公开(公告)号：US4256377A

公开(公告)日：1981-03-17

申请号：US907003

申请日：1978-05-18

申请人： Hans Krueger ,  Hans Pink

发明人： Hans Krueger ,  Hans Pink

IPC分类号： G02F1/1337 ,  G02F1/13

CPC分类号： G02F1/133719 ,  Y10S359/90

摘要： A homeotropic orientation layer for a liquid crystal cell is produced by forming an organic liquid solution containing a suitable amount of Si and Me to provide a necessary ratio of such elements to correspond to a chemical composition defined by the formula:(Me.sub.2 O.sub.3).sub.1-x (SiO.sub.y).sub.xwherein Me is an element selected from the group consisting of Al and Cr, x is a numeral at least equal to 0 and smaller than 1, and y is a numeral at least equal to 1.9 and not more than 2; applying a layer of such organic solution onto at least one face of a liquid crystal cell substrate, which may have a conductive layer thereon, and transferring such layer of organic solution into a solid homeotropically orientating layer by thermal decomposition of the organic solution, as by heating the solution-coated substrate at a temperature in the range of about 100.degree. to 550.degree. C. for a period of time ranging from about 10 to 30 minutes.

摘要翻译： 通过形成含有适当量的Si和Me的有机液体溶液来制备液晶单元的垂直取向层，以提供这样的元素所需的比例，以符合由下式定义的化学组成：（Me 2 O 3）1-x （SiO y）x其中Me是选自Al和Cr的元素，x是至少等于0且小于1的数，y是至少等于1.9且不大于2的数字; 将这样的有机溶液层施加到可以在其上具有导电层的液晶单元基板的至少一个表面上，并且通过有机溶液的热分解将这种有机溶液层转移到固体垂直取向层中，如通过 在约100℃至550℃的温度范围内将溶液涂覆的基材加热约10至30分钟的时间。

公开(公告)号：US4248502A

公开(公告)日：1981-02-03

申请号：US47745

申请日：1979-06-12

申请人： Martin Bechteler ,  Hans Krueger

发明人： Martin Bechteler ,  Hans Krueger

IPC分类号： G02F1/133 ,  G02F1/1335 ,  G02F1/1337 ,  G02F1/13

CPC分类号： G02F1/1337 ,  G02F1/133502

摘要： An electro-optical display device particularly a liquid crystal display device having a pair of carrier plates spaced apart to form a cavity with each of the carrier plates on a surface facing the cavity being provided with an electrically conductive layer covered by a dielectric layer with the device having the medium, which may be the liquid crystal layer and is switchable between two optically different states, disposed in the cavity, characterized by the conductive layer having a thickness d.sub.1 and an index of refraction n.sub.1 and each of the dielectric layers having a thickness d.sub.2 and a refractive index n.sub.2 with the thickness having a range of 0.5 d.sub.1 .ltoreq.d.sub.1 .ltoreq.1.5 d.sub.1 and 0.5 d.sub.2 .ltoreq.d.sub.2 .ltoreq.1.5 d.sub.2, wherein ##EQU1## with .lambda. being the mean free wavelength of the operating light, ##EQU2## with n.sub.o being the index of refraction of the carrier plate and n.sub.3 being the index of refraction of the liquid crystal layer in the idle state.

摘要翻译： 一种电光显示装置，特别是一种液晶显示装置，其具有间隔开以形成空腔的一对载体板，每个承载板在面向空腔的表面上设置有由介电层覆盖的导电层， 具有介质的装置，其可以是液晶层并且可设置在空腔中的两种光学不同状态之间，其特征在于，导电层具有厚度d1和折射率n1，并且每个电介质层具有厚度 d2和折射率n2，其厚度为0.5d1 / d1 = 1.5d1和0.5d2 ，不是载板的折射率，n3是处于空闲状态的液晶层的折射率。

公开(公告)号：US4111534A

公开(公告)日：1978-09-05

申请号：US791514

申请日：1977-04-27

申请人： Werner Cirkler ,  Hans Krueger

发明人： Werner Cirkler ,  Hans Krueger

IPC分类号： G09F9/00 ,  G02F1/1335 ,  G02F1/13357 ,  G02F1/13

CPC分类号： G02F1/133617

摘要： An optical display device having a high contrast in the light intensity of the image being displayed relative to the background light characterized by a liquid crystal cell having a layer of liquid crystal material interposed between spaced front and rear transparent carrier plates which have transparent electrodes on their inner surfaces facing the layer and a fluorescent plate of material, which has an index of refraction greater than 1, and fluorescent centers creating fluorescent light from an ambient light, being disposed behind the liquid crystal cell in the direction of viewing with the surface of the fluorescent plate being in direct contact with an outer surface of the rear carrier plate. In this device, a selective application of voltage to the selected electrodes of the cell will cause a change in the optical properties of the liquid crystal layer to decouple light from the display with an intensity substantially greater than the intensity of the background of the display. Preferably, the liquid crystal cell is received within a recess in the plate so that the outer surface of the front plate is flush with the remaining surface of the fluorescent plate. If desired, an additional illuminating device may be encapsulated within the plate to provide an additional source of light.

公开(公告)号：US09647196B2

公开(公告)日：2017-05-09

申请号：US14007074

申请日：2012-03-28

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

IPC分类号： H01L41/053 ,  B81C1/00 ,  H03H9/10 ,  H01L41/25 ,  H01L23/00

CPC分类号： H01L41/053 ,  B81B2207/095 ,  B81C1/00301 ,  H01L24/11 ,  H01L41/25 ,  H01L2224/1134 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1461 ,  H03H9/1071 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2924/00014

摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

公开(公告)号：US09056760B2

公开(公告)日：2015-06-16

申请号：US13520923

申请日：2011-01-24

申请人： Gregor Feiertag ,  Hans Krueger ,  Wolfgang Pahl ,  Anton Leidl

发明人： Gregor Feiertag ,  Hans Krueger ,  Wolfgang Pahl ,  Anton Leidl

IPC分类号： H01L29/72 ,  B81B7/00 ,  B81C1/00 ,  G01L9/00 ,  H01L23/10 ,  H04R19/04 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00309 ,  G01L9/0073 ,  H01L23/10 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/163 ,  H01L2924/181 ,  H04R19/04 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

摘要： The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

摘要翻译： 本发明涉及包括MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片设置在彼此的顶部; MEMS芯片和ASIC芯片的内部安装通过MEMS芯片或ASIC芯片的通孔连接到电气部件的外部电气端子。

公开(公告)号：US20140226285A1

公开(公告)日：2014-08-14

申请号：US14239990

申请日：2012-08-10

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Alexander Schmajew

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Alexander Schmajew

IPC分类号： H05K5/06

CPC分类号： H05K5/066 ,  B81B7/0058 ,  B81B2207/093 ,  B81C2203/035 ,  H01L23/10 ,  H01L23/3121 ,  H01L24/16 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.

摘要翻译： 组件包括衬底，芯片和框架。 框架，基板和芯片包围一个体积。 提供了一种金属密封层，其被设计成气密地密封容积。 金属密封层具有硬化液态金属或硬化液态金属合金。

公开(公告)号：US20140111062A1

公开(公告)日：2014-04-24

申请号：US14007074

申请日：2012-03-28

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl ,  Wolfgang Pahl ,  Robert Koch

IPC分类号： H01L41/053 ,  H01L41/25

CPC分类号： H01L41/053 ,  B81B2207/095 ,  B81C1/00301 ,  H01L24/11 ,  H01L41/25 ,  H01L2224/1134 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1461 ,  H03H9/1071 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2924/00014

摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

摘要翻译： 提出了由两个压电晶片组成的密封晶片级封装，其优选在材料方面是相同的及其制造方法。 两个晶片之间的电气和机械连接通过框架结构和支柱实现，其框架结构和支柱分布在两个晶片之间的部分结构借助于连接层进行晶片结合。

公开(公告)号：US08691369B2

公开(公告)日：2014-04-08

申请号：US12258301

申请日：2008-10-24

申请人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

发明人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

IPC分类号： B32B7/06

CPC分类号： H01L23/544 ,  B41M5/24 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2223/54406 ,  H01L2223/5448 ,  H01L2924/0002 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/24901 ,  H01L2924/00

摘要： A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.

摘要翻译： 提出了具有标记的层组合，例如，用于小型化电气部件。 层组合包括施加在其上的第一层和不同的剥离层，其上由释放的图案状区域形成图案。 释放区域由无机半导体绝缘材料形成，其中在其上产生的图案是机器可读的。

公开(公告)号：US08580613B2

公开(公告)日：2013-11-12

申请号：US12999421

申请日：2009-06-16

申请人： Gregor Feiertag ,  Hans Krueger ,  Anton Leidl ,  Alois Stelzl

发明人： Gregor Feiertag ,  Hans Krueger ,  Anton Leidl ,  Alois Stelzl

IPC分类号： H01L21/00

CPC分类号： G01L19/141 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/00

摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.

摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。

公开(公告)号：US20100187949A1

公开(公告)日：2010-07-29

申请号：US12700446

申请日：2010-02-04

申请人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

发明人： Wolfgang Pahl ,  Hans Krueger ,  Werner Ruile

IPC分类号： H01L41/053 ,  H01L41/047 ,  H01L41/22

CPC分类号： H03H9/02834 ,  H03H9/02574 ,  Y10T29/42

摘要： A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

摘要翻译： 组件具有衬底和补偿层。 基板的下表面机械地牢固地连接到补偿层。 衬底的下表面和补偿层的上表面具有形貌。