公开(公告)号：US20160104698A1

公开(公告)日：2016-04-14

申请号：US14510433

申请日：2014-10-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin

IPC: H01L25/00 ,  H01L25/16

CPC classification number: H01L25/50 ,  G06F1/3231 ,  G06F3/017 ,  H01L25/165 ,  H01L25/167 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2217/94108 ,  H04M2250/12 ,  H01L2924/00

Abstract: A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.

Abstract translation: 一种用于制造光学接近传感器的方法包括形成具有光学传输开口和延伸穿过其中的光学接收开口的封装顶板，将光学传输元件附接到邻近光学传输开口的封装顶板，以及将光学接收元件附接到 封装顶板邻近光学接收开口。 封装主体形成在封装顶板上以限定容纳光学传输元件的光学传输空腔和容纳光学接收元件的光学接收腔。

公开(公告)号：US20160047774A1

公开(公告)日：2016-02-18

申请号：US14462432

申请日：2014-08-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/406 ,  H05K3/42 ,  H05K13/04 ,  G01N27/407

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

Abstract translation: 紧凑的微电子气体传感器模块包括以这样的方式形成的电触头，使得它们不消耗集成电路芯片上的不动产。 使用这种设计，可以进一步小型化包装。 气体传感器与定制设计的专用集成电路（ASIC）封装在一起，该集成电路提供用于处理传感器信号以识别被测样品内的气体种类的电路。 在一个示例中，通过提供暴露于电解气体感测化合物的柱形式的附加金属表面积，同时减小整体封装尺寸，增强了传感器的输出信号强度。 在一些示例中，在形成有气体传感器的基板的下侧上形成底侧触点。 传感器电极可以直接或间接地通过通孔电耦合到ASIC。

公开(公告)号：US09258467B2

公开(公告)日：2016-02-09

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H01L27/146 ,  B29L31/00

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US09257372B2

公开(公告)日：2016-02-09

申请号：US14032075

申请日：2013-09-19

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Kim-Yong Goh ,  Xueren Zhang ,  Kevin Formosa

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L23/31 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L23/49541 ,  G01P1/023 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2224/45099

Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.

Abstract translation: 半导体器件的表面贴装封装具有：封装，容纳至少一个包含半导体材料的管芯; 以及电接触引线，从封装凸出以电耦合到电路板的接触焊盘; 封装具有设计成面向电路板的顶表面的主面，该主面具有设计成用于机械耦合到电路板的耦合特征，以增加安装封装的谐振频率。 耦合特征设想至少一个第一耦合凹槽，其限定在从主面开始的封装内，被设计成由固定到电路板的对应耦合元件接合，从而限制安装的封装的移动。

公开(公告)号：US20160018356A1

公开(公告)日：2016-01-21

申请号：US14334572

申请日：2014-07-17

Applicant: STMicroelectronics Pte Ltd

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/406

CPC classification number: G01N27/12 ,  G01N27/123 ,  G01N27/125 ,  G01N27/128

Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.

Abstract translation: 微型电阻气体检测器包含薄膜，当加热到特定温度时可以选择性地识别特定气体。 公开了一种固态气体传感器模块，其包括堆叠在绝缘凹槽上的气体传感器，加热器和温度传感器。 绝缘凹部部分地填充有提供结构完整性的支撑材料。 固态气体传感器模块可以集成在公共基板上的ASIC的顶部上。 具有足够的绝热性，这种气体检测器可以作为诸如智能电话的移动电子设备的低功率组件来提供。 操作多传感器阵列的方法允许通过使用专用传感器或通过热调谐传感器来监测不同气体种类来检测不同气体种类的相对浓度。

公开(公告)号：US09176089B2

公开(公告)日：2015-11-03

申请号：US13853732

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L31/058 ,  G01N27/22 ,  H01L25/065 ,  H01L25/00 ,  G01L9/12 ,  G01K7/01 ,  H01L27/02 ,  H01L29/78 ,  G01K7/18 ,  G01K7/20

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。

公开(公告)号：US20150243356A1

公开(公告)日：2015-08-27

申请号：US14623300

申请日：2015-02-16

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS PTE LTD

Inventor： Antonino CONTE ,  Alberto Jose' DI MARTINO ,  Kailash KHAIRNAR

IPC: G11C13/00

CPC classification number: G11C13/0069 ,  G11C8/04 ,  G11C13/0004 ,  G11C13/0023 ,  G11C13/0026 ,  G11C13/0061 ,  G11C13/0097 ,  G11C2213/79

Abstract: A phase change non-volatile memory device has a memory array with a plurality of memory cells arranged in rows and columns, a column decoder and a row decoder designed to select columns, and, respectively, rows of the memory array during operations of programming of corresponding memory cells. A control logic, coupled to the column decoder and the row decoder, is designed to execute a sequential programming command, to control the column decoder and row decoder to select one column of the memory array and execute sequential programming operations on a desired block of memory cells belonging to contiguous selected rows of the selected column.

Abstract translation: 相变非易失性存储器件具有存储器阵列，其具有排列成行和列的多个存储器单元，列解码器和行解码器，被设计为在编程操作期间选择列以及分别存储器阵列的行 相应的存储单元。 耦合到列解码器和行解码器的控制逻辑被设计为执行顺序编程命令，以控制列解码器和行解码器来选择存储器阵列的一列并对期望的存储块执行顺序编程操作 属于所选列的连续选定行的单元格。

公开(公告)号：US20150237245A1

公开(公告)日：2015-08-20

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/235 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

Abstract translation: 公开了一种用于微型照相机的低成本树脂透镜。 树脂透镜具有低外形，特别适用于诸如智能手机的消费产品。 树脂透镜安装到附接到标准四层基板的集成电路管芯上。 集成电路管芯包括用于支持数字图像捕获，传输和处理的电子和/或光电子电路。 图像校正软件调整图像以校正由树脂透镜引入的失真。

公开(公告)号：US20150145137A1

公开(公告)日：2015-05-28

申请号：US14090673

申请日：2013-11-26

Applicant: STMicroelectronics Pte. Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L23/31 ,  H01L27/06 ,  H01L23/528 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。

公开(公告)号：US20150138436A1

公开(公告)日：2015-05-21

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N5/225 ,  B29D11/00 ,  B29C65/48

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。