摘要:
A vertical semiconductor transistor component is built up on a substrate by using a statistical mask. The vertical semiconductor transistor component has vertical pillar structures statistically distributed over the substrate. The vertical pillar structures are electrically connected on a base side thereof to a first common electrical contact. The vertical pillar structures include, along the vertical direction, layer zones of differing conductivity, and have insulation layers on their circumferential walls. An electrically conductive material is deposited between the pillar structures and forms a second electrical contact of the semiconductor transistor component. The pillar structures are electrically contacted to a third common electrical contact on their capping side.
摘要:
A nonvolatile semiconductor memory cell includes a transistor component formed on a substrate and a storage node that determines the switching state of the transistor component. The storage node is arranged near a control gate electrode. The storage node has a group of vertically oriented column structures having at least two semiconductor layer zones and an insulating layer zone situated between the two semiconductor layer zones.
摘要:
A memory cell configuration has word lines and bit lines running transversely with respect thereto. Memory elements with a magnetoresistive effect are respectively connected between one of the word lines and one of the bit lines. The memory elements are disposed in at least two layers one above the other.
摘要:
A memory cell configuration and a method for its production include stacked capacitors and use a vertical storage capacitor having a ferroelectric or paraelectric storage dielectric. In order to produce the storage capacitor, a dielectric layer for the storage dielectric is produced over the whole area. The dielectric layer is subsequently structured and first electrodes and second electrodes for the storage capacitors are formed. The invention is suitable for Gbit DRAMs and for nonvolatile memories.
摘要:
In its gate region (10), a silicon MOS technology component has a surface structure (6) having edges and/or vertices at which inversion regions, suitable as quantum wires or quantum dots, are preferentially formed when a gate voltage is applied. The surface structure is preferably formed as a silicon pyramid (6) by local molecular beam epitaxy.
摘要:
An insulating layer is grown on a principal face of a substrate that comprises a source terminal region. A first opening wherein the surface of the source terminal region is partially uncovered is provided in the insulating layer. A vertical layer sequence that comprises at least a channel region and a drain region for the MOS transistor is produced in the first opening by epitaxial growth of semiconductor material within situ doping. A second opening that is at least of a depth corresponding to the sum of the thicknesses of drain region and channel region is produced in the layer structure, a gate dielectric is applied on the surface thereof and a gate-electrode is applied on said gate dielectric.
摘要:
To make a contact between a capacitor electrode (13) disposed in a trench (11) and an MOS transistor source/drain region disposed outside the trench, a shallow etching is carried out in a self-aligned manner with respect to a field-oxide region insulating the MOS transistor by producing the trench (11) in a substrate (1). After forming an Si.sub.3 N.sub.4 spacer (10) at the edge (8), laid bare during the etching, of the substrate (1) the part laid bare of the field-oxide region (2) is first removed with the aid of a mask and the trench (11) is completed in a further etching. The contact is produced after the formation of an SiO.sub.2 layer (12) at the surface of the trench (11) after removing the Si.sub.3 N.sub.4 spacer (10) and producing the capacitor electrode (13) at the edge (8), laid bare by removing the Si.sub.3 N.sub.4 spacer (10), of the substrate (1).
摘要:
A large scale integrable memory cell including a field effect transistor lying at a bit line and further including a storage capacitor which is formed by the wall of a trench and a cooperating electrode. The active region of the storage cell which lies outside the trench is fashioned in the form of a strip. The end face forms one part of the trench edge and the remaining portion of the trench edge is surrounded by a field oxide region.