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51.发明申请公开(公告)号：US20150166395A1
公开(公告)日：2015-06-18
申请号：US14535754
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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Patent Agency Ranking
公开(公告)号：US20150166394A1
公开(公告)日：2015-06-18
申请号：US14530379
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/0884 , B23K26/359 , B23K26/402 , B23K26/53 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B65G2249/04 , C03B23/02 , C03B23/023 , C03B23/025 , C03B33/0222 , C03B33/023 , C03B33/033 , C03B33/04 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
Abstract translation: 提供了激光加工任意形状的模制3D薄透明脆性部件的特殊感兴趣的基板，由强化或非强化CorningGorilla®玻璃（所有代码）形成。 开发的激光方法可以定制为从面板手动分离部件或通过热应力所需的轮廓进行全激光分离。 方法可用于形成具有小曲率半径的三维表面。 该方法涉及利用超短脉冲激光器，其可以任选地跟随有二氧化碳激光器进行全自动分离。
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公开(公告)号：US20150166393A1
公开(公告)日：2015-06-18
申请号：US14529697
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/07 , C03C23/0025 , Y02P40/57 , Y10T428/24273
Abstract: This laser cutting process makes use of a short pulse laser in combination with optics that generate a focal line to fully perforate the body of a range of ion-exchangeable glass compositions. The glass is moved relative to the laser beam to create perforated lines that trace out the shape of any desired parts. The glass may be cut pre-ion exchange, or may be cut post-ion exchange. The laser creates hole-like defect zones that penetrate the full depth the glass, of approximately 1 micron in diameter. These perforations or defect regions are generally spaced from 1 to 15 microns apart.
Abstract translation: 该激光切割工艺利用短脉冲激光器与光学元件组合，其产生焦线以完全穿透一系列可离子交换的玻璃组合物的主体。 玻璃相对于激光束移动，以产生可以追踪任何所需部件形状的穿孔线。 玻璃可以进行切割前离子交换，也可以在离子交换后切割。 激光产生穿透直径约1微米的玻璃的全深度的孔状缺陷区。 这些穿孔或缺陷区域通常间隔开1至15微米。
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公开(公告)号：US20150165562A1
公开(公告)日：2015-06-18
申请号：US14529976
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0613 , B23K26/0624 , B23K26/0738 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/06 , B32B2250/02 , B32B2315/02 , Y02P40/57 , Y10T428/21 , Y10T428/24273 , Y10T428/24355
Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
Abstract translation: 激光处理材料以形成分离部分的方法。 该方法包括将脉冲激光束聚焦到沿着光束传播方向观察的激光束焦线中，引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿孔或故障线 所述激光束焦线在所述材料内，并且将散焦的二氧化碳（CO 2）激光从所述多个孔的远端边缘引导到所述材料的近侧边缘。
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公开(公告)号：US20150165560A1
公开(公告)日：2015-06-18
申请号：US14536009
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Thomas Hackert , Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/082 , B23K26/0608 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/389 , B23K26/53 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03B33/04 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24273
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
Abstract translation: 本发明涉及用于在透明材料（特别是玻璃）的薄衬底中切割和分离内部轮廓的方法。 该方法涉及利用超短脉冲激光器在衬底中形成穿孔或孔，其后可以使用CO 2激光束来促进穿孔线周围的完全分离。
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公开(公告)号：US20150165548A1
公开(公告)日：2015-06-18
申请号：US14530410
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/02 , B23K26/037 , B23K26/04 , B23K26/0624 , B23K26/083 , B23K26/0869 , B23K26/361 , B23K26/362 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/54 , B24B9/10 , C03B33/082 , C03B33/091 , C03C21/002 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
Abstract translation: 本文描述了使用激光器对任意形状的玻璃或其它衬底的边缘进行倒角和/或斜切的工艺。 公开了在玻璃基板上制造倒角的三种一般方法。 第一种方法包括利用超短脉冲激光切割具有期望的倒角形状的边缘。 用超短激光治疗可以任选地跟随一个CO2激光器进行全自动分离。 第二种方法是基于锋利边缘角的热应力剥离，并且已经证明可以与超短脉冲和/或CO2激光器的不同组合一起工作。 第三种方法依赖于由离子交换引起的应力，以沿着由超短激光产生的断层线材料分离以形成所需形状的倒角边缘。
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