公开(公告)号：US07147760B2

公开(公告)日：2006-12-12

申请号：US10974083

申请日：2004-10-27

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D17/02 ,  C25D17/12 ,  C25D7/12

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

公开(公告)号：US07118658B2

公开(公告)日：2006-10-10

申请号：US10154426

申请日：2002-05-21

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25C7/00 ,  C25D17/00

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06

摘要： A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.

公开(公告)号：US07114903B2

公开(公告)日：2006-10-03

申请号：US10621037

申请日：2003-07-15

申请人： Randy A. Harris ,  Kyle M. Hanson

发明人： Randy A. Harris ,  Kyle M. Hanson

IPC分类号： B65H5/00

CPC分类号： H01L21/67781 ,  H01L21/67766 ,  H01L21/67769 ,  Y10S414/139 ,  Y10T29/49117

摘要： An apparatus and method for handling and/or pre-processing microelectronic workpieces. In one embodiment, the apparatus includes an input/output station configured to removably receive a plurality of microelectronic workpieces at an input/output location, a transfer station, and a first transfer device that moves the microelectronic workpieces directly between the input/output location and the transfer station. A second transfer device moves the microelectronic workpieces directly from the transfer station to at least one process station. The transfer station can include a pre-process station configured to identify and/or align the microelectronic workpieces. The apparatus can further include a storage station configured to support a plurality of microelectronic workpieces and can be positioned to at least partially overlap the pre-process station.

摘要翻译： 一种用于处理和/或预处理微电子工件的装置和方法。 在一个实施例中，该装置包括被配置为在输入/输出位置可移除地接收多个微电子工件的输入/输出站，传送站和第一传送装置，其将微电子工件直接在输入/输出位置与 转运站。 第二传送装置将微电子工件直接从传送站移动到至少一个处理站。 传送站可以包括配置成识别和/或对准微电子工件的预处理站。 该设备还可以包括配置成支撑多个微电子工件的存储站，并且可以定位成至少部分地与预处理站重叠。

公开(公告)号：US06969682B2

公开(公告)日：2005-11-29

申请号：US10693668

申请日：2003-10-24

申请人： Kyle M. Hanson ,  Paul Z. Wirth ,  Steven L. Peace ,  Jon Kuntz ,  Scott A. Bruner

发明人： Kyle M. Hanson ,  Paul Z. Wirth ,  Steven L. Peace ,  Jon Kuntz ,  Scott A. Bruner

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/311

CPC分类号： H01L21/6715 ,  H01L21/32134 ,  H01L21/67017 ,  Y10S438/906 ,  Y10S438/913

摘要： A system for processing wafers includes a robot moveable within an enclosure to load and unload workpieces into and out of workpiece processors. A processor includes an upper rotor having alignment pins, and a lower rotor having one or more openings for receiving the alignment pins to form a processing chamber around the workpiece. The alignment pins center the workpiece relative to a rotor spin axis and to an etch or drain groove in the upper rotor. A first fluid outlet delivers processing fluid to a central region of the workpiece. The processing fluid is distributed across the workpiece surface via centrifugal force generated by spinning the processing chamber. Purge gas is optionally delivered into the processing chamber through an annular opening around the first fluid outlet to help remove processing fluid from the processing chamber.

摘要翻译： 用于处理晶片的系统包括可在外壳内移动以将工件加载和卸载到工件处理器中的机器人。 处理器包括具有对准销的上转子和具有一个或多个开口的下转子，用于接收对准销以在工件周围形成处理室。 对准销使工件相对于转子旋转轴线和上转子中的蚀刻或排水槽居中。 第一流体出口将处理流体输送到工件的中心区域。 处理液通过旋转处理室产生的离心力分布在工件表面上。 吹扫气体可选地通过围绕第一流体出口的环形开口输送到处理室中，以帮助从处理室去除处理流体。

公开(公告)号：US06916412B2

公开(公告)日：2005-07-12

申请号：US09875365

申请日：2001-06-05

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Steve L. Eudy ,  Curtis A. Weber ,  Randy Harris

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Steve L. Eudy ,  Curtis A. Weber ,  Randy Harris

IPC分类号： B23H7/26 ,  C25D3/00 ,  C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00

CPC分类号： H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  H01L21/6719 ,  H01L21/67751

摘要： An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.

公开(公告)号：US06869510B2

公开(公告)日：2005-03-22

申请号：US09998142

申请日：2001-10-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C23C18/16 ,  A61K35/12 ,  C23C28/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  H01L21/288

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。

公开(公告)号：US06761806B2

公开(公告)日：2004-07-13

申请号：US09891844

申请日：2001-06-26

申请人： Kyle M. Hanson

发明人： Kyle M. Hanson

IPC分类号： C25D1700

CPC分类号： H01L21/67259 ,  H01L21/681

摘要： A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector mounted along the back side of a rotor which acts as a workpiece holder. The emitted beam passes through the workpiece holder and is reflected by any workpiece present in the workpiece holder. The preferred units include both an optical emitter and pair of detectors. The detection is preferably able to discriminate on the basis of the angle of the reflected beam, so that a portion of the beam reflected by the workpiece holder is not considered or minimized.

摘要翻译： 一种半导体加工工件支撑件，其包括检测子晶体，其检测晶片或其它工件是否存在。 优选的布置使用光束发射器和沿着作为工件保持器的转子的后侧安装的光束检测器。 发射的光束通过工件保持器并被存在于工件保持器中的任何工件反射。 优选的单元包括光发射器和一对检测器。 该检测优选地能够基于反射光束的角度进行鉴别，使得不考虑或最小化由工件保持器反射的光束的一部分。

公开(公告)号：US06717171B2

公开(公告)日：2004-04-06

申请号：US09875439

申请日：2001-06-05

申请人： Randy Harris ,  Kyle M. Hanson ,  Daniel P. Bexten

发明人： Randy Harris ,  Kyle M. Hanson ,  Daniel P. Bexten

IPC分类号： B65G4907

CPC分类号： H01L21/67772 ,  Y10S414/137 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration. Accordingly, the microelectronic workpieces within the container can be less likely to be damaged by movement of the container. Instead, a workpiece transfer device can be configured to have a range of travel that allows it to access each of the microelectronic workpieces within the container without requiring that the container itself be moved. A workpiece detector coupled to the container access device can move generally parallel to the microelectronic workpieces to detect a presence, absence, and/or position of the microelectronic workpieces, without moving laterally toward and away from the microelectronic workpieces.

摘要翻译： 用于处理最初位于容器中的微电子工件的装置和方法。 容器可以从第一种构型改变，其中微电子工件在容器内通常是不可接近的，其中微电子工件能够从容器移除。 该装置可以包括可靠近壳体的孔定位的容器进入装置，其至少部分地包围用于处理微电子工件的区域。 容器进入装置可以可移动地定位在孔附近，以将容器的构型从第一构型改变到第二构型。 容器支撑件可以靠近孔定位，并且可以构造成当容器处于第二构造时相对于孔将容器移动到固定的静止位置。 因此，容器内的微电子工件不太可能被容器的移动所损坏。 相反，工件传送装置可以被配置成具有允许其访问容器内的每个微电子工件的行程范围，而不要求容器本身移动。 耦合到容器进入装置的工件检测器可以大致平行于微电子工件移动，以检测微电子工件的存在，不存在和/或位置，而不向横向和远离微电子工件横向移动。

公开(公告)号：US06547937B1

公开(公告)日：2003-04-15

申请号：US09476526

申请日：2000-01-03

申请人： Thomas H. Oberlitner ,  Kyle M. Hanson

发明人： Thomas H. Oberlitner ,  Kyle M. Hanson

IPC分类号： C25D1700

CPC分类号： H01L21/67086 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D21/10 ,  H01L21/67005 ,  H01L21/67023 ,  H01L21/67057 ,  H01L21/6723

摘要： An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with one aspect of the invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further aspect of the invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

摘要翻译： 提供了一种集成工具，其包括具有桨组件的至少一个工件处理站。 根据本发明的一个方面，工件处理站适于调节加工流体相对于工件的水平，其中待加工的工件的部分和可能的桨可选择性地浸入处理流体中。 根据本发明的另一方面，提供了用于在工件处理站中靠近工件使用的桨叶。 桨叶包括一组或多组输送口和一组或多组流体回收口。 在至少一个实施例中，桨叶用于搅拌靠近工件表面的处理流体。 在至少另一个实施例中，桨叶用于将待处理的工件的一个或多个流体递送和/或回收。 本发明的一个方面使得通过桨将供应到工件的流体限于位于工件和桨之间的空间，从而避免这些流体与位于碗组件内的处理流体混合，而不是由桨供应 。

公开(公告)号：US06428662B1

公开(公告)日：2002-08-06

申请号：US09385185

申请日：1999-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D17/06

摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the bayonet connection.

摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 杯子围绕反应堆容器内的周边支撑。 阳极组件具有承载阳极的阳极屏蔽层。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间提供卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接连接到阳极，当插管通过卡口连接将管连接到阳极时，该插件连接完成。