PROTECTION OF POLYMER SURFACES DURING MICRO-FABRICATION
    59.
    发明申请
    PROTECTION OF POLYMER SURFACES DURING MICRO-FABRICATION 审中-公开
    微米制造过程中聚合物表面的保护

    公开(公告)号:US20080220612A1

    公开(公告)日:2008-09-11

    申请号:US11682347

    申请日:2007-03-06

    IPC分类号: H01L21/311

    摘要: A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.

    摘要翻译: 保护聚合物层免受光致抗蚀剂层污染的方法。 该方法包括:(a)在基底上形成聚合物层; (b)在聚合物层上形成非光敏保护层; (c)在所述保护层上形成光致抗蚀剂层; (d)将光致抗蚀剂层暴露于光化辐射并显影光致抗蚀剂层以形成图案化的光致抗蚀剂层,从而暴露保护层的区域; (e)蚀刻通过保护层和聚合物层,其中保护层不被图案化的光致抗蚀剂层保护; (f)在第一去除过程中去除图案化的光致抗蚀剂层; 和(g)在与第一去除过程不同的第二去除过程中去除保护层。