公开(公告)号：US20100213161A1

公开(公告)日：2010-08-26

申请号：US12775452

申请日：2010-05-06

申请人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

发明人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

IPC分类号： B44C1/22 ,  B32B38/10 ,  C23C14/34

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US07749448B2

公开(公告)日：2010-07-06

申请号：US11267762

申请日：2005-11-03

申请人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

发明人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

IPC分类号： B01L3/02

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US20080141880A1

公开(公告)日：2008-06-19

申请号：US11613152

申请日：2006-12-19

申请人： Jürgen H. Daniel ,  Dirk De Bruyker ,  Eugene M. Chow

发明人： Jürgen H. Daniel ,  Dirk De Bruyker ,  Eugene M. Chow

IPC分类号： B41K1/38 ,  B41N1/00 ,  B41N3/00

CPC分类号： B41C1/055 ,  B41C1/1033 ,  B41C1/1075 ,  B41C1/145 ,  B41N1/12

摘要： A printing plate has a substrate and a heat decomposable polymer layer arranged adjacent to the substrate, the decomposable polymer having defined regions within the polymer layer to form a printing pattern. The printing plate may be used in a printing system. The printing plate is formed in a process by providing a substrate, coating the substrate with a heat decomposable polymer to form a plate, and forming a printing pattern in the heat decomposable polymer by selectively decomposing regions of the heat decomposable polymer.

摘要翻译： 印版具有与基底相邻布置的基底和可热分解的聚合物层，所述可分解聚合物在所述聚合物层内具有限定的区域以形成印刷图案。 印刷版可以用在印刷系统中。 通过提供基板，通过可热分解聚合物涂覆基板以形成板，并且通过选择性分解可热分解聚合物的区域，在可热分解聚合物中形成印刷图案，从而形成印刷版。

公开(公告)号：US07121859B2

公开(公告)日：2006-10-17

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

发明人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

IPC分类号： H01R13/15

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

摘要翻译： 一种数据传输互连组件，其能够传输超过40​​Gbps的传输速度，其中，例如，使用弯曲以在连接的板之间提供连续的平滑曲线的柔性扁平电缆将线卡可拆卸地耦合到背板，以及 通过使用对所发送的信号波透明的电缆到电缆接口部件的连接装置连接。 微型接头构件形成在抵抗电缆的接触结构上，以提供比发射信号的波长小的接口布置。 连接器装置使用凸轮机构来对准电缆，然后将具有形成在其上的微弹簧接口构件的接触结构压靠在电缆上。 替代接触结构使用各向异性导电膜。

公开(公告)号：US06788086B2

公开(公告)日：2004-09-07

申请号：US10717803

申请日：2003-11-19

申请人： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork

发明人： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork

IPC分类号： G01R3102

CPC分类号： G01Q70/10 ,  G01Q70/06 ,  G01Q70/16 ,  G01R1/06727 ,  Y10S977/873

摘要： Scanning probe systems, which include scanning probe microscopes (SPMs), atomic force microscope (AFMs), or profilometers, are disclosed that use cantilevered spring (e.g., stressy metal) probes formed on transparent substrates. When released, a free end bends away from the substrate to form the cantilevered spring probe, which has an in-plane or out-of-plane tip at its free end. The spring probe is mounted in a scanning probe system and is used to scan or otherwise probe a substrate surface. The probes are used for topography, electrical, optical and thermal measurements.

公开(公告)号：US06734425B2

公开(公告)日：2004-05-11

申请号：US10136258

申请日：2002-04-30

申请人： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork ,  Michel A. Rosa ,  Dirk De Bruyker

发明人： Thomas Hantschel ,  Eugene M. Chow ,  David K. Fork ,  Michel A. Rosa ,  Dirk De Bruyker

IPC分类号： G01B528

CPC分类号： G01Q70/10 ,  G01Q70/06 ,  G01Q70/16 ,  G01R1/06727 ,  Y10S977/873

摘要： Scanning probe systems, which include scanning probe microscopes (SPMs) are disclosed that include cantilevered spring (e.g., stressy metal) probes and actuation/position sensing electrodes formed on a substrate. The actuation electrodes are used to position the spring probe relative to the substrate using electrostatic, magnetic, acoustic, or piezoelectric arrangements. An actuation signal source is switched between full on and off states to facilitate “ON/OFF” probe actuation in which the spring probe is either fully retracted against the substrate or deployed for scan operations. The position sensing electrodes are used to sense the deflected position of the spring probe relative to the substrate using resistive, magnetic, or piezoresistive arrangements. Spring probe arrays are disclosed that include multiple spring probes arranged on a single substrate. Each spring probe of the array includes a separate actuation electrode that is controlled using “ON/OFF” or tapping probe actuation, and may include a separate position sensing electrode.

摘要翻译： 公开了包括扫描探针显微镜（SPM）的扫描探针系统，其包括形成在基底上的悬臂弹簧（例如，应力金属）探针和致动/位置感测电极。 致动电极用于使用静电，磁，声或压电布置相对于衬底定位弹簧探头。 致动信号源在完全打开和关闭状态之间切换，以便于“ON / OFF”探头致动，其中弹簧探针完全缩回到基板上或部署用于扫描操作。 位置检测电极用于使用电阻，磁阻或压阻布置来感测弹簧探针相对于基底的偏转位置。 公开了包括布置在单个基板上的多个弹簧探针的弹簧探针阵列。 阵列的每个弹簧探针包括使用“ON / OFF”或分接探头致动来控制的单独的致动电极，并且可以包括单独的位置感测电极。

公开(公告)号：US08850694B2

公开(公告)日：2014-10-07

申请号：US12754245

申请日：2010-04-05

申请人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K Biegelsen

发明人： Eugene M. Chow ,  Jeng Ping Lu ,  Meng H. Lean ,  David K Biegelsen

IPC分类号： B23P19/00 ,  H01L23/00 ,  B81C99/00

CPC分类号： B81C99/002 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

摘要翻译： 一种静电复印微组装系统，方法和装置，其包括适于接收多个微物体的分类单元。 微物体也可以在分选单元上分类和定向，然后转移到基底。 系统，方法和装置还可以包括用于检测分类单元中的至少一个微物体中的错误的装置和用于防止不适当的微物体被转移到基板的保护装置。 系统，方法和装置还可以包括有组织的微物体馈送器组件，其可以将多个微物体中的至少一个传送到分类单元或直接传送到衬底。

公开(公告)号：US20130232782A1

公开(公告)日：2013-09-12

申请号：US13866835

申请日：2013-04-19

申请人： Eugene M. Chow

发明人： Eugene M. Chow

IPC分类号： H05K3/32

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099

摘要： An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

摘要翻译： 包括应力设计的非平面微球的插入件可以提供布置在插入件上方和下方的电子结构的焊盘的互连。 位于插入件的底表面处的用于接触的微小弹簧的锚定部分与位于微弹簧的自由部分中的微小弹簧的末端之间的侧向偏移在插入件的顶表面上接触和偏转允许装置的互连 具有不同的焊盘间距。 自由部分的微针接触允许器件的临时互连，而焊接在自由部分上的焊料允许器件永久连接到插入器。

公开(公告)号：US08519534B2

公开(公告)日：2013-08-27

申请号：US12887775

申请日：2010-09-22

申请人： Eugene M. Chow ,  Eric Peeters

发明人： Eugene M. Chow ,  Eric Peeters

IPC分类号： H01L23/48

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49147 ,  H01L2224/13099 ,  H01L2924/00

摘要： At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

摘要翻译： 至少一个微小弹簧已经施加在层压结构之上，以提供：在处理和晶片加工期间的机械保护，弹簧间隔层，弹簧和基底之间的锚固件的加强，在弹簧偏转期间提供间隙止挡，以及水分和污染物保护。 可以将完全成型的层压结构施加在微小弹簧结构上，或者可以将部分形成的层压结构施加到微弹体结构上，然后固化或硬化。 微小弹簧的尖端部分可以突出穿过层压结构并暴露以进行接触或者可以埋在接触结构内。 层压结构可以保留在最终微型结构中的适当位置或全部或部分去除。 层压结构可以是光刻图案化的材料，图案化和蚀刻以除去部分或全部结构，形成例如附加的结构元件，例如用于微弹簧的间隙止动件。

公开(公告)号：US08441808B2

公开(公告)日：2013-05-14

申请号：US12887814

申请日：2010-09-22

申请人： Eugene M. Chow

发明人： Eugene M. Chow

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099

摘要： An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

摘要翻译： 包括应力设计的非平面微球的插入件可以提供布置在插入件上方和下方的电子结构的焊盘的互连。 位于插入件的底表面处的用于接触的微小弹簧的锚定部分与位于微弹簧的自由部分中的微小弹簧的末端之间的侧向偏移在插入件的顶表面上接触和偏转允许装置的互连 具有不同的焊盘间距。 自由部分的微针接触允许器件的临时互连，而焊接在自由部分上的焊料允许器件永久连接到插入器。