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    SIDE MOUNTABLE SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES, PANELS AND METHODS OF FORMING THE SAME
    51.
    发明申请
    SIDE MOUNTABLE SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGES, PANELS AND METHODS OF FORMING THE SAME 有权
    侧面安装的半导体发光装置包装，面板及其形成方法

    公开(公告)号：US20080272383A1

    公开(公告)日：2008-11-06

    申请号：US11744286

    申请日：2007-05-04

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Side-mountable semiconductor light emitting device packages include an electrically insulating substrate having a front face and a back face and a side face extending therebetween. The side face is configured for mounting on an underlying surface. An electrically conductive contact is provided proximate an edge of the substrate on the back face of the substrate and/or on a recessed region on the side face of the substrate. The contact is positioned to be positioned proximate an electrical connection region of the underlying surface when the semiconductor light emitting device package is side mounted on the underlying surface. A conductive trace extends along the front face of the substrate and is electrically connected to the contact. A semiconductor light emitting device is mounted on the front face of the substrate and electrically connected to the conductive trace.

    摘要翻译： 侧面安装的半导体发光器件封装包括具有正面和背面的电绝缘基板和在其间延伸的侧面。 侧面被配置为安装在下面的表面上。 在衬底的背面和/或衬底的侧面上的凹陷区域上靠近衬底的边缘设置导电触点。 当半导体发光器件封装侧面安装在下面的表面上时，触点定位成位于下表面的电连接区域附近。 导电迹线沿着衬底的前表面延伸并且电连接到触点。 半导体发光器件安装在基板的正面上并与导电迹线电连接。

    Composite optical lens with an integrated reflector
    53.
    发明授权
    Composite optical lens with an integrated reflector 有权
    具有集成反射镜的复合光学透镜

    公开(公告)号：US07280288B2

    公开(公告)日：2007-10-09

    申请号：US10861639

    申请日：2004-06-04

    申请人： Ban P. Loh ,  Gerald H. Negley

    发明人： Ban P. Loh ,  Gerald H. Negley

    IPC分类号： G02B17/00 ,  F21V5/04

    CPC分类号： G02B3/00 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.

    摘要翻译： 公开了一种复合光学透镜。 复合光学透镜包括适于接收光的凹底表面，适于反射接收的光的反射表面以及反射光通过该表面离开光学透镜的光学表面。 凹形底表面限定了凹腔，其允许在凹腔内放置发光器件的至少一部分。 凹底面，光学表面或两者可以具有预定的光学光洁度以在光上操作，例如漫射或聚焦光。 反射表面可以被涂覆，设计或两者用于全内反射效果。

    Power surface mount light emitting die package
    54.
    发明授权
    Power surface mount light emitting die package 有权
    功率表面贴装发光管芯封装

    公开(公告)号：US07264378B2

    公开(公告)日：2007-09-04

    申请号：US10446532

    申请日：2003-05-27

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V29/00 ,  H01L31/0203

    CPC分类号： H01L33/642 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K2201/10106 ,  H01L2924/00014

    摘要： A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). The lens can be coated with any optical system of chemical that affects the performance of the device. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

    摘要翻译： 公开了一种发光管芯封装。 模具封装包括基板，反射板和透镜。 衬底由导热但电绝缘的材料制成。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装垫。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 透镜可以涂覆任何影响设备性能的光学化学系统。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。 反射板包括反射表面，以在期望的方向上引导来自LED的光。

    LED package die having a small footprint
    55.
    发明授权
    LED package die having a small footprint 有权
    LED封装模具占地面积小

    公开(公告)号：US06897486B2

    公开(公告)日：2005-05-24

    申请号：US10721641

    申请日：2003-11-25

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21K99/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L29/267

    CPC分类号： H01L33/647 ,  F21K9/00 ,  F21V29/507 ,  F21V29/74 ,  F21V29/76 ,  F21V29/83 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

    摘要翻译： 公开了一种发光管芯封装及其制造方法。 模具封装包括具有凹槽的杆基板，附着到凹槽的导线引线和安装在杆基板上的发光二极管（LED）。 还耦合到衬底的是套筒，反射器和透镜。 为了制造发光管芯封装，形成长的衬底，并且引线附接到衬底。 然后，将包括附接线引线的基板切割以预先确定长度以形成单独的基板。 对于每个茎基板，LED，反射器和透镜被耦合。

    LED solutions for luminaries
    56.
    发明授权
    LED solutions for luminaries 有权
    LED解决方案

    公开(公告)号：US09453618B2

    公开(公告)日：2016-09-27

    申请号：US13456869

    申请日：2012-04-26

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V29/00 ,  F21K99/00 ,  F21V3/00 ,  F21V29/71 ,  F21Y101/02

    CPC分类号： F21K9/233 ,  F21K9/232 ,  F21V3/00 ,  F21V29/717 ,  F21Y2101/00 ,  F21Y2115/10

    摘要： A LED lighting device is disclosed. The LED lighting device includes one or more of the following components, in any combination: structural body with heat-fins, LED light module, LED driver circuit board, electrical screw-cap, thermal end-cap, heat transport device, heat-sink and heat-foil. This invention presents a substantial cost saving in the LED adaptation to retrofit the existing light fixtures and luminaires. Its other advantages include, without limitation, having standard electrical connector to achieve ease of use and interchangeability, reduced light loss by having its own integrated build-in reflector with more effective optical design, an increase in energy saving through thermal solutions to lower LED's operating junction temperature for better performance and increased reliability.

    摘要翻译： 公开了一种LED照明装置。 LED照明装置包括以下组件中的一个或多个：散热片结构体，LED灯模块，LED驱动电路板，电动螺帽，热端盖，热传输装置，散热片 和热箔。 本发明在改进现有灯具和灯具的LED适应性方面显着地节约了成本。 其其他优点包括但不限于具有标准电连接器以实现易于使用和互换性，通过具有其自身的集成内置反射器具有更有效的光学设计来减少光损失，通过热解决方案增加节能以降低LED的工作 结温更好的性能和更高的可靠性。

    Method for coating semiconductor device using droplet deposition
    58.
    发明授权
    Method for coating semiconductor device using droplet deposition 有权

    公开(公告)号：US08390016B2

    公开(公告)日：2013-03-05

    申请号：US13237789

    申请日：2011-09-20

    申请人： Bernd Keller ,  Ban P. Loh

    发明人： Bernd Keller ,  Ban P. Loh

    IPC分类号： H01L33/00

    CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

    摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

    Semiconductor light emitting device packages including submounts
    59.
    发明授权
    Semiconductor light emitting device packages including submounts 有权
    半导体发光器件封装包括底座

    公开(公告)号：US08378374B2

    公开(公告)日：2013-02-19

    申请号：US12685883

    申请日：2010-01-12

    申请人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

    发明人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

    IPC分类号： H01L33/62 ,  H01L33/64

    CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

    摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

    摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

    LED BACKLIGHTING FOR DISPLAYS
    60.
    发明申请
    LED BACKLIGHTING FOR DISPLAYS 有权
    LED背光用于显示

    公开(公告)号：US20110261554A1

    公开(公告)日：2011-10-27

    申请号：US13175600

    申请日：2011-07-01

    申请人： Ban P. Loh

    发明人： Ban P. Loh

    IPC分类号： F21V9/16 ,  H05K1/18 ,  F21V9/00 ,  F21S4/00 ,  F21V7/00

    CPC分类号： G02F1/133603 ,  G02F1/133606 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A display system including a display panel having a first major surface and a second major surface and a lighting system adapted to provide uniform luminance proximal to the display panel is disclosed. The lighting system includes an illuminating substrate having a first major surface with reflective coating and a second major surface. The illuminating substrate defines an array of mounting holes, each hole occupied by an LED module. An array of light emitting diode (LED) modules are affixed to the illuminating substrate, each module including at least one light emitting diode adapted to emit light. The lighting system can also include a diffusant layer which can be optically coupled to the illuminating substrate by soft optical gel and is placed close to or made to contact the display panel. The optical gel may contain phosphors or other optical substance for added optical performance to the lighting system. The diffusant layer has beveled edges at critical angle of refraction or coated with reflective material to minimize light loss at its edges. Each of the LED modules includes at least one LED chip, conductive traces connected to the LED chip and a heat sink.

    摘要翻译： 公开了一种显示系统，包括具有第一主表面和第二主表面的显示面板和适于在显示面板附近提供均匀亮度的照明系统。 照明系统包括具有带有反射涂层的第一主表面和第二主表面的照明基板。 照明基板限定一组安装孔，每个孔由LED模块占据。 一组发光二极管（LED）模块固定到照明基板上，每个模块包括适于发光的至少一个发光二极管。 照明系统还可以包括扩散层，其可以通过柔性光学凝胶光学耦合到照明基底并且靠近显示面板或与显示面板接触。 光学凝胶可以含有荧光体或其它用于向照明系统增加光学性能的光学物质。 扩散层在临界折射角处具有倾斜边缘，或涂覆有反射材料，以最小化其边缘处的光损失。 每个LED模块包括至少一个LED芯片，连接到LED芯片的导电迹线和散热器。