要： An apparatus includes a housing including a plurality of light sources to provide backlighting for the apparatus. A first portion of the plurality of light sources is configured to provide a first color temperature setting. A second portion of the plurality of light sources is configured to provide a second color temperature setting. The apparatus includes a controller including one or more processors configured to execute instructions stored on memory, which when executed, cause the one or more controllers to set at least one of an overall color temperature setting for the backlighting of the apparatus, or a partial color temperature setting for the backlighting of the apparatus.

公开(公告)号：US20190162372A1

公开(公告)日：2019-05-30

申请号：US16212281

申请日：2018-12-06

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Monica Hansen ,  Justin Wendt ,  Clint Adams ,  Andrew Huska

IPC分类号： F21K9/65 ,  H01H13/70 ,  F21V7/00 ,  H01H13/83 ,  F21V3/04

摘要： An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.

公开(公告)号：US10242971B2

公开(公告)日：2019-03-26

申请号：US15978092

申请日：2018-05-12

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/544 ,  H01L21/67 ,  H01L33/62 ,  G02F1/1335 ,  H01L23/532

摘要： An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.

公开(公告)号：US20180331079A1

公开(公告)日：2018-11-15

申请号：US15593230

申请日：2017-05-11

申请人： Rohinni, LLC

发明人： Justin Wendt ,  Andy Huska ,  Sean Kupcow ,  Nicholas Steven Busch ,  Cody Peterson

IPC分类号： H01L25/075 ,  H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H01L33/62 ,  H01L33/56

CPC分类号： H01L25/0753 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/005 ,  H05K1/028 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/166

摘要： A waterproof sealed circuit apparatus includes a circuit substrate having a first side opposite a second side. The first side includes a circuit trace. A semiconductor device die is electrically coupled to the circuit trace on the first side of the circuit substrate. A polymer sealing layer is adhered to the first side of the circuit substrate and covers the semiconductor device die. Polymer chains of the sealing layer are crosslinked.

公开(公告)号：US20180261580A1

公开(公告)日：2018-09-13

申请号：US15978092

申请日：2018-05-12

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/677 ,  H01L21/48 ,  H01L21/687 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L23/544 ,  H01L21/683 ,  H01L21/68

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.

公开(公告)号：US20180164494A1

公开(公告)日：2018-06-14

申请号：US15881634

申请日：2018-01-26

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Andrew Huska ,  Kasey Christie ,  Clint Adams

IPC分类号： F21V8/00 ,  H01H13/83 ,  G02F1/1335

CPC分类号： G02B6/0036 ,  G02B6/0068 ,  G02B6/009 ,  G02B6/0091 ,  G02F1/133603 ,  H01H13/83

摘要： Described herein are techniques related to orienting a plurality of light-generating sources of a lightguide to illuminate a backlit a device, such as a display or keyboard, with soft, even light. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

公开(公告)号：US20180122673A1

公开(公告)日：2018-05-03

申请号：US15343055

申请日：2016-11-03

申请人： Rohinni, LLC

发明人： Justin Wendt ,  Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67766 ,  H01L21/6836 ,  H01L21/68714 ,  H01L23/544 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486

摘要： An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.